KR100357292B1 - 프린트배선판제조용현상액및프린트배선판의제조방법 - Google Patents
프린트배선판제조용현상액및프린트배선판의제조방법 Download PDFInfo
- Publication number
- KR100357292B1 KR100357292B1 KR1019940033674A KR19940033674A KR100357292B1 KR 100357292 B1 KR100357292 B1 KR 100357292B1 KR 1019940033674 A KR1019940033674 A KR 1019940033674A KR 19940033674 A KR19940033674 A KR 19940033674A KR 100357292 B1 KR100357292 B1 KR 100357292B1
- Authority
- KR
- South Korea
- Prior art keywords
- alkyl group
- printed wiring
- wiring board
- developer
- carbon number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 125000001453 quaternary ammonium group Chemical group 0.000 claims abstract description 42
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 34
- 239000000243 solution Substances 0.000 claims abstract description 32
- 239000000908 ammonium hydroxide Substances 0.000 claims abstract description 28
- 239000007864 aqueous solution Substances 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 23
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000003513 alkali Substances 0.000 claims abstract description 18
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims abstract description 16
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims abstract description 15
- 239000001099 ammonium carbonate Substances 0.000 claims abstract description 15
- 125000000547 substituted alkyl group Chemical group 0.000 claims abstract description 15
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 14
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 54
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 30
- 238000007747 plating Methods 0.000 claims description 30
- 229920002120 photoresistant polymer Polymers 0.000 claims description 15
- VFHDWENBWYCAIB-UHFFFAOYSA-M hydrogen carbonate;tetramethylazanium Chemical group OC([O-])=O.C[N+](C)(C)C VFHDWENBWYCAIB-UHFFFAOYSA-M 0.000 claims description 7
- DQKGOGJIOHUEGK-UHFFFAOYSA-M hydron;2-hydroxyethyl(trimethyl)azanium;carbonate Chemical compound OC([O-])=O.C[N+](C)(C)CCO DQKGOGJIOHUEGK-UHFFFAOYSA-M 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 239000013530 defoamer Substances 0.000 claims 1
- 238000005406 washing Methods 0.000 abstract description 15
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 238000005187 foaming Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 3
- 240000007594 Oryza sativa Species 0.000 abstract 1
- 235000007164 Oryza sativa Nutrition 0.000 abstract 1
- 235000009566 rice Nutrition 0.000 abstract 1
- 239000010408 film Substances 0.000 description 27
- 230000007797 corrosion Effects 0.000 description 21
- 238000005260 corrosion Methods 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 239000004020 conductor Substances 0.000 description 16
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 14
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000006260 foam Substances 0.000 description 7
- 229910000029 sodium carbonate Inorganic materials 0.000 description 7
- 238000011161 development Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- -1 acrylate compound Chemical class 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 3
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 2
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 2
- 235000011180 diphosphates Nutrition 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HSNJERRVXUNQLS-UHFFFAOYSA-N 1-(4-tert-butylphenyl)propan-2-one Chemical compound CC(=O)CC1=CC=C(C(C)(C)C)C=C1 HSNJERRVXUNQLS-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 230000001919 adrenal effect Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- ULOATRXJQBWREA-UHFFFAOYSA-M diethyl(dimethyl)azanium;hydrogen carbonate Chemical compound OC([O-])=O.CC[N+](C)(C)CC ULOATRXJQBWREA-UHFFFAOYSA-M 0.000 description 1
- JQDCIBMGKCMHQV-UHFFFAOYSA-M diethyl(dimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)CC JQDCIBMGKCMHQV-UHFFFAOYSA-M 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- KOLFZBNEVBCHPP-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydrogen carbonate Chemical compound [H+].[O-]C([O-])=O.CC[N+](C)(C)C KOLFZBNEVBCHPP-UHFFFAOYSA-M 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003733 fiber-reinforced composite Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- XUBMPLUQNSSFHO-UHFFFAOYSA-M hydrogen carbonate;tetraethylazanium Chemical compound OC([O-])=O.CC[N+](CC)(CC)CC XUBMPLUQNSSFHO-UHFFFAOYSA-M 0.000 description 1
- FZAHPINGRQIQCI-UHFFFAOYSA-M hydrogen carbonate;triethyl(2-hydroxyethyl)azanium Chemical compound OC([O-])=O.CC[N+](CC)(CC)CCO FZAHPINGRQIQCI-UHFFFAOYSA-M 0.000 description 1
- HBRMHZKBZZGJFF-UHFFFAOYSA-M hydron;tetrapropylazanium;carbonate Chemical compound OC([O-])=O.CCC[N+](CCC)(CCC)CCC HBRMHZKBZZGJFF-UHFFFAOYSA-M 0.000 description 1
- WCDPGJKFAMMXGK-UHFFFAOYSA-M hydron;triethyl(methyl)azanium;carbonate Chemical compound OC([O-])=O.CC[N+](C)(CC)CC WCDPGJKFAMMXGK-UHFFFAOYSA-M 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- GRNRCQKEBXQLAA-UHFFFAOYSA-M triethyl(2-hydroxyethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CCO GRNRCQKEBXQLAA-UHFFFAOYSA-M 0.000 description 1
- BJAARRARQJZURR-UHFFFAOYSA-N trimethylazanium;hydroxide Chemical compound O.CN(C)C BJAARRARQJZURR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950042931A KR0146841B1 (ko) | 1994-12-12 | 1995-11-22 | 석유연소기기 |
| RU95122477A RU2109210C1 (ru) | 1994-12-12 | 1995-12-09 | Устройство для сгорания керосина |
| JP7323395A JP2750109B2 (ja) | 1994-12-12 | 1995-12-12 | 石油燃焼機器 |
| CN95121664A CN1145997A (zh) | 1994-12-12 | 1995-12-12 | 石油燃烧器 |
| FR9514717A FR2728058B1 (fr) | 1994-12-12 | 1995-12-12 | Appareil a combustion de kerosene comportant des moyens de filtration du combustible |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31676593A JP3328858B2 (ja) | 1993-12-16 | 1993-12-16 | プリント配線板の製造法および現像液 |
| JP93-316765 | 1993-12-16 | ||
| JP94-015289 | 1994-02-09 | ||
| JP1528994A JP3610984B2 (ja) | 1994-02-09 | 1994-02-09 | プリント配線板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950023246A KR950023246A (ko) | 1995-07-28 |
| KR100357292B1 true KR100357292B1 (ko) | 2003-01-10 |
Family
ID=26351408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940033674A Expired - Lifetime KR100357292B1 (ko) | 1993-12-16 | 1994-12-12 | 프린트배선판제조용현상액및프린트배선판의제조방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5538832A (enExample) |
| KR (1) | KR100357292B1 (enExample) |
| TW (1) | TW275182B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6548858B2 (en) * | 2001-03-06 | 2003-04-15 | Mitac International Corp. | Multi-layer circuit board |
| CN1846172A (zh) * | 2003-09-01 | 2006-10-11 | 株工会社新克 | 正型感光性组合物用显影液 |
| DE102004012191B4 (de) * | 2004-03-12 | 2008-04-10 | Kodak Graphic Communications Gmbh | Stabiler stark alkalischer Entwickler |
| TWI412856B (zh) | 2010-07-29 | 2013-10-21 | Chunghwa Picture Tubes Ltd | 液晶顯示面板之薄膜電晶體基板與其製作方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5175078A (en) * | 1988-10-20 | 1992-12-29 | Mitsubishi Gas Chemical Company, Inc. | Positive type photoresist developer |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59182444A (ja) * | 1983-04-01 | 1984-10-17 | Sumitomo Chem Co Ltd | ポジ型フオトレジストの改良現像液 |
| US4606999A (en) * | 1983-12-21 | 1986-08-19 | Thiokol Corporation | Development of positive photoresists using cyclic quaternary ammonium hydroxides |
| DE3580827D1 (de) * | 1984-10-09 | 1991-01-17 | Hoechst Japan K K | Verfahren zum entwickeln und zum entschichten von photoresistschichten mit quaternaeren ammomiumverbindungen. |
| US4784937A (en) * | 1985-08-06 | 1988-11-15 | Tokyo Ohka Kogyo Co., Ltd. | Developing solution for positive-working photoresist comprising a metal ion free organic base and an anionic surfactant |
| DE3705896A1 (de) * | 1986-02-24 | 1987-08-27 | Tokyo Ohka Kogyo Co Ltd | Verfahren zur herstellung eines fotoresistmusters auf einer substratflaeche und ein dafuer geeignetes schaumentfernungsmittel |
| US5053318A (en) * | 1989-05-18 | 1991-10-01 | Shipley Company Inc. | Plasma processing with metal mask integration |
| DE69300616T2 (de) * | 1992-04-30 | 1996-05-30 | Ibm | Silikon enthaltendes positives Photoresistmaterial und dessen Verwendung in Dünnfilm-Verpackung-Technologie. |
-
1994
- 1994-12-01 US US08/347,889 patent/US5538832A/en not_active Expired - Fee Related
- 1994-12-12 KR KR1019940033674A patent/KR100357292B1/ko not_active Expired - Lifetime
- 1994-12-13 TW TW083111590A patent/TW275182B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5175078A (en) * | 1988-10-20 | 1992-12-29 | Mitsubishi Gas Chemical Company, Inc. | Positive type photoresist developer |
Also Published As
| Publication number | Publication date |
|---|---|
| US5538832A (en) | 1996-07-23 |
| TW275182B (enExample) | 1996-05-01 |
| KR950023246A (ko) | 1995-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1079614A (en) | Etching composition and method for using same | |
| WO2009096438A1 (ja) | 導電パターンの作製方法 | |
| KR20190051965A (ko) | 수지 마스크 박리용 세정제 조성물 | |
| EP0539714B1 (en) | Amphoteric compositions | |
| JPH0465184A (ja) | 電着前処理方法 | |
| KR20140001903U (ko) | 레지스트층의 박막화 장치 | |
| CN109939977A (zh) | 树脂掩模剥离清洗方法 | |
| US5538832A (en) | Developing solution for producing printed circuit boards and a process for producing printed circuit boards wherein the developing solution comprises a quaternary ammonium hydroxide and a quaternary ammonium carbonate | |
| JP3610984B2 (ja) | プリント配線板の製造法 | |
| CN113504715B (zh) | 一种印刷线路板显影添加剂 | |
| JP3328858B2 (ja) | プリント配線板の製造法および現像液 | |
| KR200487657Y1 (ko) | 레지스트층의 박막화 장치 | |
| JPS616827A (ja) | フオトレジストのストリツパー | |
| WO2022050386A1 (ja) | 基板の洗浄方法 | |
| JP5588380B2 (ja) | ドライフィルムレジストの薄膜化処理方法 | |
| CN120386153B (zh) | 一种无碱体系显影液及其显影方法 | |
| KR20180003402U (ko) | 레지스트층의 박막화 장치 | |
| CN116648499A (zh) | 树脂掩膜剥离用清洗剂组合物 | |
| Chu et al. | Development of new photoresist stripping agent | |
| KR200491908Y1 (ko) | 레지스트층의 박막화 장치 | |
| KR20160002326U (ko) | 레지스트층의 박막화 장치 | |
| JPH03192792A (ja) | プリント配線板の製造方法 | |
| JPH03120784A (ja) | プリント配線板の製造方法 | |
| JP3186478U (ja) | ドライフィルムレジストの薄膜化処理装置 | |
| JP2025114005A (ja) | レジスト剥離及びシードエッチング用の処理液及び処理方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19941212 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19990604 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19941212 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20010430 Patent event code: PE09021S01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20011227 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20020830 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20021007 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20021008 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20050926 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20060925 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20070920 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20080925 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20090925 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20101007 Start annual number: 9 End annual number: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20110920 Start annual number: 10 End annual number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20120924 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20120924 Start annual number: 11 End annual number: 11 |
|
| FPAY | Annual fee payment |
Payment date: 20130924 Year of fee payment: 12 |
|
| PR1001 | Payment of annual fee |
Payment date: 20130924 Start annual number: 12 End annual number: 12 |
|
| FPAY | Annual fee payment |
Payment date: 20141001 Year of fee payment: 13 |
|
| PR1001 | Payment of annual fee |
Payment date: 20141001 Start annual number: 13 End annual number: 13 |
|
| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |
Termination date: 20150612 Termination category: Expiration of duration |