TW275182B - - Google Patents

Info

Publication number
TW275182B
TW275182B TW083111590A TW83111590A TW275182B TW 275182 B TW275182 B TW 275182B TW 083111590 A TW083111590 A TW 083111590A TW 83111590 A TW83111590 A TW 83111590A TW 275182 B TW275182 B TW 275182B
Authority
TW
Taiwan
Application number
TW083111590A
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31676593A external-priority patent/JP3328858B2/ja
Priority claimed from JP1528994A external-priority patent/JP3610984B2/ja
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Application granted granted Critical
Publication of TW275182B publication Critical patent/TW275182B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW083111590A 1993-12-16 1994-12-13 TW275182B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31676593A JP3328858B2 (ja) 1993-12-16 1993-12-16 プリント配線板の製造法および現像液
JP1528994A JP3610984B2 (ja) 1994-02-09 1994-02-09 プリント配線板の製造法

Publications (1)

Publication Number Publication Date
TW275182B true TW275182B (zh) 1996-05-01

Family

ID=26351408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111590A TW275182B (zh) 1993-12-16 1994-12-13

Country Status (3)

Country Link
US (1) US5538832A (zh)
KR (1) KR100357292B1 (zh)
TW (1) TW275182B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8304266B2 (en) 2010-07-29 2012-11-06 Chunghwa Picture Tubes, Ltd. Manufacturing method of thin film transistor substrate of liquid crystal display panel

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6548858B2 (en) * 2001-03-06 2003-04-15 Mitac International Corp. Multi-layer circuit board
WO2005022267A1 (ja) * 2003-09-01 2005-03-10 Think Laboratory Co., Ltd. ポジ型感光性組成物用現像液
DE102004012191B4 (de) * 2004-03-12 2008-04-10 Kodak Graphic Communications Gmbh Stabiler stark alkalischer Entwickler

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182444A (ja) * 1983-04-01 1984-10-17 Sumitomo Chem Co Ltd ポジ型フオトレジストの改良現像液
US4606999A (en) * 1983-12-21 1986-08-19 Thiokol Corporation Development of positive photoresists using cyclic quaternary ammonium hydroxides
EP0177905B1 (de) * 1984-10-09 1990-12-05 Hoechst Japan Kabushiki Kaisha Verfahren zum Entwickeln und zum Entschichten von Photoresistschichten mit quaternären Ammomiumverbindungen
US4784937A (en) * 1985-08-06 1988-11-15 Tokyo Ohka Kogyo Co., Ltd. Developing solution for positive-working photoresist comprising a metal ion free organic base and an anionic surfactant
DE3705896A1 (de) * 1986-02-24 1987-08-27 Tokyo Ohka Kogyo Co Ltd Verfahren zur herstellung eines fotoresistmusters auf einer substratflaeche und ein dafuer geeignetes schaumentfernungsmittel
US5175078A (en) * 1988-10-20 1992-12-29 Mitsubishi Gas Chemical Company, Inc. Positive type photoresist developer
US5053318A (en) * 1989-05-18 1991-10-01 Shipley Company Inc. Plasma processing with metal mask integration
EP0568476B1 (en) * 1992-04-30 1995-10-11 International Business Machines Corporation Silicon-containing positive resist and method of using the same in thin film packaging technology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8304266B2 (en) 2010-07-29 2012-11-06 Chunghwa Picture Tubes, Ltd. Manufacturing method of thin film transistor substrate of liquid crystal display panel

Also Published As

Publication number Publication date
KR100357292B1 (ko) 2003-01-10
KR950023246A (ko) 1995-07-28
US5538832A (en) 1996-07-23

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