KR100344516B1 - 차폐된커넥터및도금된구멍들을갖는보드의조립체 - Google Patents

차폐된커넥터및도금된구멍들을갖는보드의조립체 Download PDF

Info

Publication number
KR100344516B1
KR100344516B1 KR1019970700263A KR19970700263A KR100344516B1 KR 100344516 B1 KR100344516 B1 KR 100344516B1 KR 1019970700263 A KR1019970700263 A KR 1019970700263A KR 19970700263 A KR19970700263 A KR 19970700263A KR 100344516 B1 KR100344516 B1 KR 100344516B1
Authority
KR
South Korea
Prior art keywords
boards
assembly
plated holes
shielded connectors
shielded
Prior art date
Application number
KR1019970700263A
Other languages
English (en)
Other versions
KR970705200A (ko
Inventor
버나듀스 파그만
Original Assignee
커넥터 시스템즈 테크놀로지 엔.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 커넥터 시스템즈 테크놀로지 엔.브이. filed Critical 커넥터 시스템즈 테크놀로지 엔.브이.
Publication of KR970705200A publication Critical patent/KR970705200A/ko
Application granted granted Critical
Publication of KR100344516B1 publication Critical patent/KR100344516B1/ko

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • H05K1/112Pads for surface mounting, e.g. lay-out directly combined with via connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • H01R13/6585Shielding material individually surrounding or interposed between mutually spaced contacts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09472Recessed pad for surface mounting; Recessed electrode of component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09509Blind vias, i.e. vias having one side closed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09509Blind vias, i.e. vias having one side closed
    • H05K2201/09518Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809Coaxial layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10356Cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1059Connections made by press-fit insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
KR1019970700263A 1994-07-15 1997-01-15 차폐된커넥터및도금된구멍들을갖는보드의조립체 KR100344516B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94202072A EP0692841B1 (en) 1994-07-15 1994-07-15 Assembly of shielded connectors and a board having plated holes
EP94202072.8 1994-07-15

Publications (2)

Publication Number Publication Date
KR970705200A KR970705200A (ko) 1997-09-06
KR100344516B1 true KR100344516B1 (ko) 2002-11-30

Family

ID=8217044

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970700263A KR100344516B1 (ko) 1994-07-15 1997-01-15 차폐된커넥터및도금된구멍들을갖는보드의조립체

Country Status (8)

Country Link
US (2) US5961349A (ko)
EP (1) EP0692841B1 (ko)
JP (1) JP3372042B2 (ko)
KR (1) KR100344516B1 (ko)
CN (1) CN1055572C (ko)
DE (1) DE69413679T2 (ko)
TW (1) TW379870U (ko)
WO (1) WO1996002958A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100921223B1 (ko) 2007-12-07 2009-10-12 주식회사 아이티엔티 전선 연결 장치

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3900836A1 (de) * 1989-01-13 1990-07-19 Bosch Gmbh Robert Verfahren zur messung der steuerquerschnittsflaeche einer duese
US6527561B1 (en) * 1998-10-27 2003-03-04 Huber + Suhner Ag Method for producing an electric connector and a connector produced according to this method
FR2786935B1 (fr) * 1998-12-02 2001-02-16 Framatome Connectors France Connecteur interrupteur miniature destine a etre monte en surface sur une carte de circuit imprime
US6181219B1 (en) * 1998-12-02 2001-01-30 Teradyne, Inc. Printed circuit board and method for fabricating such board
US6659784B1 (en) 1998-12-02 2003-12-09 Framatome Connectors Inc. Connector with switching device
US6113397A (en) * 1999-02-10 2000-09-05 General Instrument Corporation Coaxial connectors mounted back-to-back on backplane
US6517359B1 (en) 1999-05-21 2003-02-11 Agilent Technologies, Inc. System and method for mating electrical connections
US6250968B1 (en) * 1999-07-14 2001-06-26 Berg Technology, Inc. Electrical connector system with cross-talk compensation
US6663442B1 (en) 2000-01-27 2003-12-16 Tyco Electronics Corporation High speed interconnect using printed circuit board with plated bores
JP4434422B2 (ja) * 2000-04-04 2010-03-17 Necトーキン株式会社 高周波電流抑制型コネクタ
US6479765B2 (en) * 2000-06-26 2002-11-12 Robinson Nugent, Inc. Vialess printed circuit board
US6565391B2 (en) * 2000-09-18 2003-05-20 Elliot Bernstein High density RJ connector assembly
US6511344B2 (en) 2001-07-02 2003-01-28 Fci Americas Technology, Inc. Double-deck electrical connector with cross-talk compensation
US6417747B1 (en) * 2001-08-23 2002-07-09 Raytheon Company Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards
US7031171B2 (en) * 2001-12-26 2006-04-18 Miranda Technologies Inc. Rear connector panels for housings
ATE322802T1 (de) * 2002-09-10 2006-04-15 Saint Gobain Verbindungseinrichtung für ein flächiges element mit mehreren schichten ausgestattet mit elektrischen funktionselementen und flächiges element
US20040248438A1 (en) * 2003-06-05 2004-12-09 Wong Marvin Glenn Reinforced substrates with face-mount connectors
US6817870B1 (en) * 2003-06-12 2004-11-16 Nortel Networks Limited Technique for interconnecting multilayer circuit boards
WO2005002298A2 (en) * 2003-06-18 2005-01-06 Broadband Innovations, Inc. Low emi with high mechanical strength method of connecting signal connections
US6976849B2 (en) * 2004-04-12 2005-12-20 Cardiac Pacemakers, Inc. Pinless solder joint for coupling circuit boards
US7052288B1 (en) * 2004-11-12 2006-05-30 Fci Americas Technology, Inc. Two piece mid-plane
DE102005036296B4 (de) * 2005-08-02 2007-09-20 Siemens Ag Elektrisches Kontaktierungselement
JP2008210974A (ja) * 2007-02-26 2008-09-11 Hitachi Ltd プレスフィットピン及び基板構造
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
EP2290753B1 (de) * 2009-08-31 2012-12-05 ERNI Electronics GmbH Steckverbinder und Multilayerplatine
DE102009057260A1 (de) * 2009-12-08 2011-08-04 ERNI Electronics GmbH, 73099 Relief-Steckverbinder und Multilayerplatine
US7963776B1 (en) * 2010-03-23 2011-06-21 Tyco Electronics Corporation Electrical connector assembly having direct connection terminals
CN104253332A (zh) * 2013-06-28 2014-12-31 中航光电科技股份有限公司 印制板部件及其制造方法
US20150173181A1 (en) * 2013-12-16 2015-06-18 Cisco Technology, Inc. Enlarged Press-Fit Hole
US9620877B2 (en) 2014-06-17 2017-04-11 Semiconductor Components Industries, Llc Flexible press fit pins for semiconductor packages and related methods
WO2016149329A1 (en) * 2015-03-16 2016-09-22 Commscope Technologies Llc Right angle coaxial cable and connector assembly and method of forming same
JP6658263B2 (ja) * 2016-04-25 2020-03-04 富士通株式会社 基板及びケーブル接続基板
JP6594361B2 (ja) * 2017-02-16 2019-10-23 株式会社ソニー・インタラクティブエンタテインメント 通信機器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3578895A (en) 1969-06-09 1971-05-18 Vitramon Inc Lead terminal
US3681744A (en) * 1970-06-16 1972-08-01 Berg Electronics Inc Circuit board socket
US4506939A (en) * 1983-01-31 1985-03-26 General Electric Company Arrangement for connecting printed circuit boards
US4588241A (en) * 1983-09-23 1986-05-13 Probe-Rite, Inc. Surface mating coaxial connector
JPS60250699A (ja) 1984-05-25 1985-12-11 富士通株式会社 高周波モジュ−ルの接続構造
DE3426278A1 (de) * 1984-07-17 1986-01-30 Schroff Gmbh, 7541 Straubenhardt Leiterplatte
DE3435749A1 (de) * 1984-09-28 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Rueckwandverdrahtung fuer einschiebbare elektrische baugruppen
DE3435773A1 (de) * 1984-09-28 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Rueckwandverdrahtung fuer einschiebbare elektrische baugruppen
JPH01164089A (ja) * 1987-12-21 1989-06-28 Ibiden Co Ltd ブラインド・スルーホールを用いた電子部品実装構造
US5122475A (en) * 1988-09-30 1992-06-16 Harris Corporation Method of making a high speed, high density semiconductor memory package with chip level repairability
US4952896A (en) * 1988-10-31 1990-08-28 Amp Incorporated Filter assembly insertable into a substrate
US5046966A (en) * 1990-10-05 1991-09-10 International Business Machines Corporation Coaxial cable connector assembly
US5199879A (en) * 1992-02-24 1993-04-06 International Business Machines Corporation Electrical assembly with flexible circuit
US5387764A (en) 1993-05-04 1995-02-07 The Whitaker Corporation Electrical connector for interconnecting coaxial conductor pairs with an array of terminals
JPH1164089A (ja) * 1997-08-18 1999-03-05 Toshiba Corp 波動診断装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100921223B1 (ko) 2007-12-07 2009-10-12 주식회사 아이티엔티 전선 연결 장치

Also Published As

Publication number Publication date
DE69413679T2 (de) 1999-04-29
KR970705200A (ko) 1997-09-06
DE69413679D1 (de) 1998-11-05
EP0692841B1 (en) 1998-09-30
CN1055572C (zh) 2000-08-16
WO1996002958A1 (en) 1996-02-01
US6196876B1 (en) 2001-03-06
JP3372042B2 (ja) 2003-01-27
EP0692841A1 (en) 1996-01-17
JPH10506223A (ja) 1998-06-16
US5961349A (en) 1999-10-05
CN1152972A (zh) 1997-06-25
TW379870U (en) 2000-01-11

Similar Documents

Publication Publication Date Title
KR100344516B1 (ko) 차폐된커넥터및도금된구멍들을갖는보드의조립체
FI970877A (fi) Parannettu salpa ja asennusosa pinta-asennettavaa sähköliitintä varten
DE69526783T2 (de) Abgeschirmtes leiterplatten-verbindermodul
DE69634005D1 (de) Steckverbinder mit integriertem leiterplattenzusammenbau
DE69303201D1 (de) Abgeschirmter Rückwandverbinder
DE69312128T2 (de) Abgeschirmter Rückwand-Steckverbinder
DE69423854T2 (de) Leiterplattenverbinder
DE69636930D1 (de) Schaltungsplatte und Schaltungsplattenanordnung
KR100315064B1 (ko) 고밀도전자조립체용커넥터
FI951402A0 (fi) Liittimien loppupäiden päättäminen piirilevyyn
DE69423828D1 (de) Leiterplattenrandverbinder
DE69400395T2 (de) Leiterplatten-Randverbinder
EP0551082A3 (en) Printed circuit board and outrigger edge connector assembly and method of assembling the same
SG54976A1 (en) Connection structure between connector and circuit board and connector for use with this connection structure
DE69522288T2 (de) Impedanzwandler mit elektromagnetischem Abschirmungseffekt
DE69523452D1 (de) Zweifacher leiterplattensteckverbinder
KR960003541U (ko) 전자제품의 피씨비조립장치
DE59406298D1 (de) Einpress-Befestigung für Bauteile in Leiterplattenbohrungen
KR960032105U (ko) 전자렌지의 pcb기판 접지구조
KR950023656U (ko) 전자렌지의 커넥터구조
KR950004863U (ko) 기판과 전선연결용 콘넥터
KR960025594U (ko) 회로기판상에 발생되는 정전기의 접지구조
KR960019209U (ko) 전기, 전자제품의 접지구조
KR970050509U (ko) 전자제품의 피씨비기판 어셈블리 휨방지 납땜장치
KR970007884U (ko) 전자부품이 실장된 보드로 만든 장신구

Legal Events

Date Code Title Description
A201 Request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20070702

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee