KR100300045B1 - Semiconductor high speed package inspecting socket - Google Patents

Abstract

PURPOSE: A socket for testing a semiconductor high-speed package is provided to prevent a damage of a pad of a DUT board caused by a contact between the pad of the DUT board and a contact pin. CONSTITUTION: A rectangular socket housing(11) is used for loading a package. A pin assembly(12) is installed at one side of the socket housing(11) in order to transfer an electric signal of the package. A couple of buffer members(13,13') is used for buffering a connection terminal. A guide wall(11a) is formed on a circumference of the rectangular socket housing(11). A pin insertion hole(15) and a block insertion hole(16) are formed in one side of the rectangular socket housing(11). The pin assembly(12) is inserted into the pin insertion hole(15). A fixing block(14) is inserted into the block insertion hole(16) in order to fix the pin assembly. The pin assembly(12) is formed with a polyimide tape(21) and a contact pin(22). A support rubber(23) is formed on an upper surface of the rectangular socket housing(11). A groove(24) is formed at a front side and a rear side of the support rubber(23).

Description

Socket for semiconductor high speed package inspection {SEMICONDUCTOR HIGH SPEED PACKAGE INSPECTING SOCKET}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for semiconductor high speed package inspection, and more particularly, to a socket for semiconductor high speed package inspection suitable for preventing damage to a pad of a DUT board.

A typical package has a speed of 50 MHz or less, but packages such as Rambus DRAMs have a high speed of 500 MHz or more, and the frequency is considerably high. A zone stack socket (JTI SOCKET) for inspecting a package having such a high frequency is illustrated in FIG. It is shown in the bar, briefly described as follows.

1 is a plan view showing the configuration of a conventional zone stack socket, Figure 2 is a schematic cross-sectional view showing a state of inspecting a package with a conventional zone stack socket, as shown, the socket housing (HOUSING) 1 of the rectangular frame body A plurality of long holes 2 are formed at the upper edge, and two rubber bands 3 and 3 ', each having a different height, are installed to penetrate the long holes 2, and the two rubber bands 3 and 3 ')' Contact pins (CONTACT PINs) 4 are provided to fit the upper and lower ends thereof.

An operation of inspecting a package using a zone stack socket configured as described above will be described with reference to FIG. 2.

The zone stack socket 5 configured as described above is installed on the upper surface of the deity board 6 of the handler HANDLER, and the package 8, which is vacuum-adsorbed using the nest 7, is installed in the socket 5. The package 8 is pressed downward using the nest 7 while seated on the upper surface.

When the package 8 is pressed as described above, the leads 8a of the package 8 are in contact with the upper surfaces of the contact pins 4, respectively, and press the contact pins 4 downward, and the lower ends of the contact pins 4 are in the direction of the arrow. And contact the upper surfaces of the pads 6a of the deity board 6.

In this state, the electrical characteristics of the package are inspected, and after the inspection is completed, the inspection is completed by moving the package 8 to the nest 7.

However, in the conventional zone stack socket 5 constructed as described above, the lower end of the contact pin 4 at the time of mounting of the package 8 simultaneously rotates the upper surface of the pad 6a of the deity board 6 in the direction of the arrow. Since the pad 6a is easily damaged due to the sliding contact, the entirety of the deity board 6 needs to be replaced. In the case where the contact pins 4 are worn out over a long period of time, a small contact pin ( 4) Since the workers have to pull out and replace the socket 2 of the socket 5 one by one, it takes not only a lot of replacement time but also hassle.

SUMMARY OF THE INVENTION An object of the present invention is to provide a socket for inspecting a semiconductor high speed package which does not have various problems as described above.

It is another object of the present invention to provide a socket for inspecting semiconductor high speed packages suitable for preventing the pad of the deity board from being easily damaged by the contact of the contact pins.

Another object of the present invention is to provide a socket for inspecting semiconductor high speed packages suitable for facilitating replacement of worn contact pins.

1 is a plan view showing the configuration of a conventional zone stack socket.

Figure 2 is a schematic cross-sectional view showing a state of inspecting a package with a conventional zone stack socket.

Figure 3 is a perspective view showing the configuration of the semiconductor high speed package inspection socket of the present invention.

Figure 4 is a plan view showing the configuration of the socket for semiconductor high speed package inspection of the present invention.

5 is a cross-sectional view taken along the line AA ′ of FIG. 5;

Figure 6 is a perspective view showing the configuration of the present invention pin assembly.

Figure 7 is a cross-sectional view showing a state in which the package is inspected by the semiconductor high speed package inspection socket of the present invention.

Explanation of symbols on the main parts of the drawings

11 socket housing 11a guide wall

12: pin assembly 13,13 ': buffer member

14: fixed block 21: polyamide tape

22: contact pin 23: support rubber

24,24 ': Evacuation Home

In order to achieve the object of the present invention as described above, the rectangular socket housing for seating the package, and inserted into the pin insertion hole formed in the socket housing in a vertical direction, the upper end protrudes to the upper end to contact the lid of the package during inspection and the lower end And a plurality of contact pins protruding downward to contact the pad of the deity board, and a fixing block inserted into and fixed to the block insertion hole formed in communication with the pin insertion hole for tightly fixing the contact pins. A socket for inspecting a semiconductor high speed package is provided.

Hereinafter, the semiconductor high speed package inspection socket of the present invention configured as described above will be described in more detail with reference to embodiments of the accompanying drawings.

3 is a perspective view showing the configuration of a socket for inspecting a semiconductor high speed package according to the present invention;

4 is a plan view showing the configuration of the semiconductor high speed package inspection socket of the present invention;

FIG. 5 is a cross-sectional view taken along line AA ′ of FIG. 5, and FIG. 6 is a perspective view illustrating a configuration of the pin assembly of the present invention.

As shown, the semiconductor high speed package inspection socket of the present invention is a rectangular socket housing 11 for seating the package, and a pin for installing an electrical signal of the package is installed on one side of the socket housing 11 Attached to the assembly 12, a portion corresponding to the connection terminal of the pin assembly 12, the shock absorbing member (13) (13 ') for cushioning the connection terminal during inspection, and detachable to the socket housing (11) It is installed so that the pin assembly 12 is composed of a fixing block 14 for fixing to the socket housing (11).

The socket housing 11 is formed with a guide wall 11a having a predetermined height on the periphery of the rectangular body, so that it can be guided when the package is seated, and on one side, a pin assembly 12 is inserted in a vertical direction. In order to fix the insertion hole 15 and the pin assembly 12, the block insertion hole 16 into which the fixing block 14 is inserted is formed in communication.

As shown in FIG. 6, the pin assembly 12 has polyamide tape 21 having a predetermined thickness and width, and is installed at equal intervals so as to protrude to the upper and lower ends of the polyamide tape 21. And a contact pin 22 having a? &Quot; shape.

The buffer members 13 and 13 ′ are elastic rubbers having a predetermined length fixed to the socket housing 11 so as to correspond to the contact pins 22.

The fixing block 14 is detachably installed in the block insertion hole 16 of the socket housing 11, and an insertion groove 14a into which the polyamide tape 21 is inserted is formed at one side thereof.

A certain portion of the upper surface of the socket housing 11 is provided with a support rubber 23 installed at a predetermined length to support the package, and the front and rear sides of the support rubber 23 have an NC lead of the package during inspection. Evacuation grooves (24, 24 ') that can evacuate are formed to a certain depth.

An operation of inspecting a package using the semiconductor high speed package inspection socket of the present invention configured as described above will be described with reference to FIG. 7.

The socket S of the present invention is installed on the upper surface of the de-utie board 25, and the package 26 to be inspected is gripped by vacuum using the nest 27, and then moved to the upper side of the socket S.

Then, the lid 26a of the package 26 is brought into contact with the upper end of the contact pin 22 while lowering the package 26 held by the nest 27 to the upper surface of the socket S. When the pin 22 is pressed by the lead 26a of the package 26, the pin 22 is buffered by the elastic rubber buffer members 13 and 13 ', and the body of the package 26 is supported by the support rubber 23. Supported by the package, and the annular leads 26b of the package 26 evacuate to the evacuation groove 24.

As described above, the lead 26a of the package 26 and the upper end of the contact pin 22 contact each other, and the lower end of the contact pin 22 and the pad 25a of the deity board 25 come into contact with each other. The electrical signal of the package 26 is tested by applying a specific signal.

After the electrical characteristic test is completed, the package 26 is transferred to the nest 27 to complete the inspection of the package 26.

In addition, when the inspection of the package 26 is repeated for a long time, the contact pins 22 may be worn. At this time, the fixing block 14 is dismantled from the socket housing 11, and the pin assembly 12 is removed. Next, the new pin assembly 12 is installed in the socket housing 11 to be inserted into the insertion groove 14a of the fixing block 14 to resume the inspection operation.

Replacement of the pin assembly 12 as described above is simply performed by disassembling and reassembling the fixed block 14.

As described in detail above, the semiconductor high speed package inspection socket of the present invention is fixed to the pin assembly by using a fixed block in the socket housing, so that the pad of the DeUty board by contact with the contact pin as in the conventional inspection Not only can it prevent wear, but it is also possible to replace the pin by simply removing the fixing block and replacing the pin assembly.

Claims (3)

The rectangular socket housing for seating the package and the pin insertion hole formed in the socket housing are inserted in a vertical direction so that the upper part protrudes upwards to contact the lid of the package and the lower part lowers so as to contact the pad of the deity board. A socket for semiconductor high speed package inspection, comprising a plurality of protruding contact pins and a fixing block inserted into and fixed to a block insertion hole formed in communication with the pin insertion hole for tightly fixing the contact pins. The socket for semiconductor high speed package inspection according to claim 1, wherein the contact pins are arranged at equal intervals by polyamide tape. 2. The semiconductor high speed according to claim 1, wherein upper and lower ends of the contact pins are provided with buffer members so as to cushion the upper and lower ends of the contact pins when they are in contact with the leads of the package and the pads of the DIUT board. Socket for package inspection.