KR100299123B1 - Packaging apparatus and arraying method of optical axis for semiconductor laser diode - Google Patents

Abstract

PURPOSE: A packaging device of a semiconductor laser diode for optical communication and a method for aligning optical axis are provided to enhance optical coupling efficiency by aligning easily a laser diode and an optical axis. CONSTITUTION: A package housing(201) has an internal space formed on a table(215). A package housing loading portion(210) is adhered on a heating portion(213) in order to fix the package housing(201). A laser emission portion(208) is coupled with one side of the package housing(201). An adhesive material(211) is formed between a thermoelectric cooler(203) and a bottom face of the package housing(201). The thermoelectric cooler(203) is adhered to a bottom face of an inside of the package housing(201). A heat sink(204) is adhered on the thermoelectric cooler(203). A sub carrier(202b) is adhered on the heat sink(204). The laser diode(202) is adhered on the sub mount(202a). A lens(205) is located between the laser diode(202) and the laser emission portion(208). A sun module(207) is fixed to a location control portion(209). A probe(212) is connected with an anode and a cathode of the laser diode(202). An external alignment observation portion(214) has a lens portion(214a).

Description

Packaging apparatus and arraying method of optical axis for semiconductor laser diode

The present invention relates to a packaging device for a semiconductor laser diode for optical communication and an alignment method thereof, and more particularly, for optical communication that facilitates alignment of a laser diode and an optical axis when packaging a semiconductor laser diode module for high speed optical communication, and improves optical coupling efficiency. A packaging device for a semiconductor laser diode and an alignment method thereof.

In general, a semiconductor laser diode module for optical communication is packaged with a laser diode for generating an optical signal, an optical fiber for transmitting the optical signal to the outside, and a lens for increasing optical coupling efficiency between the two members.

Conventionally, as a method of aligning the optical axis, alignment between the laser diode and the lens is mechanically performed, but alignment of the optical axis of the laser diode submodule portion except the lens or the submodule portion including the lens is performed only manually. have. Here, the optical axis refers to the axis of the traveling direction of the laser light emitted from the laser diode.

1 is a schematic cross-sectional view showing a packaging apparatus of a conventional semiconductor laser diode for optical communication.

As shown, the structure of a conventional semiconductor laser diode packaging device for optical communication is as follows.

Inside the package housing 101, as a laser diode submodule 107, a thermoelectric cooler (not shown) is attached to an upper surface of one side of the package housing 101, and a heat sink is disposed on the upper surface of the thermoelectric cooling element. sink 104 is attached. A subcarrier (not shown) is attached to an upper surface of the heat sink 104, and a submount 102a is attached to an upper surface of the subcarrier to which a laser diode 102 that emits laser light is attached. In addition, a lens 105 is provided to allow laser light to pass between the one side surface of the package housing 101 and the laser diode 102. In addition, an optical fiber 106 is installed around the laser light output unit 108 provided on one side of the package housing 101 to transmit the laser light emitted through the lens 105.

In such a structure, a method of aligning the laser diode 102 and the lens 105 with the optical axis by a conventional semiconductor laser diode packaging device for optical communication is performed by manually attaching the laser diode through a microscope or the like when the submodule 107 is attached. Since the direction and position of the sub-module 107 are determined, whether the position of the light in the longitudinal cross section of the package housing 101 is centered or positioned in parallel light will eventually align the lens 105 and the optical fiber 106 to laser welding. You can only check before sorting by

In addition, when the position of the laser diode submodule 107 is attached to the package housing 101, since only the external position is checked without checking the path or position of the actual light, the optical fiber 106 is aligned here. The optical fiber 106 and the package housing 101 longitudinal section are fixed at a predetermined angle with the position displacement at the center. Alignment in this manner takes much time for the alignment of the optical axis compared to the alignment of the optical axis by parallel light, and when the optical fiber 106 is fixed, the position and angular displacement of the laser diode submodule 107 is at the end of the package housing 101. When the alignment is impossible, there is a problem of disassembling and aligning, thereby consuming expensive components.

The packaging device and the alignment method of the semiconductor laser diode for optical communication according to the present invention to improve the problems as described above facilitates the alignment of the laser diode and the optical axis when packaging the laser diode module for high speed optical communication, and improves the optical coupling efficiency Has its purpose.

1 is a schematic cross-sectional view showing an optical axis alignment of a conventional semiconductor laser diode for optical communication;

2 is a schematic cross-sectional view showing a packaging device for a semiconductor laser diode for optical communication according to the present invention;

3 is a schematic cross-sectional view showing the optical axis alignment by the packaging device of the semiconductor laser diode for optical communication of FIG.

4 is a flowchart illustrating an optical axis alignment method of the semiconductor laser diode for optical communication according to the present invention.

<Description of the symbols for the main parts of the drawings>

101,201,301 ... Package Housing 102,202,302 ... Laser Diode

102a, 202a, 302a ... submount

202b ... subcarrier

203 ... thermoelectric cooler

104,204,304 ... heat sink

105,205,305 ... Lens 106,306 ... optical fiber

107,207,307 ... Submodule 108,208,308 ... Laser light exit part

209 ... positioning unit 210 ... package housing fixing unit

211 ... Adhesives 212 ... Probes

213 ... Heater 214 ... External alignment observation

214a ... Lens section 215 ... Table

In order to achieve the above object, a packaging device for a semiconductor laser diode for an optical communication according to the present invention includes a sub-module having a laser diode and a lens installed in a package housing having a laser light output unit, on the optical axis of the laser light output unit. A packaging device for a semiconductor laser diode for optical communication for alignment, comprising: an optical table; A heating device provided on one side of the table; A package housing mounting part which is installed on the heating device to fix the package housing including the sub module to be fixed; A position adjusting unit provided above the package housing fixing unit, the position adjusting unit including at least one driving unit and a controller for controlling the driving unit so as to correct the position and angle of the sub-module located in the package housing; An external alignment observation unit provided at a predetermined height on the other side of the table and having a lens unit disposed to face the laser light output unit of the package housing; And a probe connected to a negative electrode and a positive electrode of the laser diode to apply a current so that the laser light is emitted from the laser diode. The laser light emitted from the laser diode and transmitted through the lens and the laser light output part of the submodule. It is observed by the external alignment observation unit, by driving the position adjuster so that the concentricity of the lens longitudinal section of the sub-module and the laser light emitted from the laser light emitting unit is characterized in that for correcting the position and angle of the sub-module.

In addition, in order to achieve the above object, an optical axis alignment method of a semiconductor laser diode for an optical communication according to the present invention includes a sub-module having a laser diode and a lens installed in a package housing having a laser light emitting unit. An optical axis alignment method of a semiconductor laser diode for optical communication for aligning with an optical axis, comprising: a light observation step of observing a laser beam that is applied by a probe and passes through the laser light emitting portion from the laser diode; A driving step of aligning the submodules with an optical axis of the laser light emitted from the laser diode; And fixing the sub module aligned with the optical axis to the bottom surface of the package housing.

Hereinafter, a packaging device for a semiconductor laser diode for an optical communication according to the present invention will be described in detail with reference to the accompanying drawings. 2 is a schematic cross-sectional view showing a packaging device of a semiconductor laser diode for optical communication according to the present invention, Figure 3 is a schematic cross-sectional view showing the alignment of the optical axis by the packaging device of the semiconductor laser diode for optical communication of FIG.

As shown in FIG. 2, in the packaging apparatus of the semiconductor laser diode for optical communication of the present invention, the package housing fixing unit 210 for fixing the package housing 201 having an internal space formed on the table 215 is heated. The laser light emitting portion 208 is attached to one side of the package housing 201, which is attached to the upper portion and is a surface perpendicular to the emission direction of the laser light.

The adhesive 211 is provided between the thermoelectric cooler 203 and the bottom surface of the package housing 201.

Here, the thermoelectric cooling element 203 is attached to the inner bottom surface of the package housing 201, a heat sink 204 is attached to the thermoelectric cooling element 203, the subcarrier (202b) is a heat It is attached to the top surface of the sink 204. In addition, the laser diode 202 is attached to the upper portion of the submount (202a) on the subcarrier (202b), the lens 205 is the laser diode 202 in the direction in which the laser light is emitted from the laser diode (202) And the laser beam output unit 208 are attached to the upper surface of the heat sink 204.

The submodule 207 includes the heat sink 204, the thermoelectric cooling element 203, the subcarrier 202b, the submount 202a, the laser diode 202, and the lens 205 as described above. Is fixed to the positioning unit 209, and the probe 212 is connected to the negative and positive poles of the laser diode 202 to apply a current so that the laser light is emitted from the laser diode 202. The external alignment observation unit 214 is installed to face the laser light output unit 208 outside the package housing 201 so that the laser light emitted from the laser diode 202 is monitored through the laser light output unit 208. It is provided with the lens part 214a.

In this structure, the operation of the semiconductor laser diode packaging device for optical communication of the present invention is as follows.

The sub-module 207 inside the package housing 201 fixed by the package housing fixing unit 210 is applied with a current by the probe 212 connected to the negative and positive poles of the laser diode 202 so that the laser diode 202 is provided. The laser light is emitted. The laser light thus emitted is transmitted to the lens 205, and the transmitted laser light passes through the laser light output part 208 provided on one side of the package housing 201. At this time, the laser beam passing through the laser beam output unit 208 is provided on the outside of the package housing 201 through the lens unit 214a which is installed to face the laser beam output unit 208. Is observed by. Here, the external alignment observation unit 214 is preferably an infrared camera having a lens unit 214a of zoom and focus to accurately observe the laser light.

At this time, the external alignment observation unit 214 checks the concentricity with the light emitted from the lens 205 longitudinal section and the laser light output unit 208 of the sub-module 207, and the alignment is easily matched by matching the concentricity In order to correct the position and angle of the submodule 207 due to the driving of the positioning unit 209 fixed to the submodule 207, the position of the submodule 207 is moved at a predetermined angle to emit the lens 205 and the laser beam. The laser light is transmitted through the longitudinal concentricity of the part 208 to form parallel light which goes straight in the direction of the optical axis. Thus, the laser light transmitted from the longitudinal section of the lens 205 which is the starting point of the parallel light is emitted to the laser light output part 208. Aligned and aligned with each other on the optical axis.

When the laser beam is identified to the external alignment observation unit 214 as parallel light which does not incline at a predetermined angle in the center of the laser beam output unit 208, the position and angle of the submodule 207 are optimally aligned for optical axis alignment. As it is state, fix the position. In order to fix this, an adhesive 211 formed between the bottom surface of the package housing 201 and the thermoelectric cooling element 203 of the sub module 207 is installed under the package housing fixing unit 210. When the adhesive 211 is melted by heating to a predetermined temperature and the molten adhesive 211 is fixed at a low temperature, the submodule 207 is attached to the bottom surface of the package housing 201. Here, the adhesive 211 is preferably formed of a solder (bond) excellent in bonding and adhesion. In addition, the position adjusting unit 209 is provided with at least one driving unit (not shown) and a controller (not shown) for controlling the driving unit to move the submodule 207 to correct the position and angle.

As shown in FIG. 3 by the packaging device of the semiconductor laser diode for optical communication as described above, at the center of the laser light output unit 308 by correcting the position and angle of the sub-module 307 inside the package housing 301. By confirming by the external alignment observation unit (not shown) that the parallel light is emitted through the concentricity of the end face of the lens 305, an optical fiber 306 can be installed so as to coincide with the optical axis of the parallel light. In addition, the optical axis can be easily aligned.

Such components are provided on the table 215 to maintain equilibrium and stable fixing.

By doing so, the misalignment between the submodule 207 and the optical axis generated when the submodule 207 is aligned with the optical axis can be minimized, and the ease of the process of aligning the submodule 207 is improved.

Hereinafter, the optical axis alignment method of the semiconductor laser diode for optical communication according to the step-by-step alignment method according to the present invention will be described in detail. 4 is a flowchart illustrating an optical axis alignment method of the semiconductor laser diode for optical communication according to the present invention. 4 will be described with reference to FIG. 2.

First, as shown in FIG. 2, the thermoelectric element 203, the heat sink 204, the subcarrier 202b, the submount 202a, the laser diode 202, and the lens may be disposed on the package housing fixing unit 210. The sub module 207 having the 205 is installed in the package housing 201. The laser beam output unit 208 provided on one side of the package housing 201 and the external alignment observation unit 214 for observing the laser beam passing through the laser beam output unit 208 to confirm the optical axis alignment are mutually different. Place them spaced apart to coincide on the optical axis.

Next, the submodule 207 inside the package housing 201 is fixed to the position adjusting unit 209, and the probe 212 is connected to the negative and positive poles of the laser diode.

Next, a current is applied by the probe 212 connected to the negative and positive poles of the laser diode 202 so that the laser light emitted from the laser diode 202 passes through the lens 205, and the transmitted laser light is a laser. It passes through the light exit portion 208 to be observed by the lens portion 214a of the external alignment observation portion 214.

Then, when the observed laser light is not aligned with the longitudinal section of the lens 205 and the concentricity of the laser light output unit 208, the positioning unit 209 fixed to the submodule 207 is driven to After adjusting the position and angle of the submodule 207 by moving the submodule 207 so that the longitudinal section of the lens 205 which is the starting point of the parallel light and the concentricity of the laser light emitting unit 208 are corrected, the external alignment observation unit 214 Check with). Thus, by correcting the position of the sub-module 207 in accordance with the concentricity and aligning the optical axis, when the laser light is emitted parallel light straight on the optical axis in the center of the laser light output unit 208, the sub-module 207 The position and angle of) are optimally aligned on the optical axis, so fix the position.

Then, the adhesive 211 formed between the bottom surface of the inside of the package housing 201 and the thermoelectric cooling element 203 of the sub module 207 by heating to a predetermined temperature by the heating device 213 provided on the table 215. After the in-solder is melted and fixed at low temperature, the sub module 207 is attached to the bottom surface of the package housing 201 in an optimal optical axis alignment state.

Finally, by removing the position adjusting unit 209 and the probe 212, the optical axis alignment by the packaging device of the laser diode for optical communication is completed.

Thus, by applying the packaging device and the alignment method of the semiconductor laser diode for optical communication according to the present invention, the average of the conventional optical power before welding was 2.21 ㎽, the average of the optical power after application of the present invention is 2.73 ㎽ laser The location of the diodes differs from how they are aligned with the housing longitudinal section at an angle or position displacement. In addition, when the optical fibers are aligned immediately after the thermoelectric cooling element is aligned, the optical power is increased from 2.16 2. to 2.66 달리 unlike the conventional art, and the optical coupling efficiency may be increased by about 10% when compared to 5 되는 as the reference. Can be. In addition, in the case of welding by applying the present invention, since the laser beam is located at the center, the loss of the laser beam after welding can be reduced by 0.8% from 2.06% to 1.26%, unlike the related art.

As described above, the packaging device and the alignment method of the semiconductor laser diode for optical communication according to the present invention facilitates the alignment of the laser diode and the optical axis during packaging of the high speed optical communication semiconductor laser diode, and improves the optical coupling efficiency There is an advantage in that it prevents the consumption of expensive parts.

Claims (2)

A packaging apparatus for a semiconductor laser diode for an optical communication for aligning a submodule having a laser diode and a lens installed in a package housing having a laser light emitting portion with an optical axis of the laser light emitting portion, table; A heating device provided on one side of the table; A package housing mounting part which is installed on the heating device and fixes the package housing including the sub module to be fixed; A position adjusting unit provided above the package housing fixing unit, the position adjusting unit including at least one driving unit and a controller for controlling the driving unit so as to correct the position and angle of the sub-module located in the package housing; An external alignment observation unit provided at a predetermined height on the other side of the table and having a lens unit disposed to face the laser light output unit of the package housing; And And a probe connected to the negative and positive poles of the laser diode to apply a current so that the laser light is emitted from the laser diode. The laser beam emitted from the laser diode and transmitted through the lens of the submodule and the laser light output unit is observed by the external alignment observation unit, and the position is such that the concentricity of the lens longitudinal section of the submodule and the laser light emitted from the laser light output unit are coincident. A packaging device for a semiconductor laser diode for optical communication, comprising adjusting a position and an angle of a submodule by driving an adjusting unit. A method of aligning an optical axis of a semiconductor laser diode for an optical communication for aligning a submodule having a laser diode and a lens installed inside a package housing having a laser light emitting part with an optical axis of the laser light emitting part, A light observation step in which a current is applied by a probe and observes the laser light emitted from the laser diode through the laser light output unit; A driving step of aligning the submodules with an optical axis of the laser light emitted from the laser diode; And And fixing the sub-module aligned with the optical axis to the bottom surface of the package housing.