KR100282113B1 - 인쇄 회로 기판 제조 방법 - Google Patents

인쇄 회로 기판 제조 방법 Download PDF

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Publication number
KR100282113B1
KR100282113B1 KR1019980047949A KR19980047949A KR100282113B1 KR 100282113 B1 KR100282113 B1 KR 100282113B1 KR 1019980047949 A KR1019980047949 A KR 1019980047949A KR 19980047949 A KR19980047949 A KR 19980047949A KR 100282113 B1 KR100282113 B1 KR 100282113B1
Authority
KR
South Korea
Prior art keywords
printed circuit
coating
circuit board
resist
photosensitive resist
Prior art date
Application number
KR1019980047949A
Other languages
English (en)
Korean (ko)
Other versions
KR19990045154A (ko
Inventor
료타 반도
Original Assignee
사사키 요시오
간사이 페인트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사사키 요시오, 간사이 페인트 가부시키가이샤 filed Critical 사사키 요시오
Publication of KR19990045154A publication Critical patent/KR19990045154A/ko
Application granted granted Critical
Publication of KR100282113B1 publication Critical patent/KR100282113B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1019980047949A 1997-11-11 1998-11-10 인쇄 회로 기판 제조 방법 KR100282113B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9308675A JPH11145593A (ja) 1997-11-11 1997-11-11 プリント配線基板の製造方法
JP97-308675 1997-11-11

Publications (2)

Publication Number Publication Date
KR19990045154A KR19990045154A (ko) 1999-06-25
KR100282113B1 true KR100282113B1 (ko) 2001-02-15

Family

ID=17983942

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980047949A KR100282113B1 (ko) 1997-11-11 1998-11-10 인쇄 회로 기판 제조 방법

Country Status (3)

Country Link
JP (1) JPH11145593A (zh)
KR (1) KR100282113B1 (zh)
TW (1) TW407445B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5087332B2 (ja) * 2007-07-12 2012-12-05 公益財団法人鉄道総合技術研究所 二液型接着剤塗布装置及びそれを用いた二液反応硬化型接着剤の塗布方法並びにアンカー部材の固定方法

Also Published As

Publication number Publication date
TW407445B (en) 2000-10-01
KR19990045154A (ko) 1999-06-25
JPH11145593A (ja) 1999-05-28

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