KR100276412B1 - 무선 온도 보정 장치 및 방법 - Google Patents

무선 온도 보정 장치 및 방법 Download PDF

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Publication number
KR100276412B1
KR100276412B1 KR1019930014808A KR930014808A KR100276412B1 KR 100276412 B1 KR100276412 B1 KR 100276412B1 KR 1019930014808 A KR1019930014808 A KR 1019930014808A KR 930014808 A KR930014808 A KR 930014808A KR 100276412 B1 KR100276412 B1 KR 100276412B1
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KR
South Korea
Prior art keywords
temperature
wafer
correction
melting point
calibration
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1019930014808A
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English (en)
Korean (ko)
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KR940006239A (ko
Inventor
엠. 모슬레히 메흘다드
나즘 하비브
에이. 벨로 리노
Original Assignee
윌리엄 비. 켐플러
텍사스 인스트루먼츠 인코포레이티드
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Publication of KR940006239A publication Critical patent/KR940006239A/ko
Application granted granted Critical
Publication of KR100276412B1 publication Critical patent/KR100276412B1/ko
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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00Testing or calibrating of thermometers
    • G01K15/005Calibration
    • H10P74/00
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/52Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
    • G01J5/53Reference sources, e.g. standard lamps; Black bodies
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/80Calibration

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Radiation Pyrometers (AREA)
KR1019930014808A 1992-08-11 1993-07-31 무선 온도 보정 장치 및 방법 Expired - Fee Related KR100276412B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7/928,564 1992-08-11
US07/928,564 US5265957A (en) 1992-08-11 1992-08-11 Wireless temperature calibration device and method

Publications (2)

Publication Number Publication Date
KR940006239A KR940006239A (ko) 1994-03-23
KR100276412B1 true KR100276412B1 (ko) 2001-01-15

Family

ID=25456433

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930014808A Expired - Fee Related KR100276412B1 (ko) 1992-08-11 1993-07-31 무선 온도 보정 장치 및 방법

Country Status (6)

Country Link
US (2) US5265957A (enExample)
EP (1) EP0583007B1 (enExample)
JP (1) JP3461868B2 (enExample)
KR (1) KR100276412B1 (enExample)
DE (1) DE69314876T2 (enExample)
TW (1) TW287230B (enExample)

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US6169271B1 (en) 1998-07-13 2001-01-02 Mattson Technology, Inc. Model based method for wafer temperature control in a thermal processing system for semiconductor manufacturing
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US6200023B1 (en) * 1999-03-15 2001-03-13 Steag Rtp Systems, Inc. Method for determining the temperature in a thermal processing chamber
US6293696B1 (en) * 1999-05-03 2001-09-25 Steag Rtp Systems, Inc. System and process for calibrating pyrometers in thermal processing chambers
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WO2002033369A1 (en) * 2000-10-13 2002-04-25 Tokyo Electron Limited Apparatus for measuring temperatures of a wafer using specular reflection spectroscopy
US6666577B2 (en) * 2000-11-02 2003-12-23 Matsushita Electric Industrial Co., Ltd. Method for predicting temperature, test wafer for use in temperature prediction, and method for evaluating lamp heating system
US6517235B2 (en) 2001-05-31 2003-02-11 Chartered Semiconductor Manufacturing Ltd. Using refractory metal silicidation phase transition temperature points to control and/or calibrate RTP low temperature operation
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US20050233770A1 (en) * 2002-02-06 2005-10-20 Ramsey Craig C Wireless substrate-like sensor
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
DE10325602B3 (de) * 2003-06-05 2004-09-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur temperaturgeregelten Prozessierung von Substraten
FR2874285B1 (fr) * 2004-08-13 2006-10-13 Commissariat Energie Atomique Procede de realisation d'empilements d'ilots de materiau semi-conducteur encapsules dans un autre materiau semi-conducteur
US7406397B2 (en) * 2004-09-02 2008-07-29 International Business Machines Corporation Self heating monitor for SiGe and SOI CMOS devices
DE102004051409B4 (de) * 2004-10-21 2010-01-07 Ivoclar Vivadent Ag Brennofen
US8547521B1 (en) * 2004-12-01 2013-10-01 Advanced Micro Devices, Inc. Systems and methods that control liquid temperature in immersion lithography to maintain temperature gradient to reduce turbulence
US7275861B2 (en) * 2005-01-31 2007-10-02 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures
US7380982B2 (en) * 2005-04-01 2008-06-03 Lam Research Corporation Accurate temperature measurement for semiconductor applications
DE102005049477A1 (de) * 2005-10-13 2007-04-19 Freiberger Compound Materials Gmbh Verfahren und Vorrichtung zur Kristallzüchtung mittels kombinierter Heizerregelung
WO2007098149A2 (en) * 2006-02-21 2007-08-30 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
US7893697B2 (en) 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
JP5236652B2 (ja) * 2006-09-29 2013-07-17 サイバーオプティクス セミコンダクタ インコーポレイテッド 基板と一体化された粒子センサ
US7778793B2 (en) * 2007-03-12 2010-08-17 Cyberoptics Semiconductor, Inc. Wireless sensor for semiconductor processing systems
JP4991390B2 (ja) * 2007-05-21 2012-08-01 株式会社日立ハイテクノロジーズ マイクロサンプル加熱用試料台
US8047706B2 (en) * 2007-12-07 2011-11-01 Asm America, Inc. Calibration of temperature control system for semiconductor processing chamber
US8523427B2 (en) * 2008-02-27 2013-09-03 Analog Devices, Inc. Sensor device with improved sensitivity to temperature variation in a semiconductor substrate
JP6038030B2 (ja) * 2010-08-31 2016-12-07 キヤノン ユー.エス. ライフ サイエンシズ, インコーポレイテッドCanon U.S. Life Sciences, Inc. 熱センサ用コンパウンドキャリブレータ
US8749629B2 (en) * 2011-02-09 2014-06-10 Siemens Energy, Inc. Apparatus and method for temperature mapping a turbine component in a high temperature combustion environment
DE102015106805A1 (de) 2015-04-30 2016-11-03 Anton Paar Optotec Gmbh Temperaturkalibration für Messgerät
JP7339983B2 (ja) * 2021-05-21 2023-09-06 Semitec株式会社 温度校正方法
KR102616595B1 (ko) * 2022-11-02 2023-12-28 한국표준과학연구원 서모커플 웨이퍼 교정 시스템 및 이를 이용한 교정방법
TW202441147A (zh) * 2022-12-16 2024-10-16 美商蘭姆研究公司 用於高保真度原位溫度計量校準的參考晶圓
CN117109776B (zh) * 2023-10-24 2024-01-19 成都明夷电子科技有限公司 一种光模块单点温度校准方法

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US4309901A (en) * 1979-12-18 1982-01-12 The United States Of America As Represented By The Secretary Of The Air Force Heat transfer calibration plate
US4387301A (en) * 1981-04-20 1983-06-07 Hughes Aircraft Company Target for calibrating and testing infrared detection devices
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FR2570825B1 (fr) * 1984-09-26 1987-02-06 Commissariat Energie Atomique Appareil de mesure thermique de la texture d'un corps poreux
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US5258602A (en) * 1988-02-17 1993-11-02 Itt Corporation Technique for precision temperature measurements of a semiconductor layer or wafer, based on its optical properties at selected wavelengths
US4956538A (en) * 1988-09-09 1990-09-11 Texas Instruments, Incorporated Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors
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US5102231A (en) * 1991-01-29 1992-04-07 Texas Instruments Incorporated Semiconductor wafer temperature measurement system and method
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US5221142A (en) * 1991-05-20 1993-06-22 Peak Systems, Inc. Method and apparatus for temperature measurement using thermal expansion
US5265957A (en) * 1992-08-11 1993-11-30 Texas Instruments Incorporated Wireless temperature calibration device and method

Also Published As

Publication number Publication date
TW287230B (enExample) 1996-10-01
KR940006239A (ko) 1994-03-23
JP3461868B2 (ja) 2003-10-27
US5326170A (en) 1994-07-05
JPH06224206A (ja) 1994-08-12
US5265957A (en) 1993-11-30
EP0583007A1 (en) 1994-02-16
EP0583007B1 (en) 1997-10-29
DE69314876T2 (de) 1998-03-12
DE69314876D1 (de) 1997-12-04

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