KR100266214B1 - Cog-type lcd panel - Google Patents

Abstract

PURPOSE: A chip on glass-type liquid crystal panel is to reduce a pad margin by mounting a drive integrated circuit(D-IC) chip and a flexible printed circuit(FPC) film onto a same region. CONSTITUTION: A D-IC chip(16) is attached to a pad region of a lower glass substrate(14), and is electrically connected to an electrode pad(24) connected to an image display by an output bump(22D). The D-IC chip is inputted with an electrical signal from an FPC film(18) through the input bump. A dummy bump(22B) positioned between an edge of the lower glass substrate and output bump supports the D-IC chip. FPC film is attached to an upper portion of the D-IC chip by an anisotropic conductive film(ACF)(20), and is electrically connected to the D-IC chip by the input bump. The D-IC chip outputs a control signal for a thin film transistor in response to electrical signals inputted from the FPC film through the input bump. The FPC film transfers the electrical signals to the D-IC chip from a control circuit.

Description

COG type liquid crystal panel with reduced pad margin and manufacturing method

The present invention relates to a COG type liquid crystal panel and a method of manufacturing the same that can reduce the margin of the pad.

In recent years, liquid crystal (Liquid Crystal Display) is characterized by a light weight, thin, low power consumption, and the quality of the liquid crystal material and the development of micro-pixel processing technology, the image quality has been improved rapidly. In addition, the application range is gradually increasing. The practical application range of liquid crystal shows that the application device and personal computer (PC; Personal Computer) related to small high-precision display such as View-Finder or Project Display are gradually used in clocks, electronic table calculators and measuring instruments. A wide range of applications are underway for large-scale and multi-pixel display applications such as workstations and TVs. In such a liquid crystal display device, an image display unit in which pixels of liquid crystal are arranged in a matrix form, and a drive IC chip (hereinafter, referred to as a "D-IC chip") for driving the image display unit are included. Liquid crystal panels have recently been manufactured in the form of COG (Chip On Glass), in which D-IC chips are mounted directly on the edge of a glass substrate. In addition, a flexible printed circuit film (hereinafter referred to as an "FPC film") for attaching signals to the D-IC chips is attached to the COG type liquid crystal panel. In the COG liquid crystal panel, since the D-IC chips and the FPC film are mounted at different positions, the effective screen area is reduced and the size of the liquid crystal panel is increased. In addition, the FPC film includes wiring that can provide an electrical signal to all of the D-IC chips. As a result, the wiring amount of the FPC film is increased, and the manufacturing cost of the FPC film and the manufacturing cost of the liquid crystal panel have to be increased.

In practice, the COG type liquid crystal panel has D-IC chips 6 mounted on the edge on the lower glass substrate 4 so as to be positioned between the upper glass substrate 2 and the FPC film 8 as shown in FIGS. 1A and 1B. It will be included. An image display unit in which liquid crystal cells and thin film transistors are arranged in a matrix form is formed between the lower glass substrate 4 and the upper glass substrate 2. An electrode for supplying signals for driving thin film transistors (hereinafter referred to as "TFT") at the edge of the lower glass substrate 4 on which the D-IC chips 6 and the FPC film 8 are mounted. Since the pads are formed, it is commonly referred to as "pad margin or pad area". In this pad area, output wiring electrodes (not shown) for connecting the D-IC chips 6 and the image display unit and input wiring electrodes for connecting the D-IC chips 6 and the FPC film 8 ( Not shown) is formed. The D-IC chips 6 are for driving TFTs, and are provided with an anisotropic conductive film (ACF) 10 to be electrically connected to the input wiring electrodes and the output wiring electrodes. The bumps 10A are bonded to the pad area. In the FPC film 8, wiring for transferring electrical signals (e.g., video data, timing control signals and voltage signals) from a control circuit unit (not shown) to the D-IC chips 6 is mounted. . The FPC film 8 is also adhered to the pad area by the ACF 10 and the bumps 10A so as to be electrically connected to the input wiring electrodes.

As described above, since the D-IC chips and the FPC film are mounted side by side in the pad region, the pad region may be large. As a result, in the conventional COG type liquid crystal panel, the screen area is reduced and the size of the glass substrate is inevitably increased.

Accordingly, an object of the present invention is to provide a COG type liquid crystal panel having a pad margin reduced by mounting a D-IC chip and an FPC film in the same area and a method of manufacturing the same.

1A is a plan view schematically showing a conventional COG type liquid crystal panel.

1B is a sectional view schematically showing a conventional COG type liquid crystal panel.

2A is a plan view schematically illustrating a COG type liquid crystal panel according to an exemplary embodiment of the present invention.

2b is a cross-sectional view schematically showing a COG type liquid crystal panel according to an embodiment of the present invention.

Figure 3a is a plan view schematically showing a COG type liquid crystal panel according to another embodiment of the present invention.

3b is a cross-sectional view schematically showing a COG type liquid crystal panel according to another embodiment of the present invention.

* Explanation of symbols for main parts of the drawings

2,12 upper glass substrate 4,14 lower glass substrate

6,16: D-IC chip 8,18: FPC film

20,10: ACF 10A: Bump

22A: Bump for relay 22B: Dummy bump

22C: Bump for Input 22D: Bump for Output

In order to achieve the above object, the COG type liquid crystal panel with reduced pad margin according to the present invention overlaps the driving integrated circuit chips mounted side by side on the lower glass substrate to supply signals to the electrode pads. A flexible printed circuit film mounted on the driving integrated circuit chips to supply electrical signals to the driving integrated circuit chips, and the driving integrated circuit chips and the flexible printed circuit film are superimposed on the lower glass substrate and driven An anisotropic conductive film is provided to electrically connect the integrated circuit chips with the wirings formed on the lower glass substrate and to electrically connect the flexible printed circuit film to the driving integrated circuit chips.

A method of manufacturing a COG type liquid crystal panel with reduced pad margin according to the present invention includes providing a glass substrate on which a plurality of pixels and electrode pads connected to the pixels are formed, and a first anisotropic conductive layer on the electrode pads. Attaching a film, arranging first conductive bumps corresponding to electrode pads on the first anisotropic conductive film, arranging drive integrated circuit chips side by side on top of the first conductive bumps, and driving Pressing the integrated circuit chips, attaching a second anisotropic conductive film on top of the driving integrated circuit chips, arranging second conductive bumps along both edges of the second anisotropic conductive film, and second conductive Positioning the flexible printed circuit film on top of the bumps, and pressing the flexible printed circuit film.

The COG type liquid crystal panel with reduced pad margin according to the present invention is mounted on the lower glass substrate so as to overlap the driving integrated circuit chips and drive integrated circuit chips mounted side by side on the lower glass substrate to supply signals to the electrode pads. A flexible printed circuit film for supplying signals to the driving integrated circuit chips and a wiring formed by bonding the driving integrated circuit chips and the flexible printed circuit film on the lower glass substrate so as to overlap each other and the driving integrated circuit chips on the lower glass substrate. And an anisotropic conductive film electrically connecting the flexible printed circuit film and electrically connecting the flexible printed circuit film with the driving integrated circuit chips.

According to an exemplary embodiment of the present invention, there is provided a method of manufacturing a COG type liquid crystal panel having a reduced pad margin, the method comprising: providing a glass substrate on which a plurality of pixels and electrode pads connected to the pixels are formed; Attaching a conductive film, arranging first conductive bumps on the first anisotropic conductive film to correspond with the electrode pads, placing a flexible printed circuit film on top of the first conductive bumps, and Pressing the flexible printed circuit film, attaching a second anisotropic conductive film on top of the flexible printed circuit film, arranging second conductive bumps along both edges of the second anisotropic conductive film, and Arranging the drive integrated circuit chips side by side on top of the two conductive bumps, and pressing the drive integrated circuit chips.

Other objects and features of the present invention other than the above object will become apparent from the description of the embodiments with reference to the accompanying drawings.

2A and 2B, the upper glass substrate 12 adhered to the upper portion of the lower glass substrate 14, the D-IC chips 16 mounted in the pad region on the lower glass substrate 12, and these D-ICs. A COG type liquid crystal panel according to an embodiment of the present invention having an FPC film 18 mounted on top of chips 16 is shown. Between the upper glass substrate 12 and the lower glass substrate 14, image display portions in which liquid crystal cells and TFTs are arranged in a matrix form are formed.

The D-IC chips 16 are bonded to the pad area on the lower glass substrate 14 by the ACF 20 and electrically connected to the electrode pads 24 connected to the image display part by the output bumps 22D. Will be. In addition, the D-IC chips 16 input electrical signals from the FPC film 18 via input bumps 22C located on the upper portion thereof. The dummy bumps 22B positioned between the edge portion of the lower glass substrate 14 and the output bumps 22D allow the D-IC chips 16 to be stably supported. The FPC film 18 is adhered to the top of the D-IC chips 16 by the ACF 20 and electrically connected to the D-IC chips 16 by the input bumps 22C. The D-IC chips 16 transmit TFT control signals for driving TFTs in response to electrical signals input from the FPC film 18 via input bumps 22C via the output bumps 22D. The output is toward the electrode pads 24. The FPC film 18 transfers electrical signals from the control circuit unit (not shown) to the D-IC chips 16. As such, the size of the pad region is reduced by mounting the D-IC chips 16 and the FPC film 18 in the pad region on the lower glass substrate 14 so that the D-IC chips 16 and the FPC film 18 overlap each other. As a result, the screen area of the COG type liquid crystal panel is increased and the size of the COG type liquid crystal panel is reduced.

As such, the manufacturing process of the COG type liquid crystal panel in which the FPC film 18 and the D-IC chips 16 are overlapped will be illustrated. First, the ACF 20 is attached to the pad region of the lower glass substrate 14 to which the upper glass substrate 12 is bonded. Output bumps 22D and dummy bumps 22B are arranged side by side on both edges of the ACF 20, and the D-ICs are placed on top of these output bumps 22D and dummy bumps 22B. The chips 16 are raised. The D-IC chips 16 placed on the output bumps 22D and the dummy bumps 22B are compressed to the lower glass substrate 14 by the downward pressure, and the electrode pads 24 Electrical connection. Subsequently, the ACF 20 is reattached to the upper portions of the D-IC chips 16, and input bumps 22C are arranged in a line at the outer edge of the ACF 20. FPC film 18 is placed on top of these input bumps 22C. The FPC film 18 placed on top of the input bumps 22C is squeezed to the D-IC chips 16 by the pressure acting downward, and is also electrically connected to the D-IC chips 16. .

3A and 3B, an upper glass substrate 12 adhered to an upper portion of the lower glass substrate 14, an FPC film 18 mounted on a pad region, that is, an edge portion, on the lower glass substrate 12; The COG type liquid crystal panel according to another embodiment of the present invention having D-IC chips 16 mounted on the FPC film 18 is illustrated. Between the upper glass substrate 12 and the lower glass substrate 14, image display portions in which liquid crystal cells and TFTs are arranged in a matrix form are formed. The FPC film 18 is adhered to the pad region on the lower glass substrate 14 by the ACF 20 and electrically connected to the electrode pads 24 connected to the image display portion by the relay bumps 22A. do. The D-IC chips 16 are adhered to the top of the FPC film 18 by the ACF 20 and are electrically connected to the FPC film 18 by the input bumps 22C and the output bumps 22D. Will be connected. Input bumps 22C carry signals from FPC film 18 toward D-IC chips 16, while output bumps 22D send signals from D-IC chips 16 to FPC film (16). 18) and relay bumps 22A. In other words, the FPC film 18 located between the lower glass substrate 14 and the D-IC chips 16 transmits the electrical signals from the control circuit unit (not shown) to the D-IC chips 16 as well as the D-IC chips 16. TFT drive signals from the IC chips 16 are transferred to the electrode pads 24 connected to the image display section. As such, the size of the pad region is reduced by mounting the D-IC chips 16 and the FPC film 18 in the pad region on the lower glass substrate 14 so that the D-IC chips 16 and the FPC film 18 overlap each other. As a result, the screen area of the COG type liquid crystal panel becomes larger and the size of the COG type liquid crystal panel becomes smaller.

Thus, the manufacturing process of the COG type liquid crystal panel in which the FPC film 18 and the D-IC chips 16 are overlapped will be described. First, the ACF 20 is attached to the pad region of the lower glass substrate 14 to which the upper glass substrate 12 is bonded. Relay bumps 22A and dummy bumps 22B are arranged side by side at both edges of the ACF 20, and the FPC film is placed on top of these relay bumps 22A and dummy bumps 22B. 18 is raised. Thus, the FPC film 18 placed on the relay bumps 22A and the dummy bumps 22B is pressed onto the lower glass substrate 14 by downward pressure, and electrically connected to the electrode pads 24. Will be connected. Subsequently, an ACF 20 is attached to the upper portion of the FPC film 18, and input bumps 22C and output bumps 22D are arranged side by side at both edges of the ACF 20. D-IC chips 16 are arranged on top of these input bumps 22C and output bumps 22D. Thus, the D-IC chips 16 placed on the input bumps 22C and the output bumps 22D are pressed onto the FPC film 18 by the pressure acting downward, and the FPC film 18 and Electrical connection.

As described above, in the COG type liquid crystal panel having reduced pad margin according to the present invention, the pad margin may be minimized by mounting the D-IC chip and the FPC film in the same area. Accordingly, the effective screen area is increased as the module size of the liquid crystal panel is reduced and the pad margin is reduced.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined only by the claims.

Claims (8)

A liquid crystal panel having a plurality of pixels arranged between an upper glass substrate and a lower glass substrate, and electrode pads connected to the pixels on the lower glass substrate, the lower glass substrate for supplying signals to the electrode pads. Drive integrated circuit chips mounted side by side on a plate, a flexible printed circuit film mounted on the drive integrated circuit chips to overlap the drive integrated circuit chips, and supplying electrical signals to the drive integrated circuit chips; Bonding the driving integrated circuit chips and the flexible printed circuit film to overlap each other on a substrate; and electrically connecting the driving integrated circuit chips with wires formed on the lower glass substrate and driving the flexible printed circuit film. And an anisotropic conductive film electrically connected to the integrated circuit chips. It is a COG type liquid crystal panel with reduced margin pad. The semiconductor device of claim 1, further comprising: first conductive bumps connected between the flexible printed circuit film and the input terminals of the driving integrated circuit chips, the output terminals of the driving integrated circuit chips, and the lower glass substrate. Pad margins further comprising second conductive bumps connected between wirings and dummy bumps positioned between the lower glass substrate and the driving integrated circuit chips to stably support the driving integrated circuit chips. COG type liquid crystal panel Providing a plurality of pixels and a glass substrate on which electrode pads connected to the pixels are formed, attaching a first anisotropic conductive film on the electrode pads, and on the first anisotropic conductive film Arranging first conductive bumps corresponding to the electrode pads, arranging driving integrated circuit chips side by side on the first conductive bumps, pressing the driving integrated circuit chips, and driving the driving integrated circuit chips; Attaching a second anisotropic conductive film on top of integrated circuit chips, arranging second conductive bumps along both edges of the second anisotropic conductive film, and flexible printed circuitry on top of the second conductive bumps Manufacturing a COG type liquid crystal panel with reduced pad margin, comprising the step of positioning the film, and pressing the flexible printed circuit film Law. 4. The method of claim 3, further comprising arranging dummy bumps in parallel with the first conductive bumps between the driving integrated circuit chips and the glass substrate. 5. A liquid crystal panel having a plurality of pixels arranged between an upper glass substrate and a lower glass substrate, and electrode pads connected to the pixels on the lower glass substrate, the lower glass substrate for supplying signals to the electrode pads. Drive integrated circuit chips mounted side by side on a plate, a flexible printed circuit film mounted on the lower glass substrate so as to overlap the drive integrated circuit chips, and supplying electrical signals to the drive integrated circuit chips, and on the lower glass substrate Bonding the driving integrated circuit chips to the flexible printed circuit film so as to overlap each other, and electrically connecting the driving integrated circuit chips to the wirings formed on the lower glass substrate, and connecting the flexible printed circuit film to the driving integrated circuit. A pad comprising an anisotropic conductive film electrically connected to the chips COG type liquid crystal panel with reduced margins. The semiconductor device of claim 5, further comprising: first conductive bumps connected between the flexible printed circuit film and the input terminals of the driving integrated circuit chips, and between the flexible printed circuit film and the output terminals of the driving integrated circuit chips. Second conductive bumps connected to the third conductive bumps connected between the flexible printed circuit film and the wirings formed on the lower glass substrate, and between the lower glass substrate and the flexible printed circuit film. COG type liquid crystal panel with reduced pad margin, characterized in that it further comprises dummy bumps to stably support the flexible printed circuit film. Providing a plurality of pixels and a glass substrate on which electrode pads connected to the pixels are formed, attaching a first anisotropic conductive film on the electrode pads, and on the first anisotropic conductive film Arranging first conductive bumps corresponding to the electrode pads, placing a flexible printed circuit film on top of the first conductive bumps, pressing the flexible printed circuit film, and Attaching a second anisotropic conductive film on top of the printed circuit film, arranging second conductive bumps along both edges of the second anisotropic conductive film, and driving integrated circuit on top of the second conductive bumps Arranging the chips side by side, and pressing the driving integrated circuit chips; G-type liquid crystal panel manufacturing method. 10. The COG type liquid crystal of claim 7, further comprising a step in which dummy bumps are arranged in parallel with the first conductive bumps between the lower glass substrate and the flexible printed circuit film. Panel manufacturing method.

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