KR100242942B1 - Washing apparatus for using a multi-oscillation ultrasonic wave - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple oscillation ultrasonic cleaning apparatus, comprising: an internal cleaning tank containing a cleaning liquid containing a wafer therein, and an ultrasonic cleaning apparatus including a diaphragm for transmitting vibration to the cleaning liquid, wherein the diaphragm includes a predetermined portion of the internal cleaning tank. It is characterized in that the plurality is mounted on the site.

In the multi-oscillation ultrasonic cleaning apparatus according to the present invention formed as described above, the diaphragm is mounted on the lower end of the inner cleaning tank to vibrate indirectly, and is also mounted directly on the side end of the inner cleaning tank to vibrate, thereby cleaning the wafer provided in the inner cleaning tank. The effect is maximized.

Description

Washing apparatus for using a multi-oscillation ultrasonic wave}

The present invention relates to an ultrasonic cleaning device, and more particularly, to mount a diaphragm that generates sound waves in an external container, and also to an inner cleaning tank, so that the sound waves of the diaphragm are directly or indirectly transferred to a wafer to obtain a maximum cleaning effect. It relates to a multi-oscillation ultrasonic cleaning device that can be.

In recent years, semiconductor devices have been increasingly integrated, and the spacing between wirings has been formed to have a finer size.

Therefore, the influence of foreign matters in the manufacture of semiconductor devices is gradually increasing, and as a result, efforts to minimize the generation of foreign matters from the manufacturing stage of the semiconductor device have been accelerated.

Accordingly, the wafer cleaning process of cleaning the wafer and improving its cleanliness during the manufacturing process of the semiconductor device is gradually increasing its importance.

1 is a cross-sectional view showing a schematic shape of an ultrasonic cleaning apparatus according to a conventional manufacturing technique for performing such a function.

As shown, the ultrasonic cleaning apparatus according to the conventional manufacturing technique includes an internal cleaning tank 101 which accommodates the wafer 100 in the cleaning liquid contained therein; An outer container 103 containing an inner cleaning tank 101 in a predetermined aqueous solution (H ₂ O); A diaphragm 104 mounted at a lower end of the outer container 103 to generate predetermined sound waves; It is formed on the upper side of the inner washing tank 101 and includes an outer washing tank 102 for supplying a cleaning liquid from which contamination has been removed.

The cleaning process of the ultrasonic cleaning apparatus according to the conventional manufacturing technology formed as described above will be described in more detail as follows.

First, the diaphragm 104 attached to the lower end of the outer container 103 is vibrated at a constant frequency by the vibration of the ultrasonic generator 105 formed outside.

At this time, the vibration generated in the diaphragm 104 vibrates the aqueous solution contained in the outer container 103 and the vibration is transmitted to the inner cleaning tank 101 included in the outer container 103.

As the vibration is transmitted, the cleaning liquid filling the internal cleaning tank 101 vibrates to a predetermined width and generates local heat and high-speed flow on the surface of the wafer 100 so as to be mounted on the surface of the wafer 100. Particulate particles can be removed and the desired cleaning purpose can be achieved.

In this case, the diaphragm 104 may not secure an accurate vibration region unless the diaphragm 104 maintains a constant distance from the inner cleaning tank. Therefore, the assembly process requires a high degree of precision.

On the other hand, the drain pipe 106 is formed at the side end of the internal cleaning tank 101 serves to discharge the contaminated cleaning liquid to the outside.

At this time, the discharged cleaning liquid is filtered by a filter (not shown), and after the contaminant is removed, it is supplied to the external cleaning tank 102 by the water supply pipe 107, and the supplied cleaning liquid is formed in the inner cleaning tank 101 at the lower end thereof. Will flow into.

As described above, the ultrasonic cleaning apparatus according to the conventional manufacturing technique adopts an indirect oscillation method of vibrating cleaning by an aqueous solution between the internal cleaning tank 101 and the diaphragm 104.

However, in the ultrasonic cleaning apparatus according to the conventional manufacturing technique for performing such a function, there is a problem that the vibration of the diaphragm 104 is not derived to the entire internal cleaning tank 101 and thus does not obtain an excellent cleaning effect.

That is, the ultrasonic cleaning apparatus according to the conventional manufacturing technology employs an indirect cleaning method to mediate an aqueous solution between the internal cleaning tank 101 and the diaphragm 104 and is mounted on the surface of the wafer 100 by the vibration of the aqueous solution. To remove the contaminants, the aqueous solution molecules have a problem that the cleaning effect is lowered by acting as a factor that interferes with the generated sound waves.

In addition, when a sufficient amount of the aqueous solution is not supplied to the outer container 103, there is a problem that the sound wave generated from the diaphragm 104 is dispersed in the air and the cleaning effect is significantly reduced.

In addition, there is a problem that the assembly process for maintaining the gap between the diaphragm 104 and the internal cleaning tank 101 is very difficult to reduce the efficiency in the manufacturing process.

Accordingly, an object of the present invention is not only to mount the diaphragm on the lower surface of the inner cleaning tank but also to the left and right sides of the inner cleaning tank so that the vibration is generated not only at the bottom of the wafer but also at the left and right sides, thereby achieving an improved cleaning effect. It is to provide a multi-oscillation ultrasonic cleaning device that can be.

Another object of the present invention is to provide a multi-oscillation ultrasonic cleaning apparatus that can maximize the cleaning effect by the vibration transmission is performed directly or indirectly.

Still another object of the present invention is to provide a multi-oscillation ultrasonic cleaning device which has an additional diaphragm vibrating from the side, thereby facilitating the assembly of the diaphragm formed at the lower end of the inner cleaning tank.

1 is a cross-sectional view showing a schematic shape of an ultrasonic cleaning apparatus according to a conventional manufacturing technique.

Figure 2 is a cross-sectional view schematically showing a multiple oscillation ultrasonic cleaning apparatus according to the present invention.

3 is a cross-sectional view schematically showing a first embodiment of the present invention;

4 is a cross-sectional view schematically showing a second embodiment of the present invention;

* Explanation of symbols for main parts of the drawings

200 wafer 201 first diaphragm

202: second diaphragm 203: third diaphragm

204: First ultrasonic generator 205: Second ultrasonic generator

206: third ultrasonic generator 207: ultrasonic generator

208: inner cleaning tank 209: outer container

The ultrasonic wave cleaning apparatus according to the present invention for achieving the above object includes an internal cleaning tank containing a cleaning liquid containing a wafer therein, and a diaphragm for transmitting vibration to the cleaning liquid. A plurality of diaphragms are mounted on predetermined portions of the inner cleaning tank.

Preferably, the inner cleaning tank is accommodated by an outer container equipped with a predetermined diaphragm.

Preferably, the diaphragm is characterized in that two.

Preferably, the diaphragm is formed of stainless steel.

Preferably, the diaphragm is controlled by different ultrasonic generators.

Preferably, the diaphragm may be controlled by one ultrasonic generator.

Accordingly, in the present invention, the vibration caused by the diaphragm is generated directly or indirectly at the side ends and the lower ends of the internal cleaning tank, so that foreign matters mounted on the wafer are easily cleaned.

Hereinafter, with reference to the accompanying drawings, the multi-oscillation ultrasonic cleaning device according to the present invention in more detail.

In the following description, description of the same components as the conventional role, for example, an external cleaning tank, will be omitted.

2 is a cross-sectional view schematically showing a multi-oscillation ultrasonic cleaning apparatus according to the present invention.

As shown, the inner cleaning tank 208 containing the wafer 200 in the contained cleaning liquid is immersed in the outer container 209 of a predetermined capacity in which a certain amount of aqueous solution is contained.

In this case, a first diaphragm 201 vibrating a predetermined width by an ultrasonic signal generated by the first ultrasonic generator 204 described below is mounted on the outer side of the bottom surface of the lower end of the outer container 209. The vibration is transmitted to 209, and the vibration is transmitted to the internal cleaning tank 208 through the aqueous solution.

Here, according to a feature of the present invention, a pair of second diaphragms 202 and 203 are mounted on both sidewalls of the internal cleaning tank 208.

Accordingly, the wafer 200 contained in the cleaning liquid of the inner cleaning tank 208 is additionally mounted in addition to the cleaning effect by the vibration of the first diaphragm 201 mounted outside the bottom surface of the lower end of the outer container 209. Cleaning effects by vibration of the second diaphragms 202 and 203 may be obtained.

In addition, in the present invention, in addition to the first diaphragm 201 mounted on the lower end of the outer container, the second diaphragms 202 and 203 are additionally mounted on both outer walls of the inner cleaning tank, thereby improving the cleaning effect of the wafer. Even if a certain separation distance error occurs between the diaphragm and the internal cleaning tank, the cleaning effect is not greatly reduced. As a result, the assembling process of the first diaphragm can be carried out much easier than in the prior art.

If more detailed description of the cleaning process of the cleaning apparatus according to the present invention as follows.

First, the first diaphragm 201 mounted outside the bottom surface of the lower end of the outer container 209 cleans the wafer 200 through an aqueous solution.

In addition, the second and third diaphragms 202 and 203 mounted directly to both outer walls of the inner cleaning tank 208 directly transmit the vibration generated without the mediation of other materials to the inner cleaning tank 208.

Therefore, the wafer 200 contained in the internal cleaning tank 208 can obtain improved cleaning by the direct influence of the second diaphragms 202 and 203.

In other words, the vibration of the second diaphragms 202 and 203 causes an effect of increasing the pressure instantaneously or locally in the cleaning liquid, and this effect extends to the surface of the wafer 100 placed in the cleaning liquid, so that the surface of the wafer 100 is properly cleaned. Will be.

At this time, according to the feature of the present invention, the material of the first and second diaphragms 201, 202, 203 is made of stainless, thereby maximizing the vibration effect.

Meanwhile, according to a feature of the present invention, the first and second diaphragms 201, 202, and 203 are controlled by different ultrasonic generators, that is, the first, second, and third ultrasonic generators 204, 205, and 206, respectively. The first and second diaphragms 201, 202, and 203 may receive ultrasonic waves of different frequencies.

As a result, the cavitation phenomenon in which the liquid grains are destroyed inside the cleaning liquid by the oscillation of the first and second diaphragms 201, 202, and 203 that vibrate at different frequencies is promoted, and thus the cleaning effect of the wafer 200 is improved. Is improved.

In addition, it is possible to oscillate the low frequency (30 kHz or less) and the high frequency (1 MHz or less) together in one cleaning device, and various cleanings can be performed according to the type of the pollution source formed on the wafer 200.

3 is a cross-sectional view schematically showing another embodiment of the present invention.

As shown, the first and second diaphragms 201, 202, 203 may be controlled by one ultrasonic generator 207.

When the cleaning apparatus of the present invention is formed in this way, the space occupied by the ultrasonic generator 207 in the equipment is reduced, and there is an advantage that the equipment can be miniaturized.

In addition, even in the above embodiment, by adopting the direct / indirect multiple oscillation method according to the present invention, it is possible to achieve the effect of removing the contaminant particles attached to the front, back, corner of the wafer 200 as much as possible.

4 is a cross-sectional view schematically showing another embodiment of the present invention.

As shown, the wafer contained in the inner cleaning tank is cleaned by the direct vibration of the second diaphragms 202 and 203.

Even if the cleaning apparatus of the present invention performs the cleaning function using only the direct method without the external container and the first diaphragm as described above, the substance that hinders the sound wave is removed, thereby improving the cleaning effect than the conventional cleaning apparatus. You can get it.

While specific embodiments of the present invention have been described and illustrated above, it will be apparent that the present invention may be embodied in various modifications by those skilled in the art.

Such modified embodiments should not be understood individually from the technical idea or point of view of the present invention and such modified embodiments should fall within the scope of the appended claims of the present invention.

As described in detail above, in the multi-oscillation ultrasonic cleaning device according to the present invention, the diaphragm is not only vibrated indirectly by being mounted at the lower end of the internal cleaning tank but also directly mounted on the side end of the internal cleaning tank and vibrated, thereby providing a wafer provided in the internal cleaning tank. The cleaning effect of is maximized.

Claims (2)

An outer container having a first diaphragm mounted on an outer bottom surface thereof; An inner cleaning tank accommodated in the outer container and containing a cleaning liquid containing a wafer therein; A pair of second diaphragms mounted on both outer walls of the inner cleaning tank, The first and second diaphragms are controlled by different ultrasonic generators to transmit vibrations of different magnitudes to the cleaning liquid. The ultrasonic wave cleaning apparatus of claim 1, wherein the first and second diaphragms are made of stainless steel.

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