KR100216119B1 - Multipot type semiconductor plastic molding device - Google Patents

Abstract

The present invention relates to a molding apparatus in which a molding compound is injected into a cavity formed by joining an upper mold and a lower mold to form a wire-bonded lead frame into a completed semiconductor package, and a plurality of ports, plungers, and curls corresponding to each other are formed for each chase. By reducing the air remaining in the runner of the center block, and reducing defects such as voids and blisters in the semiconductor package, and multi-port type to reduce the wear of the port and plunger A semiconductor plastic molding apparatus.

The present invention comprises a runner for guiding the molding compound to a cavity among the upper mold and the lower mold and a curler for dispensing the molding compound with the runner, which is composed of the upper mold on the fixed side and the lower mold on the movable side. A semiconductor plastic molding apparatus comprising a port into which a molding compound is injected into a curl into another mold, and a plunger pressurizing a molding compound loaded into the port, wherein the port, the plunger and the curl are formed of a plurality of semiconductor plastics corresponding to each other. Provide a molding device.

Description

Multi pot semiconductor plastic molding device

The present invention relates to a multi-port type semiconductor plastic molding apparatus, and more particularly, to a molding apparatus for molding a wire bonded lead frame into a completed semiconductor package by injecting a molding compound into a cavity formed by combining an upper mold and a lower mold. By providing a plurality of ports, plungers and curls corresponding to each chase, air remaining in the runner of the center block can be reduced, and defects such as voids and blisters in the semiconductor package can be reduced. The present invention relates to a multi-port type semiconductor plastic molding device capable of reducing wear of ports and plungers.

In general, in a semiconductor package manufacturing process, a molding compound is coated on a lead frame by a semiconductor plastic molding apparatus after the semiconductor chip is wire bonded to the lead frame.

The main components of the molding compound are resins, which are chemically combined with curing agents to form thermosets, and most of the molding compound, the filler material made of materials such as glass and silicon, and the color of the molding compound. It is composed of dye (dye), a fire retardant for controlling the speed of the chemical reaction, a release agent for preventing sticking to the upper and lower molds during molding.

As shown in FIGS. 1 and 2, the conventional semiconductor plastic molding apparatus is provided on the upper mold 130 installed at the lower end of the upper mold base 120 on the fixed side and on the upper side of the lower mold base 140 on the movable side. It consists of the lower mold 150.

The lower mold 150 includes a runner 155 for guiding the molding compound to the cavity and a curl 152 for dispensing the molding compound to the runner 155, and the upper mold 130 is provided with the curl 152. A port 132 into which the molding compound is injected is provided, and a plunger 170 for pressing the molding compound loaded in the port 132 is provided. That is, the plunger 170 for pressing the molding compound is provided so as to descend from the upper side of the upper mold 130.

Looking at the configuration of the semiconductor plastic molding device in more detail, the lower mold 150 installed on the upper side of the lower mold base 140, which is conveyed up and down by hydraulic means, the lower center block 151 is located at the center of the center. Chase blocks 153 are provided on both sides of the block 151.

Curl 152 is formed in the center of the lower center block 151 to distribute molding compound to each runner 155, and molding compound can flow from the curl 152 toward each chase block 153. The runner 155 is recessed so that it may be.

In the upper mold 130 installed below the upper mold base 120 that is fixed, the upper center block 131 is positioned at the center, and the chase block 133 is formed on both sides of the center block 131.

The center of the upper center block 131 is provided with a port 132 into which the molding compound is injected and a plunger 170 for pressing the molding compound loaded in the port 132 and flowing it to the runner along the curl.

The operation of the conventional semiconductor plastic molding apparatus having such a configuration is as follows.

First, when the molding compound is injected into the molding apparatus for each step, as shown in FIGS. 3A and 3B, the molding compound preheated to a temperature of about 85 to 95 ° C. in the preheater is inserted into a port of the molding apparatus. do.

That is, a lead frame in which wire bonding is completed with a semiconductor chip is placed in the cavity of the lower mold 150 of the semiconductor plastic molding device, and the lower mold 150 on the movable side is provided to the hydraulic means. It is transferred to the upper side by the upper mold 130 to be combined.

After inserting the preheated molding compound having the predetermined weight and diameter into the cylindrical port 132, the plunger 170 is transferred from the upper side to the lower side to apply pressure to the preheated molding compound.

Thus, the molding compound melted under high temperature and pressure treatment is distributed from the curl 152 of the center block 151 to the plurality of runners 155 and then flows into the cavities of the respective chase blocks 133 and 153. It will be filled.

That is, the flowable molding compound passes through a plurality of runners 155 symmetrically provided in the traveling direction, and flows into the chase blocks 133 and 153 connected to the stems of each runner 155 and flows into the respective cavities.

Thus, the molding compound is filled in the wire bonded lead frames placed in the respective cavities, and after the filling is completed, the semiconductor plastic molding device is left for a predetermined time to harden the liquid molding compound to change to a solid state. The semiconductor package is completed.

However, in the conventional semiconductor plastic molding device, the air remaining in the runner is introduced into the cavity of each chase block along with the flow of the molding compound during molding, so that semiconductor defects such as voids, blisters and wire sweeps are applied to the semiconductor package. This is likely to occur, and the precise balance flow design of the runner in the center block is not possible, and thus, the molding compound has a different time to reach the runner of each chase block, which adversely affects the quality.

In addition, the residue adhering to the inner wall of the port wall is placed in the lower part of the compound as the compound is injected into the port, and the residue located at the lower part of the compound first flows into the cavity through the runner to block the passage of the runner and is incomplete. Will result in charging.

In addition, since the residue of the molding compound remaining in the center block after molding is left in proportion to the size of the center block, it causes the waste of the molding compound, and in order to load the molding compound into the port, it is necessary to load the plunger after discharging from the port. Due to the longer stroke length of the plunger flowing in the port to facilitate the wear of the port and plunger, when the center block is worn, there is a problem that the entire center block must be replaced because it consists of a single piece.

The present invention for solving the above problems is provided with a molding compound and the air remaining in the runner of the center block by having a plurality of ports, plungers and curl corresponding to each chase block in the molding device consisting of the upper mold and the lower mold Prevents inflow together, enables accurate balance flow design, reduces residues of molding compound remaining in the center block after molding, and only blocks that are subject to wear of curl blocks, port blocks or end key blocks Its purpose is to prevent semiconductor defects and reduce costs by separating and exchanging them.

The present invention for achieving the above object is composed of an upper mold installed on the lower end of the upper mold base on the fixed side, and a lower mold installed on the upper side of the lower mold base on the movable side to form a cavity when joined with the upper mold. And a runner for guiding molding compound to the cavity in one of the upper mold and the lower mold, and a curl for dispensing the molding compound into the runner, and a molding compound injected into the curl in the other mold. A semiconductor plastic molding apparatus having a plunger for pressing a molding compound loaded in the port, wherein the port, the plunger and the curl have a plurality of semiconductor plastic molding apparatuses corresponding to each other.

1 is a front sectional view showing a conventional semiconductor plastic molding device,

2 is an exploded perspective view showing an exploded state of a conventional upper and lower molds,

3a and 3b is a view showing a state in which the molding compound is mounted on the port of the conventional molding apparatus,

Figure 4 is a front sectional view showing a multi-port type semiconductor plastic molding device according to an embodiment of the present invention,

Figure 5a is a plan view showing an upper mold according to an embodiment of the present invention,

Figure 5b is a plan view showing a lower mold according to an embodiment of the present invention,

6 is an enlarged cross-sectional view showing the main part of the present invention;

7a and 7b is a view showing a state in which the molding compound is mounted on the port of the molding apparatus of the present invention,

8A is a plan view showing an upper mold according to another embodiment of the present invention;

Figure 8b is a plan view showing a lower mold according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

20: upper mold base 30: upper mold

31: upper center block 31a: curl block

32: Curl 33: Chase Block

35: upper end key block 35a: position pin

36: runner 40: lower mold base

50: lower mold 51: lower center block

51a: port block 52: port

53: lower chase block 55: lower end key block

55a: positioning groove 60: plunger

80: transfer plate 81: plunger holder

Hereinafter, preferred embodiments of the present invention will be described with reference to the illustrated drawings.

In the multi-port type semiconductor plastic molding apparatus according to an embodiment of the present invention, as shown in FIGS. 4, 5A, 5B, and 6, the upper mold 30 installed at the lower end of the upper mold base 20 on the fixed side is shown. ) And a lower mold 50 installed at the upper end of the lower mold base 40 on the movable side to form a cavity when the upper mold 30 is combined with the upper mold 30, and the upper mold 30 is melted with a cavity. A runner 36 for guiding the molded molding compound and a curl 32 for dispensing the molding compound to the runner 36 are provided, and the lower mold 50 has a port 52 into which the molding compound is injected into the curl 32. ) And a plunger 60 pressurizing the molding compound loaded in the port 52, and a port 52, a plunger 60 and a curl 32 corresponding to each chase block 33, 53 are provided. Many are installed.

Looking at the semiconductor plastic molding apparatus of the present invention in more detail, the lower mold 50 provided on the upper side of the lower mold base 40, which is the movable side, has a port block having a port 52 corresponding to the curl 32. It consists of a lower end key block 55 having both sides 51a) and a runner 56, and a lower chase block 53 having a plurality of cavities. In addition, a plurality of port blocks 51a are provided on the upper side of the lower center block 51 so that they can be assembled.

That is, a plurality of port blocks 51a are positioned on the upper side of the lower center block 51 in the center, and the lower chase blocks 53 are formed on the side surfaces of the port blocks 51a, and the port blocks 51a and the lower sides are formed. The lower end key block 55 is located between the chase blocks 53. In the center of the port block 51a, there is provided a port 52 into which the molding compound is injected and a plunger 60 for pressing the molding compound loaded in the port 52.

The port block 51a of the lower mold 50 is provided with a plurality of ports 52 and corresponding plungers 60, and the plunger 60 has a transfer plate located below the lower mold base 40. 80).

That is, the plurality of plungers 60 are installed through the plunger holder 81 at the corresponding position of each port 52 toward the upper end of the conveying plate 80, and the conveying plate 80 is provided with hydraulic means provided at both sides. It is moved up and down by the operation.

The upper mold 30 installed below the upper mold base 20, which is a fixed side, includes an upper end key block 35 having a curl block 31a having a curl 32 and at least one runner 36. And an upper chase block 33 having a cavity. In addition, a plurality of curl blocks 31a are provided in the lower side of the upper center block 31 so that assembly is possible.

That is, a plurality of curl blocks 31a are positioned above the center block 31 in the center, and upper chase blocks 33 are formed on both sides of the curl blocks 31a, and the curl blocks 31a and the upper chase blocks are formed. The upper end key block 35 is located between the 33.

A curl 32 for dispensing the molding compound is formed in the center of the curl block 31a, and a runner 36 for flowing the molding compound distributed to the upper chase block 33 is formed in the upper end key block 35. Indentation is formed.

Referring to the operation of the multi-port semiconductor plastic molding apparatus according to an embodiment of the present invention having such a configuration as follows.

First, the molding compound injected into the semiconductor plastic molding device is preheated to a temperature of about 85 to 95 ° C. in the preheater. Inside the cavity of the lower mold 50 of the semiconductor plastic molding device, a lead frame in which the semiconductor chips and wire bonding are completed is placed, and the lower mold 50 on the movable side is transferred upward by hydraulic means to be combined with the upper mold 30. Will be.

At this time, the position pin 35a formed in the end key block 35 of the upper mold 30 and the position groove 55a formed in the end key block 55 of the lower mold 50 are coupled to each other. The lower mold 50 is to be accurately molded.

In detail, the preheated molding compound is inserted into the port 52 of the lower mold 50 to be mounted on the top of the plunger 60, as shown in FIG. 7A. At this time, since the loading position of the molding compound loaded in the port 52 is relatively low, it is possible to easily check the loading state of the molding compound.

After the molding compound is loaded in the port 52, as shown in FIG. 7B, the lower mold 50 is transferred upward to form the lower mold 50 and the upper mold 30, and the plunger 60. Is transferred from bottom to top to apply pressure to the preheated molding compound.

The molten molding compound applied with pressure is distributed from the curl 32 of the curl block 31a to the runner 36 to be directly filled in the cavity of each chase block 33.

That is, the flowable molding compound passes through the runner 36 provided in the traveling direction, and flows into the chase block connected to the stem of the runner 36 and flows into each cavity to be filled.

Accordingly, the molding compound is filled in the wire-bonded lead frames placed in the respective cavities. After filling is completed, the semiconductor plastic molding device is left for a predetermined time to harden the liquid molding compound and change to a solid state. The semiconductor package is completed.

In the multi-port type semiconductor plastic molding apparatus according to another embodiment of the present invention, as shown in FIGS. 8A and 8B, the main configuration is the same as the embodiment of the present invention, but the number of ports 52 is the number of chase blocks 33 and 53 There is a feature installed by the number corresponding to each runner (36,56) of.

That is, the port 52 and the plunger 60 and toward the respective runners 36 and 56 of the chase blocks 33 and 53 to supply the amount of molding compound corresponding thereto when the volume of the semiconductor package to be manufactured is large. The curl 32 is indented.

The molten molding compound melted in the state in which the upper mold 30 and the lower mold 50 are joined together through the runners 33 and 56 at the port 52 by the respective plungers 60 which are conveyed upward. 33, 53) to be filled.

Therefore, the semiconductor plastic molding device having such a configuration reduces the air remaining in the runner to the maximum, thereby preventing air from flowing into the cavity of each chase block along with the flow of the molding compound during the molding process. The time to reach the runner becomes the same.

In addition, the residue of the molding compound remaining in the center block after molding is also reduced by reducing the length and width of the runner, and only the corresponding block is replaced from the center block when the curl block and the port block are worn out.

As described above, the present invention has a plurality of ports corresponding to each chase block, a plunger and a curl in a molding device consisting of an upper mold and a lower mold so that the air remaining in the runner of the center block is introduced together with the molding compound. To prevent semiconductor defects such as voids and blisters.

In addition, the accurate balance flow design of the runner through which the molding compound flows is possible, and thus, the overall molding compound curing speed is similar, thereby obtaining a high quality semiconductor package.

When the molding compound is loaded, the residue formed on the inner circumferential surface of the pot is located at the lower part of the molding compound to be loaded and remains in the curl after molding, so that the residue of the molding compound formed during the previous work flows into the runner and the cavity and becomes a semiconductor defect. Will be prevented.

In addition, it reduces the residue of molding compound remaining in the center block after molding to prevent waste of molding compound, and when the runner, which is a passage through which high temperature and high pressure molding compound flows, wears a corresponding curl block or port block. Alternatively, the end key block can be separated and exchanged separately from the center block, thereby reducing the cost.

The present invention as described above is capable of various modifications and changes by those skilled in the art through the detailed description and drawings of the invention within the scope without departing from the spirit and scope described in the appended claims. Will do.

Claims (13)

An upper mold provided at a lower end of the upper mold base on the fixed side, and a lower mold provided on the upper end of the lower mold base on the movable side to form a cavity when being combined with the upper mold, wherein the upper mold and the lower mold And a runner for guiding the molding compound to the cavity in one mold and a curl for dispensing the molding compound with the runner, and pressing a molding compound into which the molding compound is injected into the curl and a molding compound loaded in the port. A semiconductor plastic molding apparatus having a plunger flowing through the curl to a runner, wherein the port, the plunger and the curl are formed in plural numbers corresponding to each other. The semiconductor plastic molding apparatus according to claim 1, wherein the one mold comprises a curl block having the curl at both sides, an end key block having the runner, and a chase block having the cavity. 2. The semiconductor plastic molding apparatus according to claim 1, wherein the other mold comprises a port block having the port corresponding to the curl, an end key block having the runner, and a chase block having the cavity. The semiconductor plastic molding of claim 2, wherein a location pin is protruded from an end key block of the one mold, and a location groove coupled to the location pin is formed in the end key block of the other mold. Device. An upper mold installed at the lower end of the upper mold base on the fixed side and a lower mold installed on the upper side of the lower mold base on the movable side to form a cavity when being combined with the upper mold to guide the molding compound to the cavity. A runner formed at a portion where the upper mold and the lower mold contact each other, a curl for dispensing the molding compound to the runner, a port for injecting molding compound into the curl, and a molding compound loaded in the port to pressurize the curler through the curl A semiconductor plastic molding apparatus having a plunger for flowing to a runner, wherein the port and the plunger are provided in a plurality of the lower mold, and the curl is provided in a plurality of the upper mold corresponding to the port and the plunger. Semiconductor plastic molding device characterized in that. 6. The apparatus of claim 5, wherein the curl is provided in at least one curl block. The apparatus of claim 6, wherein the curl block is supported by an upper center block and installed in the upper mold. 6. The semiconductor plastic molding apparatus according to claim 5, wherein one or more runners are provided in the plurality of enter key blocks. The semiconductor plastic molding apparatus according to claim 8, wherein a location pin is protruded from an end key block of the upper mold, and a location groove is formed in the end key block of the lower mold. 6. The apparatus of claim 5, wherein at least one port is provided in the plurality of port blocks. The apparatus of claim 10, wherein the port block is supported by a lower center block and installed in the lower mold. 6. The apparatus of claim 5, wherein the upper mold is comprised of a curl block with the curl, an end key block with the runner, and a chase block with the cavity. 6. The apparatus of claim 5, wherein the lower mold includes a center block having the port corresponding to the curl, an end key block having the runner, and a chase block having the cavity.

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