KR100212409B1 - 수직 및 수평 절연 게이트, 전계 효과 트랜지스터 및 그 제조방법 - Google Patents
수직 및 수평 절연 게이트, 전계 효과 트랜지스터 및 그 제조방법 Download PDFInfo
- Publication number
- KR100212409B1 KR100212409B1 KR1019910020685A KR910020685A KR100212409B1 KR 100212409 B1 KR100212409 B1 KR 100212409B1 KR 1019910020685 A KR1019910020685 A KR 1019910020685A KR 910020685 A KR910020685 A KR 910020685A KR 100212409 B1 KR100212409 B1 KR 100212409B1
- Authority
- KR
- South Korea
- Prior art keywords
- region
- conductivity type
- tank
- gate
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
- H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6349—Deposition of epitaxial materials
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US61785090A | 1990-11-21 | 1990-11-21 | |
| US617,850 | 1990-11-21 | ||
| US61827990A | 1990-11-23 | 1990-11-23 | |
| US61827390A | 1990-11-23 | 1990-11-23 | |
| US61835390A | 1990-11-23 | 1990-11-23 | |
| US618,279 | 1990-11-23 | ||
| US618,353 | 1990-11-23 | ||
| US618,273 | 1990-11-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR920010881A KR920010881A (ko) | 1992-06-27 |
| KR100212409B1 true KR100212409B1 (ko) | 1999-08-02 |
Family
ID=27505142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910020685A Expired - Fee Related KR100212409B1 (ko) | 1990-11-21 | 1991-11-20 | 수직 및 수평 절연 게이트, 전계 효과 트랜지스터 및 그 제조방법 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH06112416A (enExample) |
| KR (1) | KR100212409B1 (enExample) |
| TW (1) | TW230823B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100875801B1 (ko) * | 2005-12-30 | 2008-12-26 | 우 옵트로닉스 코포레이션 | 액정 디스플레이 장치의 바닥 기판을 제조하는 방법 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100487515B1 (ko) * | 1998-08-17 | 2005-07-07 | 삼성전자주식회사 | 이이피롬 장치의 제조 방법 |
| US20150048875A1 (en) * | 2013-08-19 | 2015-02-19 | Ememory Technology Inc. | High voltage power control system |
-
1991
- 1991-11-20 KR KR1019910020685A patent/KR100212409B1/ko not_active Expired - Fee Related
- 1991-11-21 JP JP3306372A patent/JPH06112416A/ja active Pending
-
1992
- 1992-07-14 TW TW081105560A patent/TW230823B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100875801B1 (ko) * | 2005-12-30 | 2008-12-26 | 우 옵트로닉스 코포레이션 | 액정 디스플레이 장치의 바닥 기판을 제조하는 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06112416A (ja) | 1994-04-22 |
| TW230823B (enExample) | 1994-09-21 |
| KR920010881A (ko) | 1992-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100212408B1 (ko) | 절연 게이트 전계 효과 트랜지스터 및 그 제조 방법 | |
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| US5355007A (en) | Devices for non-volatile memory, systems and methods | |
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| EP1142014B1 (en) | A method of manufacturing a peripheral transistor of a non-volatile memory | |
| KR100195678B1 (ko) | 반도체 메모리 장치 및 그 제조 방법 | |
| US6043543A (en) | Read-only memory cell configuration with trench MOS transistor and widened drain region | |
| US5930613A (en) | Method of making EPROM in high density CMOS having metallization capacitor | |
| JP2876974B2 (ja) | 不揮発性半導体記憶装置及びその製造方法 | |
| JPH06112416A (ja) | 集積回路 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
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| PG1601 | Publication of registration |
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| FPAY | Annual fee payment |
Payment date: 20040412 Year of fee payment: 6 |
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| PR1001 | Payment of annual fee |
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| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20050511 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20050511 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |