KR100200289B1 - 자체 배치형 반도체 집적회로장치 및 배선회로기판의 조합체 - Google Patents

자체 배치형 반도체 집적회로장치 및 배선회로기판의 조합체 Download PDF

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Publication number
KR100200289B1
KR100200289B1 KR1019940023481A KR19940023481A KR100200289B1 KR 100200289 B1 KR100200289 B1 KR 100200289B1 KR 1019940023481 A KR1019940023481 A KR 1019940023481A KR 19940023481 A KR19940023481 A KR 19940023481A KR 100200289 B1 KR100200289 B1 KR 100200289B1
Authority
KR
South Korea
Prior art keywords
package
circuit board
integrated circuit
terminal
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940023481A
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English (en)
Korean (ko)
Other versions
KR950010031A (ko
Inventor
히데아키 고즈루
Original Assignee
우에시마 세이스케
야마하 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5255177A external-priority patent/JPH0786449A/ja
Priority claimed from JP25517893A external-priority patent/JP3348485B2/ja
Application filed by 우에시마 세이스케, 야마하 가부시키가이샤 filed Critical 우에시마 세이스케
Publication of KR950010031A publication Critical patent/KR950010031A/ko
Application granted granted Critical
Publication of KR100200289B1 publication Critical patent/KR100200289B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
KR1019940023481A 1993-09-14 1994-09-16 자체 배치형 반도체 집적회로장치 및 배선회로기판의 조합체 Expired - Fee Related KR100200289B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP93-255177 1993-09-14
JP93-255178 1993-09-17
JP5255177A JPH0786449A (ja) 1993-09-17 1993-09-17 半導体装置と実装基板
JP25517893A JP3348485B2 (ja) 1993-09-17 1993-09-17 半導体装置と実装基板

Publications (2)

Publication Number Publication Date
KR950010031A KR950010031A (ko) 1995-04-26
KR100200289B1 true KR100200289B1 (ko) 1999-06-15

Family

ID=26542063

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940023481A Expired - Fee Related KR100200289B1 (ko) 1993-09-14 1994-09-16 자체 배치형 반도체 집적회로장치 및 배선회로기판의 조합체

Country Status (2)

Country Link
KR (1) KR100200289B1 (enExample)
TW (1) TW259892B (enExample)

Also Published As

Publication number Publication date
KR950010031A (ko) 1995-04-26
TW259892B (enExample) 1995-10-11

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