KR100200289B1 - 자체 배치형 반도체 집적회로장치 및 배선회로기판의 조합체 - Google Patents
자체 배치형 반도체 집적회로장치 및 배선회로기판의 조합체 Download PDFInfo
- Publication number
- KR100200289B1 KR100200289B1 KR1019940023481A KR19940023481A KR100200289B1 KR 100200289 B1 KR100200289 B1 KR 100200289B1 KR 1019940023481 A KR1019940023481 A KR 1019940023481A KR 19940023481 A KR19940023481 A KR 19940023481A KR 100200289 B1 KR100200289 B1 KR 100200289B1
- Authority
- KR
- South Korea
- Prior art keywords
- package
- circuit board
- integrated circuit
- terminal
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP93-255177 | 1993-09-14 | ||
| JP93-255178 | 1993-09-17 | ||
| JP5255177A JPH0786449A (ja) | 1993-09-17 | 1993-09-17 | 半導体装置と実装基板 |
| JP25517893A JP3348485B2 (ja) | 1993-09-17 | 1993-09-17 | 半導体装置と実装基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950010031A KR950010031A (ko) | 1995-04-26 |
| KR100200289B1 true KR100200289B1 (ko) | 1999-06-15 |
Family
ID=26542063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940023481A Expired - Fee Related KR100200289B1 (ko) | 1993-09-14 | 1994-09-16 | 자체 배치형 반도체 집적회로장치 및 배선회로기판의 조합체 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100200289B1 (enExample) |
| TW (1) | TW259892B (enExample) |
-
1994
- 1994-09-13 TW TW083108452A patent/TW259892B/zh not_active IP Right Cessation
- 1994-09-16 KR KR1019940023481A patent/KR100200289B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR950010031A (ko) | 1995-04-26 |
| TW259892B (enExample) | 1995-10-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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St.27 status event code: U-3-3-T10-T11-oth-X000 |
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St.27 status event code: U-3-3-T10-T11-oth-X000 |
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St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
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St.27 status event code: A-5-5-R10-R17-oth-X000 |
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Payment date: 20080225 Year of fee payment: 10 |
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