KR0181951B1 - A fluxless soldering process - Google Patents

A fluxless soldering process

Info

Publication number
KR0181951B1
KR0181951B1 KR1019910701117A KR910701117A KR0181951B1 KR 0181951 B1 KR0181951 B1 KR 0181951B1 KR 1019910701117 A KR1019910701117 A KR 1019910701117A KR 910701117 A KR910701117 A KR 910701117A KR 0181951 B1 KR0181951 B1 KR 0181951B1
Authority
KR
South Korea
Prior art keywords
soldering process
fluxless soldering
fluxless
soldering
Prior art date
Application number
KR1019910701117A
Other languages
English (en)
Inventor
Giora Dishon
Stephen Michael Bobbio
Original Assignee
Mcnc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23262749&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR0181951(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mcnc filed Critical Mcnc
Application granted granted Critical
Publication of KR0181951B1 publication Critical patent/KR0181951B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Laser Beam Processing (AREA)
  • Arc Welding In General (AREA)
KR1019910701117A 1989-03-15 1991-09-14 A fluxless soldering process KR0181951B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/324,247 US4921157A (en) 1989-03-15 1989-03-15 Fluxless soldering process

Publications (1)

Publication Number Publication Date
KR0181951B1 true KR0181951B1 (en) 1999-05-01

Family

ID=23262749

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701117A KR0181951B1 (en) 1989-03-15 1991-09-14 A fluxless soldering process

Country Status (11)

Country Link
US (1) US4921157A (ko)
EP (1) EP0463098B1 (ko)
JP (1) JP2527278B2 (ko)
KR (1) KR0181951B1 (ko)
AU (1) AU634441B2 (ko)
CA (1) CA2011888C (ko)
DE (1) DE69005104T2 (ko)
ES (1) ES2049471T3 (ko)
HK (1) HK45894A (ko)
MY (1) MY106703A (ko)
WO (1) WO1990010518A1 (ko)

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JPH09233862A (ja) * 1995-12-18 1997-09-05 Seiko Epson Corp 圧電体を用いた発電方法、発電装置および電子機器
US5918794A (en) * 1995-12-28 1999-07-06 Lucent Technologies Inc. Solder bonding of dense arrays of microminiature contact pads
JPH09312545A (ja) 1996-03-18 1997-12-02 Seiko Epson Corp 圧電素子、その製造方法、及び圧電振動片のマウント装置
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US5899737A (en) * 1996-09-20 1999-05-04 Lsi Logic Corporation Fluxless solder ball attachment process
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
SE508596C2 (sv) * 1996-11-13 1998-10-19 Aga Ab Förfarande för hårdlödning medelst plasma
US5902686A (en) * 1996-11-21 1999-05-11 Mcnc Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures
US6013381A (en) * 1996-12-06 2000-01-11 Mcnc Fluorinated fluxless soldering
US5776551A (en) * 1996-12-23 1998-07-07 Lsi Logic Corporation Use of plasma activated NF3 to clean solder bumps on a device
JP3557845B2 (ja) * 1997-04-15 2004-08-25 セイコーエプソン株式会社 ロウまたはハンダ材料
JPH1112716A (ja) 1997-06-19 1999-01-19 Seiko Epson Corp ロウ接用材料およびその製造方法
JP3420917B2 (ja) * 1997-09-08 2003-06-30 富士通株式会社 半導体装置
US5961031A (en) * 1997-11-21 1999-10-05 The University Of North Carolina At Charlotte Method and apparatus for forming hydrogen fluoride
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US6250540B1 (en) * 1999-04-30 2001-06-26 International Business Machines Corporation Fluxless joining process for enriched solders
FR2781706B1 (fr) * 1998-07-30 2000-08-25 Air Liquide Procede de brasage par refusion de composants electroniques et dispositif de brasage pour la mise en oeuvre d'un tel procede
US6742701B2 (en) * 1998-09-17 2004-06-01 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
US6605175B1 (en) * 1999-02-19 2003-08-12 Unaxis Balzers Aktiengesellschaft Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber
US6219910B1 (en) * 1999-03-05 2001-04-24 Intel Corporation Method for cutting integrated circuit dies from a wafer which contains a plurality of solder bumps
US6092714A (en) * 1999-03-16 2000-07-25 Mcms, Inc. Method of utilizing a plasma gas mixture containing argon and CF4 to clean and coat a conductor
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US6931723B1 (en) * 2000-09-19 2005-08-23 International Business Machines Corporation Organic dielectric electronic interconnect structures and method for making
US7098072B2 (en) * 2002-03-01 2006-08-29 Agng, Llc Fluxless assembly of chip size semiconductor packages
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Also Published As

Publication number Publication date
CA2011888C (en) 1995-06-13
DE69005104T2 (de) 1994-07-07
WO1990010518A1 (en) 1990-09-20
JP2527278B2 (ja) 1996-08-21
HK45894A (en) 1994-05-20
EP0463098A1 (en) 1992-01-02
EP0463098B1 (en) 1993-12-08
AU5349890A (en) 1990-10-09
ES2049471T3 (es) 1994-04-16
MY106703A (en) 1995-07-31
CA2011888A1 (en) 1990-09-15
DE69005104D1 (de) 1994-01-20
JPH05500026A (ja) 1993-01-14
AU634441B2 (en) 1993-02-18
US4921157A (en) 1990-05-01

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Legal Events

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee