KR0167305B1 - Loading/unloading method of semiconductor wafer - Google Patents
Loading/unloading method of semiconductor wafer Download PDFInfo
- Publication number
- KR0167305B1 KR0167305B1 KR1019950070173A KR19950070173A KR0167305B1 KR 0167305 B1 KR0167305 B1 KR 0167305B1 KR 1019950070173 A KR1019950070173 A KR 1019950070173A KR 19950070173 A KR19950070173 A KR 19950070173A KR 0167305 B1 KR0167305 B1 KR 0167305B1
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- wafer
- unloading
- cassette
- loading
- semiconductor wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 반도체 웨이퍼의 로딩/언로딩 방법에 관한 것으로, 종래의 웨이퍼의 로딩/언로딩 동작은 로보트의 아암(3)이 위치하는 웨이퍼(W)의 하면부위가 그 아래에 위치한 웨이퍼의 상측이므로 아암(3)의 동작시에 파티클이 발생되거나, 하측에 위치한 웨이퍼의 상면에 스크래치가 발생되는 등의 문제가 있는 바, 웨이퍼가 수납되어 있는 카세트를 장치에 장착하는 단계와; 로보트 아암이 최하측에 수납된 웨이퍼부터 로딩하여 공정을 수행하는 로딩 단계와; 공정이 완료된 웨이퍼를 상면이 하측으로 향하도록 뒤집어서 카세트에 언로딩하는 언로딩 단계와; 상기 로딩 및 언로딩 단계를 반복하여 실시하는 단계와; 카세트에 수납되어 있는 모든 웨이퍼의 공정이 완료된 후 카세트를 뒤집어서 다음 공정으로 운반하는 단계의 순서로 수행함을 특징으로 하는 반도체 웨이퍼의로딩/언로딩 방법을 제공하여 공정상의 웨이퍼 불량을 완전히 배제하도록 한 것이다.The present invention relates to a method of loading / unloading a semiconductor wafer. In the conventional loading / unloading operation of a wafer, since the lower surface of the wafer W on which the arm 3 of the robot is located is the upper side of the wafer located below it, Mounting a cassette in which the wafer is stored in the apparatus, as there is a problem that particles are generated during operation of the arm 3 or scratches are generated on the upper surface of the lower wafer; A loading step in which a robot arm is loaded from a wafer accommodated at the lowermost side to perform a process; An unloading step of flipping the wafer on which the process is completed so that the top surface faces downward and unloading the cassette; Repeating the loading and unloading steps; After the processing of all wafers stored in the cassette is completed, the wafer is loaded / unloaded in a sequence of inverting and transferring the cassette to the next process, thereby completely eliminating wafer defects in the process. .
Description
제1도는 일반적인 반도체 웨이퍼의 로딩/언로딩 방법의 설명도.1 is an explanatory diagram of a loading / unloading method of a general semiconductor wafer.
제2도는 반도체 웨이퍼 수납용 카세트의 정면도.2 is a front view of a cassette for semiconductor wafer storage.
제3도는 본 발명에 의한 반도체 웨이퍼의 로딩/언로딩 방법의 설명도.3 is an explanatory diagram of a method of loading / unloading a semiconductor wafer according to the present invention.
제4도는 본 발명에 적용된 웨이퍼 수납용 카세트의 정면도.4 is a front view of a wafer storage cassette applied to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 공정 장치 2 : 카세트1: process equipment 2: cassette
3 : 로버트 아암 4 : 플립부3: Robert Arm 4: Flip
W : 웨이퍼W: Wafer
본 발명은 반도체 웨이퍼의 로딩/언로딩 방법에 관한 것으로, 특히 카세트에 웨이퍼를 로딩/언로딩하는 과정에서 디바이스가 형성된 웨이퍼의 상면에 손상이 발생되는 것을 방지하도록 한 반도체 웨이퍼의 로딩/언로딩 방법에 관한 것이다.The present invention relates to a method of loading / unloading a semiconductor wafer, and more particularly, to a method of loading / unloading a semiconductor wafer to prevent damage to an upper surface of a wafer on which a device is formed during a process of loading / unloading a wafer into a cassette. It is about.
일반적으로 반도체 웨이퍼의 로딩/언로딩 동작을 제1도를 참조하여 설명하면, 제2도에 도시한 웨이퍼 수납용 카세트(2)를 장치(1)에 장칙하고, 로보트 아암(3)을 사용하여 웨이퍼(W)를 로딩시키며, 공정완료 후 디바이스가 구성된 웨이퍼의 상면이 위로 향한 상태에서 웨이퍼(W)를 언로딩시킨다.In general, the loading / unloading operation of the semiconductor wafer will be described with reference to FIG. 1, and the wafer holding cassette 2 shown in FIG. 2 is mounted on the apparatus 1, and the robot arm 3 is used. The wafer W is loaded, and the wafer W is unloaded after the process is completed with the top surface of the wafer on which the device is configured.
이와 같은 동작이 각가의 웨이퍼에서 수행되어 모든 웨이퍼가 공정이 완료되면 장치(1)가 장착되었던 카세트(2)를 그대로 꺼내고, 다음 카세트를 장치에 장착하게 되는 것이다.This operation is performed on each wafer, and when all wafers have been processed, the cassette 2 on which the apparatus 1 is mounted is taken out as it is, and the next cassette is mounted in the apparatus.
그러나 상기한 바와 같은 종래의 웨이퍼의 로딩/언로딩 동작은 로보트의 아암(3)이 위치하는 웨이퍼(W)의 하면부위가 그 아래에 위치한 웨이퍼의 상측으므로 아암(3)의 동작시에 파티클이 발생되거나, 하측에 위치한 웨이퍼의 상면에 스크래치가 발생되는 등의 문제가 있다.However, in the conventional wafer loading / unloading operation as described above, since the lower surface portion of the wafer W on which the arm 3 of the robot is located is the upper side of the wafer located below it, the particles are removed during the operation of the arm 3. Or scratches on the upper surface of the lower wafer.
이와 같은 문제점을 감안하여 안출한 본 발명이 목적은 로딩/언로딩 동작시에 로보트 아암의 하측에 위치한 웨이퍼가 손상되는 것을 방지하려는 것이다.The present invention devised in view of such a problem is to prevent the wafer located under the robot arm from being damaged during the loading / unloading operation.
이러한 본 발명의 목적을 달성하기 위하여, 웨이퍼가 수납되어 있는 카세트를 장치에 장착하는 단계와; 로보트 아암이 최하측에 수납된 웨이퍼부터 로딩하여 공정을 수행하는 로딩 단계와; 공정이 완료된 웨이퍼를 상면이 하측으로 향하도록 뒤집어서 카세트에 언로딩하는 언로딩 단계와; 상기 로딩 및 언로딩 단계를 반복하여 실시하는 단계와; 카세트에 수납되어 있는 모든 웨이퍼의 공정이 완료된 후 카세트를 뒤집어서 다음 공정으로 운반하는 단계의 순서로 수행함을 특징으로 하는 반도체 웨이퍼의 로딩/언로딩 방법이 제공된다.In order to achieve the object of the present invention, the step of mounting a cassette containing a wafer to the device; A loading step in which a robot arm is loaded from a wafer accommodated at the lowermost side to perform a process; An unloading step of flipping the wafer on which the process is completed so that the top surface faces downward and unloading the cassette; Repeating the loading and unloading steps; Provided is a method of loading / unloading a semiconductor wafer, which is performed in the order of inverting the cassette and carrying it to the next process after the processing of all the wafers stored in the cassette is completed.
이와같은 본 발명을 첨부도면을 참조하여 보다 상세히 설명한다.This invention will be described in more detail with reference to the accompanying drawings.
첨부도면 제3도는 본 발명에 의한 반도체 웨이퍼의 로딩/언로딩 방법의 설명도이고, 제4도는 본 발명에 적용된 웨이퍼 수납용 카세트의 정면도로서, 본 발명에는 에이퍼(W)를 뒤집기 위한 플립(FIip)부(4)가 마련되어 있고, 카세트(2)의 상부하부에는 카세트를 지지하는 H 바(Bar)(2a)가 구비되어 있다.FIG. 3 is an explanatory view of a method of loading / unloading a semiconductor wafer according to the present invention, and FIG. 4 is a front view of a wafer storage cassette applied to the present invention. FIip portion 4 is provided, and an upper bar lower portion of the cassette 2 is provided with an H bar 2a for supporting the cassette.
이와 같은 본 발명에서는 먼저, 웨이퍼(W)가 수납된 카세트를 장치에 장착하고,로보트 아암(3)을 사용하여 카세트(2)의 최하측에 수납된 웨이퍼(W)부터 하나의 웨이퍼씩 로딩하여 공정을 수행하며, 공정이 완료된 웨이퍼는 상기 플립부(4)에서 웨이퍼(W)를 뒤집어서 웨이퍼의 상면이 하측으로 향하도록 한 후 카세트에 언로딩한다.In the present invention, first, the cassette in which the wafers W are accommodated is mounted in the apparatus, and the wafers are loaded one by one from the wafers W stored at the bottom of the cassette 2 using the robot arm 3. The process is performed, and the wafer, which has been completed, is flipped over from the flip portion 4 so that the upper surface of the wafer faces downward, and then unloaded into the cassette.
이러한 동작을 최상측에 웨이퍼까지 동일하게 수행하여 카세트에 수납되어 있는 모든 웨이퍼의 공정이 완료된 후에는 카세트를 뒤집어서 다음 공정으로 운반한다.This operation is performed in the same manner to the wafer on the uppermost side, and after the processing of all the wafers stored in the cassette is completed, the cassette is turned over and transferred to the next process.
상기한 바와 같이 운용되는 본 발명에 의한 반도체 웨이퍼의 로딩/언로딩 방법은 로버트 아암의 최하측의 웨이퍼부터 로딩하여 공정완료후에 웨이퍼의 상면이 하측을 향하도록 뒤집어서 언로딩시키고, 바로 위의 웨이퍼를 동일한 동작으로 로딩/언로딩하게 되므로 로보트 아암이 이동되는 공간이 웨이퍼의 하면과 하면 사이가 되어 동작중 디바이스가 형성된 웨이퍼의 상면에 이물질이 떨어지거나, 웨이퍼가 긁히는 문제를 완전히 해소하게 되는 것이다.In the method of loading / unloading a semiconductor wafer according to the present invention, which is operated as described above, the wafer is loaded from the lowermost side of the Robert arm, and after the completion of the process, the wafer is turned upside down so that the upper surface thereof faces downward, and the wafer immediately above is loaded. Since the loading / unloading is performed in the same operation, the space where the robot arm is moved is between the lower surface and the lower surface of the wafer, thereby completely eliminating the problem of foreign matter falling on the upper surface of the wafer on which the device is formed or scratching the wafer.
이상에서 설명한 바와 같이, 본 발명에 의한 반도체 웨이퍼의 로딩/언로딩 방법은 웨이퍼의 로딩/언로딩 동작시 로보트 아암이 하측에 위치하는 웨이퍼의 상면에 손상을 가하는 것을 방지하도록 함으로써 공정상의 웨이퍼 불량을 완전히 배제하게 되는 효과가 있다.As described above, the semiconductor wafer loading / unloading method according to the present invention prevents the robot arm from damaging the upper surface of the wafer located at the lower side during wafer loading / unloading operation, thereby preventing wafer defects in the process. There is an effect that is completely excluded.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950070173A KR0167305B1 (en) | 1995-12-31 | 1995-12-31 | Loading/unloading method of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950070173A KR0167305B1 (en) | 1995-12-31 | 1995-12-31 | Loading/unloading method of semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970053352A KR970053352A (en) | 1997-07-31 |
| KR0167305B1 true KR0167305B1 (en) | 1999-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950070173A KR0167305B1 (en) | 1995-12-31 | 1995-12-31 | Loading/unloading method of semiconductor wafer |
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| KR (1) | KR0167305B1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100560817B1 (en) * | 2004-05-07 | 2006-03-13 | 삼성전자주식회사 | Method for confirming loaded/unloaded wafer state |
| WO2010033555A2 (en) | 2008-09-17 | 2010-03-25 | Engage Environments Llc | Adjustable bed skirt |
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1995
- 1995-12-31 KR KR1019950070173A patent/KR0167305B1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR970053352A (en) | 1997-07-31 |
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