KR0163553B1 - Method of arrangement for plastic packaged mold gate - Google Patents
Method of arrangement for plastic packaged mold gate Download PDFInfo
- Publication number
- KR0163553B1 KR0163553B1 KR1019910014079A KR910014079A KR0163553B1 KR 0163553 B1 KR0163553 B1 KR 0163553B1 KR 1019910014079 A KR1019910014079 A KR 1019910014079A KR 910014079 A KR910014079 A KR 910014079A KR 0163553 B1 KR0163553 B1 KR 0163553B1
- Authority
- KR
- South Korea
- Prior art keywords
- gate
- mold gate
- cavity
- arrangement
- molding compound
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
- B29C41/30—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length incorporating preformed parts or layers, e.g. moulding around inserts or for coating articles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
본 발명은 반도체 몰딩 장치의 몰드게이트의 배치방법에 있어서, 상기 몰드게이트를 캐비티의 측면에 배치함으로써, 몰딩 컴파운드의 흐름편중으로 인한 미세-다수 본딩 와이어의 스위핑(또는 휩쓸림) 현상을 억제할 수 있게 된다.According to the present invention, in the method of arranging a mold gate of a semiconductor molding apparatus, by disposing the mold gate on the side of the cavity, the sweeping (or swept) phenomenon of the micro-many bonding wires due to the flow bias of the molding compound can be suppressed. Will be.
Description
제1도는 종래의 방법에 따른 몰드게이트 배치도1 is a mold gate layout according to the conventional method
제2도는 본 발명에 따른 몰드게이트의 배치도2 is a layout view of a mold gate according to the present invention.
본 발명은 반도체 패캐지 공정에서 사용되는 몰드게이트의 배치방법에 관한 것이다. 반도체 조립공정(또는 어셈블리공정)에서는 와이어 몰딩된 칩을 수지물질로서 포장하기 위한 몰딩(molding)과정이 수행된다. 몰딩공정에서 필요한 장치로는 침과 리드 프레임, 와이어 본딩된 리드 프레임을 수지 물질로 덮음으로써 몰딩을 위한 공간을 제공하는 몰드다이가 기본적으로 필요하고, 상기 칩을 패캐지화 하는 물질이 되는 몰딩컴파운드가 있어야 한다. 상기 몰드다이에는 예열된 몰딩컴파운드가 투입되는 램포트와, 투입된 몰딩컴파운드를 입출시키기 위한 트랜스퍼램과, 압축되어 나온 겔(gel)상태의 몰딩컴파운드를 수송하는 런너(runner)가 설치되어 있으며, 상기 런너와 반도체 칩이 배치되는 캐비티는 게이트(gate)를 통하여 연결되어 있다. 여기서 몰딩공정후 패캐지 상태의 질을 결정하는 요인중의 하나는 상기 게이트의 위치이다.The present invention relates to a method of disposing a mold gate used in a semiconductor package process. In the semiconductor assembly process (or assembly process), a molding process for packaging the wire molded chip as a resin material is performed. As a necessary device in the molding process, a mold die which basically provides a space for molding by covering a needle, a lead frame, and a wire bonded lead frame with a resin material, and a molding compound, which is a material for packaging the chip, Should be The mold die is provided with a ram port into which the pre-molded molding compound is introduced, a transfer ram for injecting the injected molding compound, and a runner for transporting the compressed molding compound in a gel state. The cavity in which the runner and the semiconductor chip are disposed is connected through a gate. One of the factors that determine the quality of the package state after the molding process is the position of the gate.
반도체 칩, 예를들면 다수개의 입출력핀을 가지는 메모리용 칩인 경우에는 칩상의 본딩 패드의 수도 많아지고 그 만큼 본딩 와이어가 미세해지고 그 수가 늘어나기 때문에, 몰딩 컴파운드의 유동상태에 가장 큰 영향을 미치는 게이트의 위치가 고려되어야 한다.In the case of a semiconductor chip, for example, a memory chip having a plurality of input / output pins, the number of bonding pads on the chip increases and the number of bonding wires increases and the number of gates has the greatest influence on the flow state of the molding compound. The position of is to be considered.
제1(a) 및 (b)는 종래의 몰딩장치에서의 게이트의 위치를 나타낸다.First (a) and (b) show the position of the gate in the conventional molding apparatus.
제1도의 (a)를 참조하면, 종래에는 게이트(1)가 캐비티(2)의 모서리부분에 위치되어 있기 때문에, 상기 캐비티(2)를 통하여 겔 상태의 몰딩 컴파운드가 유입될 경우, 캐비티의 반대편 모서리쪽으로 흐를 염려가 있다.Referring to FIG. 1A, since the gate 1 is conventionally located at an edge of the cavity 2, when a gel molding compound flows through the cavity 2, the opposite side of the cavity is introduced. It may flow toward the edge.
이러한 몰딩 컴파운드의 흐름은 칩과 리드 프레임을 연결하는 본딩와이어들이 유체의 흐름에 따른 힘을 받아 한쪽으로 휩쓸리는 소위, 스위핑(Sweeping) 현상이 유발된다. 이러한 스위핑 현상은 상기 본딩 와이어들을 쇼트(short)된 상태로 만들기 때문에, 몰딩후 패캐지화된 디바이스에 동작불량을 유발시키게 된다.The flow of the molding compound causes a so-called sweeping phenomenon in which the bonding wires connecting the chip and the lead frame are swept to one side by the force of the fluid flow. This sweeping phenomenon causes the bonding wires to be in a shorted state, causing malfunctions in the packaged device after molding.
종래의 다른 형태의 제1도의 (b)의 경우에 있어서도, 캐비티(12)의 상부에 위치되어 있는 게이트(11)로 인하여 제1도의 (a)와 같은 스위핑 현상이 야기될 수 있다. 이처럼 반도체 칩을 패키징함에 있어서, 본딩 와이어의 스위핑 현상을 고려한 게이트 위치의 선정이 매우 중요하다.Also in the case of (b) of FIG. 1 of another type of conventional art, a sweeping phenomenon such as (a) of FIG. 1 may be caused by the gate 11 located above the cavity 12. As described above, in packaging a semiconductor chip, selection of a gate position in consideration of a sweeping phenomenon of a bonding wire is very important.
따라서 본 발명의 목적은, 반도체 몰딩 공정에서 본딩 와이어의 스위핑 현상을 억제할 수 있는 게이트 위치를 설계하는 방법에 관한 것이다.Accordingly, an object of the present invention relates to a method of designing a gate position that can suppress the sweeping phenomenon of a bonding wire in a semiconductor molding process.
상기 본 발명의 목적을 달성하기 위하여 본 발명은, 반도체 몰딩 장치의 몰드게이트의 배치방법에 있어서, 상기 몰드게이트를 캐비티의 일측면 중앙에 설치함을 특징으로 하는 몰드게이트 배치방법을 제공한다.In order to achieve the object of the present invention, the present invention provides a method for arranging a mold gate, characterized in that the mold gate is installed in the center of one side of the cavity.
제2도는 본 발명의 실시예에 따른 게이트의 위치를 나타낸다. 도면에 도시되어 있는 바와 같이, 게이트(21)가 캐비티(22)의 측면 중앙에 형성되어 있다. 즉, 상기 게이트(21)가 캐비티(22)의 반대측 측면으로부터 가장 가까운 거리에 있도록 배치시킨다. 그 결과, 상기 게이트(21)를 통과한 몰딩컴파운드를 캐비티(22)내에서 침의 상부와 하부에 일정하게 채울수 있게 되어 종래의 경우와 같이 일반적인 몰딩컴파운드의 흐름으로 인하여 본딩 와이어들이 편중하는 현상이 억제시킬 수 있다. 또한 상기 게이트(21)로부터 몰딩 컴파운드의 이동거리가 최단으로 될 수 있기 때문에, 종래에 비하여 보다 일정한 조건으로 몰딩 공정을 실시할 수 있다.2 shows the position of a gate according to an embodiment of the invention. As shown in the figure, a gate 21 is formed in the center of the side surface of the cavity 22. That is, the gate 21 is disposed to be the closest distance from the opposite side of the cavity 22. As a result, the molding compound that has passed through the gate 21 can be uniformly filled in the upper and lower portions of the needle in the cavity 22, so that the bonding wires are biased due to the flow of the general molding compound as in the conventional case. Can be suppressed. In addition, since the molding compound can have the shortest moving distance from the gate 21, the molding process can be performed under more constant conditions than before.
상술한 바와 같이 본 발명에 따르면, 게이트를 캐비티의 측면 중앙에 구비함으로써, 몰딩 컴파운드의 캐비티 충전중에 발생되는 본딩 와이어의 스위핑 및 쇼트가 억제되는 효과가 있다.According to the present invention as described above, by providing the gate in the center of the side of the cavity, there is an effect that the sweeping and shorting of the bonding wire generated during the cavity filling of the molding compound is suppressed.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019910014079A KR0163553B1 (en) | 1991-08-14 | 1991-08-14 | Method of arrangement for plastic packaged mold gate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019910014079A KR0163553B1 (en) | 1991-08-14 | 1991-08-14 | Method of arrangement for plastic packaged mold gate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930004048A KR930004048A (en) | 1993-03-22 |
| KR0163553B1 true KR0163553B1 (en) | 1999-01-15 |
Family
ID=19318619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910014079A KR0163553B1 (en) | 1991-08-14 | 1991-08-14 | Method of arrangement for plastic packaged mold gate |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0163553B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102254286B1 (en) * | 2019-10-18 | 2021-05-21 | 일우산업 주식회사 | Manufacturing Method of Cable pipe with a smooth surface, and cable pipe by the same |
-
1991
- 1991-08-14 KR KR1019910014079A patent/KR0163553B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR930004048A (en) | 1993-03-22 |
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