KR0156647B1 - The solder alloy of sn-zn-al-bi for pb free - Google Patents

The solder alloy of sn-zn-al-bi for pb free Download PDF

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KR0156647B1
KR0156647B1 KR1019950019318A KR19950019318A KR0156647B1 KR 0156647 B1 KR0156647 B1 KR 0156647B1 KR 1019950019318 A KR1019950019318 A KR 1019950019318A KR 19950019318 A KR19950019318 A KR 19950019318A KR 0156647 B1 KR0156647 B1 KR 0156647B1
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soldering
alloy
lead
present
tin
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KR1019950019318A
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Korean (ko)
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KR970000430A (en
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김창주
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서상기
한국기계연구원
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating With Molten Metal (AREA)

Abstract

전기 및 전자용 동 및 동합금 부품을 담금땜질하는 경우에는 납(Pb)이 40∼70 wt %(중량 퍼센트) 함유한 땜납(solder)이 아직도 널리 사용되고 있으며, 근래에 들어 납(Pb) 성분으로 인한 공해문제가 심각히 지적되고 있다.Solders containing 40 to 70 wt% (wt.%) Of lead (Pb) are still widely used for quenching electrical and electronic copper and copper alloy parts. Pollution problems are seriously pointed out.

이러한 관점에서 본 발명은 납(Pb)을 함유하지 않은 새로운 땜질 합금을 개발함으로써, 중금속인 납(Pb) 성분의 배출을 근원적으로 차단하여 공해를 방지하고, 납(Pb) 성분을 방출시키지 못하게 하는 집진설비를 특별히 고려하지 않아도 될 수 있도록 하는데 기여코자 하였다.In view of this, the present invention develops a new soldering alloy that does not contain lead (Pb), thereby fundamentally blocking the discharge of lead (Pb), which is a heavy metal, to prevent pollution and prevent the release of lead (Pb). The purpose of this study was to contribute to avoiding the special consideration of dust collection equipment.

그리고 본 발명인 새로운 땜질 합금에 있어서의 착안점은 땜질온도, 땜질재의 도포성, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 수 광택 등의 효과를 종래의 납(Pb) 땜질재와 비교하여 손색이 없도록 한 점에 있다.In the new soldering alloy of the present invention, the focus of the present invention is that the soldering temperature, the coating property of the soldering material, the viscosity of the soldering material in the molten state, the wettability with the soldering material, the soldering gloss, and the like are compared with those of the conventional solder (Pb) soldering material. Compared to the point that there is no inferiority.

한편, 본 발명이 새로운 땜질 합금은, 우선 주석(Sn)과 아연(Zn)의 합금비율을 10대 1로하여 주석(Sn)-아연(Zn) 2원합금 상태도 상에서 용융점이 200℃ 정도로 낮은 공정합금으로 하였다. 그리고 용융상태에서의 점도, 피접물에 대한 젖음성, 도포성, 응고 후 광택 등의 땜질 특성을 고려하여 알루미늄(Al)과 비스므스(Bi)를 각각 0.3∼3.0 wt %(중량 퍼센트)와 0.5∼5.0 wt %(중량 퍼센트)의 범위로 합금하였다.On the other hand, the new brazing alloy of the present invention first has an alloy ratio of tin (Sn) to zinc (Zn) of 10 to 1, and the melting point is as low as 200 ° C on the tin (Sn) -zinc (Zn) binary alloy state diagram. It was set as a process alloy. Aluminum (Al) and bismuth (Bi) are 0.3-3.0 wt% (weight percent) and 0.5-, respectively, in consideration of the soldering characteristics such as viscosity in the molten state, wettability to the adherend, coating property, gloss after solidification, and the like. Alloyed in the range of 5.0 wt% (weight percent).

Description

납(Pb)이 함유되지 않은 땜질용 주석(Sn)-아연(Zn)-알루미늄(Al)-비스므스(Bi) 합금Tin (Sn) -zinc (Zn) -aluminum (Al) -bismuth (Bi) alloy for soldering without lead (Pb)

본 발명은 납(Pb)이 함유되지 않은 땜질(solder)용 주석(Sn)-아연(Zn)-알루미늄(Al)-비스므스(Bi) 합금에 관한 것이다.The present invention relates to a tin (Sn) -zinc (Zn) -aluminum (Al) -bismuth (Bi) alloy for solder that does not contain lead (Pb).

일반적으로 전기 및 전자용 동 및 동합금 부품을 담금땜질하는 경우에는 납(Pb)이 40∼70 wt %(중량 퍼센트) 함유한 땜납(solder)이 아직도 널리 사용되고 있으며, 근래에 들어 납(Pb) 성분으로 인한 공해문제가 심각히 지적되고 있다.Generally, solders containing 40 to 70 wt% (wt.%) Of lead (Pb) are still widely used when quenching electrical and electronic copper and copper alloy parts. The pollution problem caused by this is seriously pointed out.

납(Pb) 성분은 중금속으로서, 일단 몸속에 들어오면 축적되어 인체에 해를 미치므로, 가능한 한 그 사용분야나 외부로의 성분배출을 규제해야하는 물질로 분류됨은 주지의 사실이다.It is well known that lead (Pb) is a heavy metal, and once it enters the body, it accumulates and harms the human body. Therefore, the lead (Pb) component is classified as a substance that should be regulated as far as possible for its field of use or release to the outside.

실제로 납땜질을 수행하는 작업장의 예에서는 납땜을 400∼420℃ 정도의 고온으로 용융하여 땜질작업하므로 공기 중에 납성분이 비산된다는 문제점이 있다.In an example of a workshop that actually performs brazing, there is a problem in that lead components are scattered in the air because the brazing is performed by melting the solder at a high temperature of about 400 to 420 ° C.

따라서 이를 제거하기 위해, 집진장치 등으로써 대기의 오염을 막고는 있으나, 경우에 따라 완벽할 수는 없으며 장치의 설비, 가동 및 보수를 위해 부담하는 경제적 부담이 크다는 문제점이 있다.Therefore, in order to remove this, the pollution of the air with a dust collector, etc., but in some cases can not be perfect, there is a problem that the burden on the installation, operation and maintenance of the device is large.

상기와 같은 문제점을 해결하기 위한 본 발명의 목적은 목적은 땜질온도, 땜질속도, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 다량 납(Pb)을 함유한 땜질재와 비교하여 손색이 없도록 하되 중금속인 납(Pb)을 전혀 함유하지 않고, 기존의 납(Pb)-주석(Sn) 합금계 땜질재료에 비하여 강도와 도전율을 향상시킴으로써 전자부품 땜질부의 접착강도를 증가시키고 전기비저항을 줄여 노이즈를 감소시키는 저공해의 땜질 합금을 제공하는데 있다.An object of the present invention for solving the above problems is to improve the effects of the soldering temperature, the soldering speed, the viscosity of the soldering material in the molten state, the wettability with the soldering material and the gloss after the soldering of the conventional mass lead (Pb) Compared to the soldering material containing P, it has no inferiority, but does not contain any heavy metal lead (Pb), and improves the strength and conductivity compared to the existing lead (Pb) -tin (Sn) alloy-based soldering material. It is to provide a low pollution braze alloy that increases the negative adhesive strength and reduces the electrical resistivity to reduce noise.

상기와 같은 본 발명의 목적은 동 및 동합금을 땜질하는 담금땜질재(dipping solder)로서 납(Pb)을 함유하지 않는 땜질용 합금에 있어서,An object of the present invention as described above in the soldering alloy that does not contain lead (Pb) as a dipping solder (dipping solder) for soldering copper and copper alloy,

0.3∼3.0 wt %(중량 백분율)알루미늄(Al), 0.5∼5.0 wt %(중량 백분율) 비스므스(Bi) 나머지는 주석(Sn)과 아연(Zn)으로 조성하되 주석(Sn) : 아연(Zn)의 조성비율이 10 : 1로 조성되는 것을 특징으로 하는 납(Pb)이 함유되지 않은 땜질(solder)용 주석(Sn)-아연(Zn)-알루미늄(Al)-비스므스(Bi) 합금을 제공함으로써 달성된다.0.3 to 3.0 wt% (% by weight) aluminum (Al), 0.5 to 5.0 wt% (% by weight) Bismuth (Bi) The remainder is composed of tin (Sn) and zinc (Zn), but tin (Sn): zinc (Zn) Tin (Sn) -zinc (Zn) -aluminum (Al) -bismuth (Bi) alloy for solder (Pb) containing no lead (Pb), characterized in that the composition ratio of By providing.

상기한 바와 같은 목적을 달성하고 종래의 결점을 제거하기 위한 과제를 수행하는 본 발명의 실시예인 구성과 그 작용을 상세히 설명하면 다음과 같다.When explaining the configuration and the operation of the embodiment of the present invention to achieve the object as described above and to perform the problem for removing the conventional defects in detail.

전기 및 전자용 동 및 동합금 부품을 담금땜질(dipping)하는 경우에는 납(Pb)이 40∼70 wt %(중량 퍼센트) 함유한 땜납(solder)이 아직도 널리 사용되고 있으며, 근래에 들어 납(Pb) 성분으로 인한 공해문제가 심각히 지적되고 있다.Solders containing 40 to 70 wt% (weight percent) of lead (Pb) are still widely used when dipping electrical and electronic copper and copper alloy parts. Pollution problems due to ingredients are seriously pointed out.

납(Pb) 성분은 중금속으로서, 일단 몸속에 들어오면 축적되어 인체에 해를 미치므로, 가능한 한 그 사용을 규제해야하는 물질로 분류되고 있음은 주지의 사실이다.It is well known that lead (Pb) is a heavy metal and is classified as a substance that should be regulated as much as possible because it accumulates once it enters the body and harms the human body.

실제로 납땜질을 수행하는 작업장의 예에서는 납땜을 400∼450℃ 정도의 고온으로 용해하여 땜질작업하므로 공기 중에 납산화물이 비산되고 있다.In an example of a workplace that actually performs brazing, lead oxide is scattered in the air because the brazing is performed by melting the solder at a high temperature of about 400 to 450 ° C.

따라서 이를 제거하기 위해, 집진장치 등으로써 대기의 오염을 막고는 있으나, 경우에 따라서는 완벽할 수가 없으며 장치의 가동 및 보수를 위해 부담하는 경제적 부담도 크다.Therefore, in order to remove this, the air pollution is prevented by a dust collector or the like, but in some cases it cannot be perfect, and the economic burden for operating and repairing the device is also great.

이러한 관점에서 본 발명의 목적은 중금속인 납(Pb)을 전혀 함유하지 않는 환경친화적인 새로운 땜질 합금을 개발함과 아울러 기존의 납(Pb)-주석(Sn) 합금계 땜질재료에 비하여 강도와 도전율을 향상시킴으로서 전자부품 땜질부의 접착강도를 증가시키고 전기비저항을 줄여 노이즈를 감소시키는 효과를 얻도록 하였다.From this point of view, the object of the present invention is to develop a new environmentally friendly solder alloy containing no lead (Pb), which is a heavy metal, as well as strength and conductivity compared to conventional lead (Pb) -tin (Sn) alloy solder materials. As a result, the adhesive strength of the electronic parts is increased and the electrical resistivity is reduced to reduce the noise.

그리고 본 발명인 새로운 땜질 합금에 있어서의 착안점은 땜질온도, 땜질재의 도포성, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 납(Pb) 땜질재와 비교하여 손색이 없도록 한 점에 있다.In the new soldering alloy of the present invention, the focus of the present invention is that the soldering temperature, the coating property of the soldering material, the viscosity of the soldering material in the molten state, the wettability with the soldering material, the gloss after the soldering, and the like are compared with the conventional lead (Pb) soldering material. Compared to the point that there is no inferiority.

한편, 본 발명인 새로운 땜질 합금은, 우선 주석(Sn)과 아연(Zn)의 합금비율을 10 : 1로하여 주석(Sn)-아연(Zn) 2원합금 상태도 상에서 용융점이 200℃ 정도로 낮은 공정합금으로 하였다.On the other hand, the novel soldering alloy of the present invention is a process in which the melting point is about 200 ° C on the tin (Sn) -zinc (Zn) binary alloy state diagram by first setting the alloy ratio of tin (Sn) and zinc (Zn) to 10: 1. It was set as the alloy.

그리고 용융상태에서의 점도, 피접물에 대한 젖음성, 땜질재의 도포성, 응고 후 광택 및 땜질재 강도 등의 땜질 특성을 고려하여 알루미늄(Al)과 비스므스(Bi)를 각각 0.3∼3.0 wt %(중량 퍼센트)와 0.5∼5.0 wt %(중량 퍼센트)의 범위로 합금하였다.0.3 to 3.0 wt% of aluminum (Al) and bismuth (Bi), respectively, in consideration of the soldering characteristics such as viscosity in the molten state, wettability to the workpiece, coating property of the solder material, gloss after solidification, and the strength of the solder material. Weight percent) and 0.5 to 5.0 wt% (weight percent).

여기서 용융점이 271℃인 비스므스(Bi)와 용융점이 660℃인 알루미늄(Al)의 함량을 허용된 범위 내에서 상대적으로 가감하면 땜질온도와 용융상태에서 땜질재의 특성을 다소 조절할 수 있으며, 이는 결국 땜질조건을 선택하는 방안이 된다.Here, if the content of bismuth (Bi) having a melting point of 271 ° C and aluminum (Al) having a melting point of 660 ° C is relatively decreased within the allowable range, the characteristics of the soldering material at the soldering temperature and the molten state can be controlled. This is the method of selecting the soldering condition.

이하 본 발명의 가장 바람직한 실시예를 설명하겠다.Hereinafter, the most preferred embodiment of the present invention will be described.

[실시예]EXAMPLE

먼저 주석(Sn), 아연(Zn) 및 알루미늄(Al)을 평량하여 함께 장입하고 석조중의 용탕온도를 500∼550℃의 범위로 유지하고 가열하면 기지원소인 주석(Sn), 공정합금이며 다량 첨가원소인 아연(Zn), 고융점 원소인 알루미늄(Al)의 순서로 용해된다.First, tin (Sn), zinc (Zn), and aluminum (Al) are charged and weighed together, and the molten metal in the stone is kept in the range of 500 to 550 ° C. When heated, tin (Sn), a process alloy, and a large amount It is dissolved in order of zinc (Zn), which is an additive element, and aluminum (Al), which is a high melting point element.

이들의 대부분이 용해되고 용탕위에 알루미늄(Al)만 떠 있으면 균일한 합금을 얻을 수 있도록 가끔 조용한 방법으로 용탕을 저어주어 알루미늄(Al)의 용해를 촉진시킨다.If most of them are dissolved and only aluminum (Al) is floating on the molten metal, the molten metal is stirred in a quiet manner to promote the dissolution of aluminum (Al).

그리고 알루미늄(Al)이 거의 다 녹는 시점에서 석조의 온도가 350℃ 이하가 되도록 가열을 낮추고 비스므스(Bi)를 첨가 후 조용히 교반하여 용해 및 합금시킨다.When the aluminum (Al) is almost completely dissolved, the heating is lowered so that the temperature of the masonry is 350 ° C. or lower, and after the addition of bismuth (Bi), the mixture is stirred and dissolved to dissolve and alloy.

다음의 표 1은 본 발명의 땜질합금 중에서 몇가지 대표적인 화학성분의 예이며, 표 2는 담금땜질법(dipping)에 의한 각 합금의 적정 땜질온도 및 땜질결과의 예를 나타낸 것으로, 실용조건에 충분히 만족하고 있다.Table 1 below shows examples of some typical chemical components in the soldering alloy of the present invention, and Table 2 shows examples of proper soldering temperatures and soldering results of the respective alloys by dipping, which satisfies practical conditions. Doing.

상기와 같은 본 발명의 합금은 땜질온도, 땜질속도, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 다량 납(Pb)을 함유한 땜질재와 비교하여 손색이 없으며, 또한 중금속인 납(Pb)이 함량이 없어 중금속 오염의 문제가 없으면서도, 기존의 납(Pb)-주석(Sn) 합금계 땜질재료에 비하여 강도와 도전율을 향상시킴으로써 전자부품 땜질부의 접착강도를 증가시키고 전기비저항을 줄여 노이즈를 감소시키는 등의 효과가 있다.The alloy of the present invention as described above compares the effects of the soldering temperature, the soldering speed, the viscosity of the soldering material in the molten state, the wettability with the soldering material and the gloss after soldering, compared with the conventional soldering material containing a large amount of lead (Pb). Soldering electronic components by improving strength and conductivity, compared to conventional lead (Pb) -tin (Sn) alloy-based soldering materials, without the problem of heavy metal contamination due to no content of lead (Pb), which is a heavy metal. It has the effect of reducing the noise by increasing the negative adhesive strength and reducing the electrical resistivity.

Claims (1)

동 및 동합금을 땜질하는 담금땜질재(dipping solder)로서 납(Pb)을 함유하지 않는 땜질용 합금에 있어서, 0.3∼3.0 wt %(중량 백분율)알루미늄(Al), 0.5∼5.0 wt %(중량 백분율) 비스므스(Bi) 나머지는 주석(Sn)과 아연(Zn)으로 조성하되 주석(Sn) : 아연(Zn)의 조성비율이 10 1로 조성되는 것을 특징으로 하는 납(Pb)이 함유되지 않은 땜질(solder)용 주석(Sn)-아연(Zn)-알루미늄(Al)-비스므스(Bi) 합금.0.3-3.0 wt% (weight percentage) aluminum (Al), 0.5-5.0 wt% (weight percentage) in the soldering alloy which does not contain lead (Pb) as a dipping solder for copper and copper alloys. ) Bismuth (Bi) is composed of tin (Sn) and zinc (Zn), but the lead (Pn) is characterized in that the composition ratio of tin (Sn): zinc (Zn) is 10 1 Tin (Sn) -zinc (Zn) -aluminum (Al) -bismuth (Bi) alloys for soldering.
KR1019950019318A 1995-06-28 1995-06-28 The solder alloy of sn-zn-al-bi for pb free KR0156647B1 (en)

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