KR0182080B1 - Pb-contained soldering sn-zn-pb alloy - Google Patents
Pb-contained soldering sn-zn-pb alloy Download PDFInfo
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- KR0182080B1 KR0182080B1 KR1019950048157A KR19950048157A KR0182080B1 KR 0182080 B1 KR0182080 B1 KR 0182080B1 KR 1019950048157 A KR1019950048157 A KR 1019950048157A KR 19950048157 A KR19950048157 A KR 19950048157A KR 0182080 B1 KR0182080 B1 KR 0182080B1
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- Prior art keywords
- lead
- soldering
- alloy
- zinc
- tin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 납(Pb)이 미량 함유된 땜질(solder)용 주석(Sn)-아연(Zn)-납(Pb)합금에 관한 것으로서, 특히 미량의 납(Pb)을 함유하며너도 땜질온도, 땜질속도, 용융상태에서의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과가 좋은 합금재에 관한 것이다.The present invention relates to a tin (Sn) -zinc (Zn) -lead (Pb) alloy for solder containing a small amount of lead (Pb), and particularly, contains a small amount of lead (Pb). The present invention relates to an alloy material having good effects such as speed, viscosity in a molten state, wettability with the material to be soldered, and gloss after soldering.
본 발명의 목적은 납(Pb)의 함량은 극히 미량으로 줄인 새로운 땜질 합금을 개발함으로써, 중금속인 납(Pb)성분의 배출을 근원적으로 억제하여 공해를 방지하고, 납(Pb)성분의 집진설비를 특별히 고려하지 않아도 될 수 있도록 하고, 미량의 납(Pb)을 함유하면서도 땜질온도, 땜지속도, 용융상태에서의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과가 종래의 땜질 합금인 납(Pb)을 다량 함유한 것과 비교하여 손색이 없는 함금재를 개발하는데 있다.It is an object of the present invention to develop a new brazing alloy having a very small amount of lead (Pb), thereby preventing pollution by fundamentally suppressing the discharge of lead (Pb), which is a heavy metal, and collecting dust of lead (Pb) The soldering temperature, the soldering speed, the viscosity in the molten state, the wettability with the material to be soldered and the gloss after the soldering, etc., while containing a small amount of lead (Pb), do not have to consider specially. It is to develop an inferior alloying material in comparison with a large amount of Pb.
본 발명의 구성은 동 및 동합금을 땜질하는 납을 함유한 땜질재(solder)에 있어서, 1.0∼10.0wt% 아연(Zn), 0.5∼3.0wt%납(Pb), 나머지는 주석(Sn)으로 조성된다.The present invention is composed of 1.0 to 10.0 wt% zinc (Zn), 0.5 to 3.0 wt% lead (Pb), and tin (Sn) in a solder containing lead soldering copper and copper alloy. It is created.
Description
본 발명은 납(Pb)이 미량 함유된 땜질(solder)용 주석(Sn)-아연(Zn)-납(Pb) 합금에 관한 것으로서, 특히 미량의 납(Pb)을 함유하면서도 땜질온도, 땜질속도, 용융상태에서의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과가 좋은 합금재에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to tin (Sn) -zinc (Zn) -lead (Pb) alloys for solder containing trace amounts of lead (Pb). The present invention relates to an alloy material having good effects such as viscosity in a molten state, wettability with a solder material, and gloss after soldering.
일반적으로 전기 및 전자용 동 및 동합금 부품을 땜질하는 경우에는 납(Pb)이 40 -70 wt%(중량 퍼센트) 함유한 땜납(solder)이 아직도 널리 사용되고 있는데, 근래에 들어 납(Pb) 성분으로 인한 공해문제로 심각히 지적되고 있다.In general, when soldering electrical and electronic copper and copper alloy parts, a solder containing 40 -70 wt% (wt. Percent) of lead (Pb) is still widely used. Recently, as a lead (Pb) component It is seriously pointed out as a pollution problem.
납(Pb) 성분은 중금속으로서, 일단 몸속에 들어오면 축적되어 인체에 불치의 해를 미치므로, 가능한 한 그 사용분야나 외부로의 성분배출을 규제해야하는 물질로 분류됨은 주지의 사실이다.It is well known that lead (Pb) is a heavy metal, and once it enters the body, it accumulates and incurs incurable harm to the human body.
실제로 납땜질을 수행하는 작업장의 예에서는 납땜을 400-420℃정도의 고온으로 용융하여 땜질작업하므로 공기 중에 납성분이 비산되고 있다.In an example of a workshop that actually performs brazing, the solder is melted at a high temperature of about 400-420 ° C. and soldered, so that lead components are scattered in the air.
따라서 이를 제거하기 위해, 집진장치 등으로써 대기의 오염을 막고는 있으나, 경우에 따라 완벽할 수는 없으며 장치의 설비, 가동 및 보수를 위해 지속적인 경제적 부담도 크다.Therefore, in order to remove this, the air pollution is prevented by a dust collector, but it may not be perfect in some cases, and there is a constant economic burden for the installation, operation and maintenance of the device.
그리고 기존의 주석(Sn 90 wt% )-아연(Zn 10 wt% ) 2원 공정합금 땜질재는 피땜질재와의 젖음성, 용융상태에서이 점도 및 높은 땜질온도의 요구 등과 같은 기술적인 문제들이 있다.In addition, conventional tin (Sn 90 wt%) -zinc (Zn 10 wt%) binary eutectic soldering materials have technical problems such as wettability with the material to be soldered, viscosity in molten state, and high soldering temperature.
더구나 주석-아연 합금의 특성을 보면, 용융점이 231℃ 인 주석(Sn)에 용융점이 420℃ 인 아연(Zn)을 합금하면 용융점이 저하하여 이들의 합금 중량비율을 9 : 1로 합금할 경우에는 용융점이 199℃로 낮아진 저융점 공정합금이 되지만, 이를 고비로 아연(Zn)의 함량을 점차 증가시키면 용융점을 다시 상승한다는 문제점이 있다.In addition, the characteristics of the tin-zinc alloy show that when alloying tin (Sn) having a melting point of 231 ° C. and zinc (Zn) having a melting point of 420 ° C., the melting point decreases, and the alloy weight ratio is 9: 1. The melting point becomes a low melting process alloy is lowered to 199 ℃, but there is a problem that the melting point is raised again when gradually increasing the content of zinc (Zn) at a high cost.
상기과 같은 문제점을 해결하기 위한 본 발명의 목적은 납(Pb)의 함량을 극히 미량으로 줄인 새로운 땜질 합금을 개발함으로써, 중금속인 납(Pb) 성분의 배출을 근원적으로 억제하여 공해를 방지하고, 납(Pb) 성분의 집진설비를 특별히 고려하지 않아도 될 수 있도록 하고, 미량의 납(Pb)을 함유하면서도 땜질온도, 땜질속도, 용융상태에서의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 들의 효과가 종래의 땜질 합금인 납(Pb)을 다량 함유한 것과 비교하여 손색이 없는 합금재를 개발하는데 있다.An object of the present invention for solving the above problems is to develop a new soldering alloy with a very small amount of lead (Pb), thereby preventing pollution by fundamentally suppressing the discharge of lead (Pb) component, which is a heavy metal, It is possible to avoid special consideration of the dust collection equipment of (Pb) component, and it contains a small amount of lead (Pb), but the soldering temperature, the soldering speed, the viscosity in the molten state, the wettability with the soldering material, and the effect of the gloss after the soldering Is to develop an alloy material which is inferior to that containing a large amount of lead (Pb), which is a conventional brazing alloy.
상기와 같은 본 발명의 목적은 동 및 동합금을 땜질하는 납을 함유한 땜질재(solder)에 있어서, 1.0 - 10.0 wt% 아연(Zn), 0.5 - 3.0 wt% 납(Pb), 나머지는 주석(Sn)으로 조성되는 것을 특징으로 하는 납(Pb)이 미량 함유된 땜질(solder)용 주석(Sn)-아연(Zn)-납(Pb) 합금을 제공함으로서 달성된다.The object of the present invention as described above is 1.0-10.0 wt% zinc (Zn), 0.5-3.0 wt% lead (Pb) in the solder containing a solder for soldering copper and copper alloy, the remainder is tin ( It is achieved by providing a tin (Sn) -zinc (Zn) -lead (Pb) alloy for solder containing a trace amount of lead (Pb), which is composed of Sn).
상기한 바와 같은 목적을 달성하고 종래의 결점을 제거하기 위한 과제를 수행하는 본 발명의 실시예인 구성과 그 작용을 상세히 설명하면 다음과 같다.When explaining the configuration and the operation of the embodiment of the present invention to achieve the object as described above and to perform the problem for removing the conventional defects in detail.
본 발명 땜 합금의 특징은 주성분인 주석(Sn)과 아연(Zn)에 미량의 납(Pb)을 합금한 3원합금으로 미량의 납(Pb)을 함유하면서도 땜질온도, 땜질속도, 용융상태에서의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 땜질 합금인 납(Pb)을 다량 함유한 것과 비교하여 손색이 없도록 한 것으로, 땜질재의 용융점을 가능한 한 낮추고 우수한 땜질특성을 가질 수 있도록 아연(Zn)의 함량을 10%이하인 1-10% 범위로 하였으며, 여기에 땜질특성을 최대한 개선하고 중금속인 납(Pb)을 0.5-3.0% 의 범위로 최대한 억제하여 저공해 땜질재를 개발하였다.The solder alloy of the present invention is a ternary alloy in which tin (Sn) and zinc (Zn) are alloyed with a small amount of lead (Pb). The solder alloy contains a small amount of lead (Pb) at a soldering temperature, soldering speed, and molten state. Viscosity, wettability of the solder material and gloss after soldering are compared with those containing a large amount of lead (Pb), which is a conventional soldering alloy. The content of zinc (Zn) is in the range of 1-10%, which is 10% or less, so that the soldering properties can be improved as much as possible, and the heavy metal lead (Pb) is suppressed in the range of 0.5-3.0%. Developed.
일반적으로 주석(Sn)과 아연(Zn)의 2원합금에서 아연(Zn)의 함량을 10wt%이상으로 증가시키는 경우에 용융상태에서의 유동성과 땜질 특성이 나빠지게 되는 문제점이 있는데, 이러한 취약성을 개선함과 아울러 용융상태에서의 점도, 젖음성, 응고속도 및 응고 후 광택 등의 땜질특성을 고려하여 아연(Zn)의 함량을 낮추어 2원 합금의 공정점인 199℃ 에서 용융되도록 10% 이내로 제한하고 납(Pb)을 0.5 - 3.0% (중량 퍼센트)의 범위로 미량 합금하였다.In general, when the content of zinc (Zn) in the binary alloys of tin (Sn) and zinc (Zn) is increased to 10 wt% or more, there is a problem in that fluidity and soldering properties in the molten state are deteriorated. In addition, the content of zinc (Zn) is reduced in consideration of the soldering characteristics such as viscosity, wettability, solidification rate, and gloss after solidification in the molten state, and is limited to within 10% to be melted at 199 ° C, the process point of the binary alloy. Lead (Pb) was trace alloyed in the range of 0.5-3.0% (weight percent).
이하 본 발명의 바람직한 실시예이다.Hereinafter is a preferred embodiment of the present invention.
[실시예]EXAMPLE
본 실시예에서는 90% 주석(Sn) - 10% 아연(Zn) - 1%납(Pb)인 땜질재 100 kg 을 만드는 실시예로써 설명코자 한다.In this embodiment, it will be described as an embodiment of making 100 kg of the solder material 90% tin (Sn)-10% zinc (Zn)-1% lead (Pb).
먼저 주석(Sn) 90 kg과 아연(Zn) 9 kg 을 평량하여 도가니에 넣고 450℃ 정도로 가열하여 용해 및 합금한다.First, 90 kg of tin (Sn) and 9 kg of zinc (Zn) are weighed into a crucible and heated to about 450 ° C to dissolve and alloy.
주석(Sn)과 아연(Zn)이 완전히 용해하면 가열온도를 400℃ 정도로 낮추고 납(Pb) 1kg을 투입하여 용해하고 완전히 용해가 된 후에도 약 20-30분 정도 유지하며 합금이 잘 될 수 있도록 가끔 조용히 저어주어 교반한다.When tin (Sn) and zinc (Zn) are completely dissolved, lower the heating temperature to about 400 ℃, add 1 kg of lead (Pb) to dissolve, and keep it for about 20-30 minutes after complete dissolution. Stir gently and stir.
이러한 방법으로 제조한 땜질재의 예에서 다음의 표 1은 본 발명의 땜질합금들의 몇 가지 대표적인 화학성분의 예이며, 표 2는 침적땜질법(dipping)에 의한 각 합금의 적정 땜질온도 및 땜질결과를 나타낸 것으로, 기존의 주석(Sn)-아연(Zn)-합금과 실용조건에서 비교하였다.In the example of the brazing material manufactured in this way, Table 1 below shows some representative chemical compositions of the brazing alloys of the present invention, and Table 2 shows the appropriate brazing temperature and the brazing result of each alloy by dipping. As shown, the conventional tin (Sn) -zinc (Zn) -alloy was compared with the practical conditions.
상기와 같은 본 발명은 주성분인 주석(Sn)과 아연(Zn)에 미량의 납(Pb)을 합금한 3원 합금으로, 미량의 납(Pb)을 함유하면서도 땜질온도, 땜질속도, 용융상태에서의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 땜질 합금인 납(Pb)을 다량 함유한 것과 비교하여 손색이 없다는 장점이 있고, 또한 중금속인 납(Pb)성분의 배출을 근원적으로 억제하여 공해를 방지하고, 납(Pb) 성분의 집진설비를 특별히 고려하지 않아도 되는 등의 효과가 있다.As described above, the present invention is a ternary alloy in which tin (Sn) and zinc (Zn) are alloyed with a small amount of lead (Pb), and contain a small amount of lead (Pb) at a soldering temperature, a soldering speed, and a molten state. Viscosity, wettability with the material to be soldered, and gloss after soldering are compared with those containing a large amount of lead (Pb), which is a conventional soldering alloy. There is an effect such as to prevent the pollution by fundamentally suppressing, and to not consider specially a lead (Pb) dust collector.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950048157A KR0182080B1 (en) | 1995-12-05 | 1995-12-05 | Pb-contained soldering sn-zn-pb alloy |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1019950048157A KR0182080B1 (en) | 1995-12-05 | 1995-12-05 | Pb-contained soldering sn-zn-pb alloy |
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| Publication Number | Publication Date |
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| KR970033397A KR970033397A (en) | 1997-07-22 |
| KR0182080B1 true KR0182080B1 (en) | 1999-04-01 |
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| KR1019950048157A KR0182080B1 (en) | 1995-12-05 | 1995-12-05 | Pb-contained soldering sn-zn-pb alloy |
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