KR0156649B1 - The solder alloy of sn-zn-bi-sb for pb free - Google Patents
The solder alloy of sn-zn-bi-sb for pb free Download PDFInfo
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- KR0156649B1 KR0156649B1 KR1019950012937A KR19950012937A KR0156649B1 KR 0156649 B1 KR0156649 B1 KR 0156649B1 KR 1019950012937 A KR1019950012937 A KR 1019950012937A KR 19950012937 A KR19950012937 A KR 19950012937A KR 0156649 B1 KR0156649 B1 KR 0156649B1
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- Prior art keywords
- soldering
- alloy
- lead
- tin
- zinc
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
전기 및 전자용 동 및 동합금 부품을 땜질하는 경우에는 납(Pb)이 40∼70 wt %(중량 퍼센트) 함유한 땜납(solder)이 아직도 널리 사용되고 있으며, 근래에 들어 납(Pb) 성분으로 인한 공해문제로 심각히 지적되고 있다.When soldering electrical and electronic copper and copper alloy parts, solders containing 40 to 70 wt% (weight percent) of lead (Pb) are still widely used, and in recent years, pollution due to lead (Pb) component The problem is seriously pointed out.
이러한 관점에서 본 발명은 납(Pb)을 함유하지 않은 새로운 땜질 합금을 개발함으로써, 중금속인 납(Pb) 성분의 배출을 근원적으로 차단하여 공해를 방지하고, 납(Pb) 성분의 집진설비를 특별히 고려하지 않아도 될 수 있도록 하는 데 기여코자 하였다.In view of this, the present invention develops a new soldering alloy that does not contain lead (Pb), thereby preventing pollution by fundamentally blocking the discharge of lead (Pb), which is a heavy metal, and specially providing a dust collecting facility of lead (Pb). It was intended to contribute to the need not to be considered.
그리고 본 발명인 새로운 땜질 합금에 있어서의 착안점은 땜질온도, 땜질속도, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 납(Pb) 땜질재와 비교하여 손색이 없도록 한 점에 있다.In the new soldering alloy of the present invention, the focus is on the soldering temperature, the soldering speed, the viscosity of the soldering material in the molten state, the wettability with the soldering material, the gloss after the soldering, and the like, compared with the conventional solder (Pb) soldering material. It is in the point that there is no inferiority.
한편, 본 발명인 새로운 땜질 합금은, 주 성분인 주석(Sn)과 아연(Zn)을 약 10 대 1의 비율로 합금하여 주석(Sn)-아연(Zn) 2원합금 상태도 상에서 용융점이 200℃ 정도인 가장 낮은 저융점 공정합금으로 하였다. 그리고 용융상태에서의 점도, 젖음성, 응고속도 및 응고 후 광택 땜질특성을 고려하여 비스므스(Bi)와 안티몬(Sb)을 각각 0.1∼3.0 wt %(중량 퍼센트)의 범위로 합금하였다.On the other hand, the novel brazing alloy of the present invention alloys tin (Sn) and zinc (Zn) at a ratio of about 10 to 1, and the melting point is 200 ° C on the tin (Sn) -zinc (Zn) binary alloy state diagram. It was set as the lowest low melting process alloy of degree. Bismuth (Bi) and antimony (Sb) were alloyed in the range of 0.1 to 3.0 wt% (weight percent), respectively, in consideration of viscosity, wettability, solidification rate, and gloss after soldering.
Description
본 발명은 납(Pb)이 함유되지 않은 땜질(solder)용 주석(Sn)-아연(Zn)-비스므스(Bi)-안티몬(Sb) 합금에 관한 것이다.The present invention relates to a tin (Sn) -zinc (Zn) -bismuth (Bi) -antimony (Sb) alloy for solder that does not contain lead (Pb).
일반적으로 전기 및 전자용 동 및 동합금 부품을 담금땜질하는 경우에는 납(Pb)이 40∼70 wt %(중량 퍼센트) 함유한 땜납(solder)이 아직도 널리 사용되고 있으며, 근래에 들어 납(Pb) 성분으로 인한 공해문제가 심각히 지적되고 있다.Generally, solders containing 40 to 70 wt% (wt.%) Of lead (Pb) are still widely used when quenching electrical and electronic copper and copper alloy parts. The pollution problem caused by this is seriously pointed out.
납(Pb) 성분은 중금속으로서, 일단 몸속에 들어오면 축적되어 인체에 해를 미치므로, 가능한 한 그 사용분야나 외부로의 성분배출을 규제해야하는 물질로 분류됨은 주지의 사실이다.It is well known that lead (Pb) is a heavy metal, and once it enters the body, it accumulates and harms the human body. Therefore, the lead (Pb) component is classified as a substance that should be regulated as far as possible for its field of use or release to the outside.
실제로 납땜질을 수행하는 작업장의 예에서는 납땜을 400∼420℃ 정도의 고온으로 용융하여 땜질작업하므로 공기 중에 납성분이 비산된다는 문제점이 있다.In an example of a workshop that actually performs brazing, there is a problem in that lead components are scattered in the air because the brazing is performed by melting the solder at a high temperature of about 400 to 420 ° C.
따라서 이를 제거하기 위해, 집진장치 등으로써 대기의 오염을 막고는 있으나, 경우에 따라 완벽할 수는 없으며 장치의 설비, 가동 및 보수를 위해 부담하는 경제적 부담이 크다는 문제점이 있다.Therefore, in order to remove this, the pollution of the air with a dust collector, etc., but in some cases can not be perfect, there is a problem that the burden on the installation, operation and maintenance of the device is large.
상기와 같은 문제점을 해결하기 위한 본 발명의 목적은 목적은 땜질온도, 땜질속도, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 다량 납(Pb)을 함유한 땜질재와 비교하여 손색이 없도록 하되, 중금속인 납(Pb)을 전혀 함유하지 않고, 기존의 납(Pb)-주석(Sn) 합금계 땜질재료에 비하여 강도와 도전율을 향상시킴으로써 전자부품 땜질부의 접착강도를 증가시키고 전기비저항을 줄여 노이즈를 감소시키는 저공해의 땜질 합금을 제공하는데 있다.An object of the present invention for solving the above problems is that the soldering temperature, the soldering speed, the viscosity of the soldering material in the molten state, the wettability with the soldered material and the after-soldering effect, such as containing a large amount of lead (Pb) Compared to one soldering material, it has no inferiority, but does not contain any heavy metal lead (Pb) and improves strength and conductivity as compared to conventional lead (Pb) -tin (Sn) alloy-based soldering materials. It is to provide a low pollution soldering alloy to reduce the noise by increasing the adhesive strength and reduce the electrical resistivity.
상기와 같은 본 발명의 목적은 동 및 동합금을 땜질하는 땜질재(solder)로서 납(Pb)을 함유하지 않는 땜질용합금에 있어서,The object of the present invention as described above is in a brazing alloy that does not contain lead (Pb) as a solder (solder) for brazing copper and copper alloy,
0.1∼3.0 wt %(중량 백분율)비스므스(Bi), 0.1∼3.0 wt %(중량 백분율)안티몬(Sb) ; 나머지는 주석(Sn)과 아연(Zn)으로 조성하되 주석(Sn) : 아연(Zn)의 조성비가 10 : 1로 조성되는 것을 특징으로 하는 납(Pb)이 함유되지 않은 땜질(solder)용 주석(Sn)-아연(Zn)-비스므스(Bi)-안티몬(Sb) 합금을 제공함으로써 달성된다.0.1-3.0 wt% (weight percentage) bismuth (Bi), 0.1-3.0 wt% (weight percentage) antimony (Sb); The remainder is composed of tin (Sn) and zinc (Zn), but the tin (Sn): lead tin (solder) containing no lead (Pb), characterized in that the composition ratio of zinc (Zn) is 10: 1 It is achieved by providing a (Sn) -zinc (Zn) -bismuth (Bi) -antimony (Sb) alloy.
상기한 바와 같은 목적을 달성하고 종래의 결점을 제거하기 위한 과제를 수행하는 본 발명의 실시예인 구성과 그 작용을 상세히 설명하면 다음과 같다.When explaining the configuration and the operation of the embodiment of the present invention to achieve the object as described above and to perform the problem for removing the conventional defects in detail.
본 발명은 땜질 합금은, 주 성분인 주석(Sn)과 아연(Zn)을 10 : 1의 비율로 합금하여 주석(Sn)-아연(Zn) 2원합금 상태도 상에서 용융점이 200℃ 정도인 가장 낮은 저융점 공정합금으로 하였다.In the present invention, the brazing alloy is alloyed with tin (Sn) and zinc (Zn), which are the main components, in a ratio of 10: 1, and has a melting point of about 200 ° C. on the tin (Sn) -zinc (Zn) binary alloy state diagram. A low low melting eutectic alloy was used.
그리고 용융상태에서의 점도, 젖음성, 응고속도, 응고 후 광택 및 땜질재 강도 등의 땜질특성을 고려하여 비스므스(Bi)와 안티몬(Sb)을 각각 0.1∼3.0 wt %(중량 퍼센트)의 범위로 합금하였다.The bismuth (Bi) and the antimony (Sb) were each in the range of 0.1 to 3.0 wt% (weight percent) in consideration of the soldering characteristics such as viscosity, wettability, solidification rate, post-solidification gloss and strength of the brazing material. Alloyed.
여기서 용융점이 271℃인 비스므스(Bi)와 용융점이 631℃인 안티몬(Sb)의 함량을 허용된 범위 내에서 상대적으로 가감하면 땜질재의 용융점을 다소 조절할 수 있으며, 이는 결국 땜질온도를 조절하는 방안이 된다.Here, if the content of bismuth (Bi) having a melting point of 271 ° C and antimony (Sb) having a melting point of 631 ° C is relatively decreased within the allowable range, the melting point of the brazing material can be controlled a little, which in turn controls the soldering temperature. Becomes
이하 본 발명의 가장 바람직한 실시예를 설명하겠다.Hereinafter, the most preferred embodiment of the present invention will be described.
[실시예]EXAMPLE
먼저 주석(Sn), 아연(Zn) 및 안티몬(Sb)을 평량하여 함께 장입하고 석조중의 용탕온도를 450∼500℃의 범위로 유지하고 가열하면 기지원소인 주석(Sn)과 공정합금이며 다량 첨가원소인 아연(Zn)의 순서로 용해된다.First, tin (Sn), zinc (Zn), and antimony (Sb) are charged and charged together, and the molten metal in the stone is kept in the range of 450 ~ 500 ℃, and heated, tin (Sn) and the process alloy. It is dissolved in the order of zinc (Zn) which is an additional element.
이들의 대부분이 용해되고 용탕 위에 고융점 원소인 안티몬(Sb)만 떠 있으면 균일한 합금을 얻을 수 있도록 가끔 조용한 방법으로 용탕을 저어주어 안티몬(Sb)의 용해를 촉진시킨다.If most of them are dissolved and only floating antimony (Sb), which is a high melting point element, is stirred on the molten metal in a quiet manner to promote dissolution of antimony (Sb).
그리고 안티몬(Sb)이 거의 다 녹는 시점에서 석조의 온도가 350℃ 이하가 되도록 가열을 낮추고 비스므스(Bi)를 첨가 후 조용히 교반하여 용해 및 합금시킨다.When the antimony (Sb) is almost dissolved, the heating is lowered so that the temperature of the masonry is 350 ° C. or lower, and after the addition of bismuth (Bi), the solution is stirred and dissolved to dissolve and alloy.
다음의 표 1은 본 발명의 땜질합금 중에서 몇 가지 대표적인 화학성분의 예이며, 표 2는 침적땜질법(dipping)에 의한 각 합금의 적정 땜질온도 및 땜질결과를 나타낸 것으로, 실용조건에 충분히 만족하고 있다.Table 1 below shows examples of some representative chemical components of the soldering alloy of the present invention, and Table 2 shows proper soldering temperatures and soldering results of the respective alloys by dipping, and satisfies practical conditions. have.
상기와 같은 본 발명의 합금은 땜질온도, 땜질속도, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 다량 납(Pb)을 함유한 땜질재와 비교하여 손색이 없으며, 또한 중금속인 납(Pb)의 함량이 없어 중금속 오염의 문제가 없으면서도, 기존의 납(Pb)-주석(Sn) 합금계 땜질재료에 비하여 강도와 도전율을 향상시킴으로써 전자부품 땜질부의 접착강도를 증가시키고 전기비저항을 줄여 노이즈를 감소시키는 등의 효과가 있다.The alloy of the present invention as described above compares the effects of the soldering temperature, the soldering speed, the viscosity of the soldering material in the molten state, the wettability with the soldering material and the gloss after soldering, compared with the conventional soldering material containing a large amount of lead (Pb). Soldering electronic components by improving strength and conductivity, compared to conventional lead (Pb) -tin (Sn) alloy-based soldering materials, without the problem of heavy metal contamination due to no content of lead (Pb), which is a heavy metal. It has the effect of reducing the noise by increasing the negative adhesive strength and reducing the electrical resistivity.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950012937A KR0156649B1 (en) | 1995-05-19 | 1995-05-19 | The solder alloy of sn-zn-bi-sb for pb free |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950012937A KR0156649B1 (en) | 1995-05-19 | 1995-05-19 | The solder alloy of sn-zn-bi-sb for pb free |
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| Publication Number | Publication Date |
|---|---|
| KR960040548A KR960040548A (en) | 1996-12-17 |
| KR0156649B1 true KR0156649B1 (en) | 1998-11-16 |
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| KR1019950012937A KR0156649B1 (en) | 1995-05-19 | 1995-05-19 | The solder alloy of sn-zn-bi-sb for pb free |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100593774B1 (en) * | 2001-06-01 | 2006-07-03 | 닛본 덴끼 가부시끼가이샤 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| KR100666007B1 (en) * | 2005-03-14 | 2007-01-09 | 신생금속(주) | A tin zinc solder wire for film condenser |
-
1995
- 1995-05-19 KR KR1019950012937A patent/KR0156649B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100593774B1 (en) * | 2001-06-01 | 2006-07-03 | 닛본 덴끼 가부시끼가이샤 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| KR100666007B1 (en) * | 2005-03-14 | 2007-01-09 | 신생금속(주) | A tin zinc solder wire for film condenser |
Also Published As
| Publication number | Publication date |
|---|---|
| KR960040548A (en) | 1996-12-17 |
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