KR970000430A - Tin (Sn) -zinc (Zn) -aluminum (Al) -bismuth (Bi) alloys for solders that do not contain lead (Pb) - Google Patents

Tin (Sn) -zinc (Zn) -aluminum (Al) -bismuth (Bi) alloys for solders that do not contain lead (Pb) Download PDF

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Publication number
KR970000430A
KR970000430A KR1019950019318A KR19950019318A KR970000430A KR 970000430 A KR970000430 A KR 970000430A KR 1019950019318 A KR1019950019318 A KR 1019950019318A KR 19950019318 A KR19950019318 A KR 19950019318A KR 970000430 A KR970000430 A KR 970000430A
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South Korea
Prior art keywords
soldering
alloy
lead
tin
zinc
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KR1019950019318A
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Korean (ko)
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KR0156647B1 (en
Inventor
김창주
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서상기
한국기계연구원
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Priority to KR1019950019318A priority Critical patent/KR0156647B1/en
Publication of KR970000430A publication Critical patent/KR970000430A/en
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Publication of KR0156647B1 publication Critical patent/KR0156647B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating With Molten Metal (AREA)

Abstract

전기 및 전자용 동 및 동합금 부품을 담금땜질하는 경우에는 납(Pb)이 40~70wt％(중량 퍼센트0 함유한 땜납(solder)이 아직도 널리 사용되고 있으며, 근래에 들어 납(Pb) 선분으로 인한 공해문제가 심각히 지적되고 있다.Solders containing 40 to 70 wt% lead (weight percent 0) are still widely used for quenching electrical and electronic copper and copper alloy parts. The problem is seriously pointed out.

이러한 관점에서 본 발명은 납(Pb)을 함유하지 않은 새로운 땜질 합금을 개발함으로써, 중금속인 납(Pb) 성분의 배출을 근원적으로 차단하여 공해를 방지하고, 납(Pb) 성분을 방출시키지 못하게 하는 집진설비를 특별히 고려하지 않아도 될 수 있도록 하는데 기여코자 하였다.In view of this, the present invention develops a new soldering alloy that does not contain lead (Pb), thereby fundamentally blocking the discharge of lead (Pb), which is a heavy metal, to prevent pollution and prevent the release of lead (Pb). The purpose of this study was to contribute to avoiding the special consideration of dust collection equipment.

그리고 본 발명인 새로운 땜질 합금에 있어서의 착안점은 땜질온도, 땜질재의 도포성, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 납(Pb) 땜질재와 비교하여 손색이 없도록 한 점에 있다.In the new soldering alloy of the present invention, the focus of the present invention is that the soldering temperature, the coating property of the soldering material, the viscosity of the soldering material in the molten state, the wettability with the soldering material, the gloss after the soldering, and the like are compared with the conventional lead (Pb) soldering material. Compared to the point that there is no inferiority.

한편, 본 발명인 새로운 땜질 합금은, 우선 주석(Sn)과 아연(Zn)의 합금비율을 약 10대1로 하여 주석(Sn)-아연(Zn) 2원합금 상태도 상에서 용융점이 200℃ 정도로 낮은 공정합금으로 하였다. 그리고 용융상태에서의 점도, 피접물에 대한 젖음성, 도포성, 응고 후 광택 등의 땜질특성을 고려하여 알루미늄(Al)과 비스므스(Bi)를 각각 0.3~3.0wt％(중량 퍼센트)와 0.5~5.0wt％(중량 퍼센트)의 범위로 합금하였다.On the other hand, the new brazing alloy of the present invention, the alloy ratio of tin (Sn) and zinc (Zn) is about 10 to 1, the melting point is as low as 200 ℃ on the tin (Sn) -zinc (Zn) binary alloy state diagram It was set as a process alloy. The aluminum (Al) and bismuth (Bi) were 0.3-3.0 wt% (weight percent) and 0.5-, respectively, in consideration of the soldering characteristics such as viscosity in the molten state, wettability to the adherend, coating property, gloss after solidification, and the like. Alloyed in the range of 5.0 wt% (weight percent).

Description

납(Pb)이 함유되지 않은 땜질(solder)용 주석(Sn)-아연(Zn)-알루미늄(Al)-비스므스(Bi) 합금Tin (Sn) -zinc (Zn) -aluminum (Al) -bismuth (Bi) alloys for solders that do not contain lead (Pb)

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (2)

동 및 동합금을 땜질하는 담금땜질재(dipping solder)로서 납(Pb)을 함유하지 않는 땜질용 합금에 국한한다.It is limited to an alloy for soldering which does not contain lead (Pb) as a dipping solder for soldering copper and copper alloy. 납(Pb)을 함유하지 않는 땜질재(solder)의 합금성분은 다음과 같이 국한한다.Alloying elements of the solder containing no lead (Pb) are limited as follows. (1) 알루미늄(Al) : 0.3~3.0wt％(중량 백분률)(1) Aluminum (Al): 0.3 to 3.0 wt% (weight percentage) (2) 비스므스(Bi) : 0.5~5.0wt％(중량 백분률)(2) Bismuth (Bi): 0.5-5.0 wt% (weight percentage) (3)주석(Sn)과 아연(Zn) : 나머지로서 주석(Sn) 대 아연(Zn)의 합금비율을 약 10대1로 한다.(3) Tin (Sn) and zinc (Zn): The balance of tin (Sn) to zinc (Zn) is about 10: 1. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950019318A 1995-06-28 1995-06-28 The solder alloy of sn-zn-al-bi for pb free KR0156647B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950019318A KR0156647B1 (en) 1995-06-28 1995-06-28 The solder alloy of sn-zn-al-bi for pb free

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950019318A KR0156647B1 (en) 1995-06-28 1995-06-28 The solder alloy of sn-zn-al-bi for pb free

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KR970000430A true KR970000430A (en) 1997-01-21
KR0156647B1 KR0156647B1 (en) 1998-11-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200449425Y1 (en) * 2007-08-31 2010-07-08 주식회사 제일벽지 Model attach and separate wallpaper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200449425Y1 (en) * 2007-08-31 2010-07-08 주식회사 제일벽지 Model attach and separate wallpaper

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Publication number Publication date
KR0156647B1 (en) 1998-11-16

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