KR960040547A - Tin (Sn) -zinc (Zn) -bismuth (Bi) -antimony (Sb) -lead (Pb) alloys for solder with a very low lead (Pb) content - Google Patents

Tin (Sn) -zinc (Zn) -bismuth (Bi) -antimony (Sb) -lead (Pb) alloys for solder with a very low lead (Pb) content Download PDF

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Publication number
KR960040547A
KR960040547A KR1019950012936A KR19950012936A KR960040547A KR 960040547 A KR960040547 A KR 960040547A KR 1019950012936 A KR1019950012936 A KR 1019950012936A KR 19950012936 A KR19950012936 A KR 19950012936A KR 960040547 A KR960040547 A KR 960040547A
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KR
South Korea
Prior art keywords
lead
soldering
alloy
zinc
tin
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KR1019950012936A
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Korean (ko)
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KR0156648B1 (en
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김창주
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서상기
한국기계연구원
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Priority to KR1019950012936A priority Critical patent/KR0156648B1/en
Publication of KR960040547A publication Critical patent/KR960040547A/en
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Publication of KR0156648B1 publication Critical patent/KR0156648B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

전기 및 전자용 동 및 동합금 부품을 땜질하는 경우에는 납(Pb)이 40∼70 wt%(중량 퍼센트) 함유한 땜납(solder)이 아직도 널리 사용되고 있으며, 근래에 들어 납(Pb) 성분으로 인한 공해문제로 심각히 지적되고 있다.When soldering electrical and electronic copper and copper alloy parts, solder containing 40 to 70 wt% (wt%) of lead (Pb) is still widely used, and in recent years, pollution caused by lead (Pb) component The problem is seriously pointed out.

이러한 관점에서 본 발명은 납(Pb)의 함량을 극히 미량으로 줄인 새로운 땜질 합금을 개발함으로써, 중금속인 납(Pb) 성분의 배출을 근원적으로 억제하여 공해를 방지하고, 납(Pb) 성분의 집진설비를 특별히 고려하지 않아도 될 수 있도록 하는 데 기여코자 하였다.In view of the above, the present invention develops a new brazing alloy having an extremely small amount of lead (Pb), thereby preventing pollution by fundamentally suppressing the emission of lead (Pb), which is a heavy metal, and collecting dust of lead (Pb). The aim was to contribute to the need for no special consideration of the installation.

그리고 본 발명인 새로운 땜질 합금에 있어서의 착안점은 땜질온도, 땜질속도, 용융상태에서의 땜질재의 점도, 피 땜질재와의 젖음성 및 땜질 후 광택 등의 효과를 종래의 다량 납(Pb)을 함유한 땜질재와 비교하여 손색이 없도록 한 점에 있다.In the new soldering alloy of the present invention, the focus point is the soldering temperature, the soldering speed, the viscosity of the soldering material in the molten state, the wettability with the soldering material, the gloss after the soldering, and the like. Compared to ash, it is intact.

한편, 본 발명인 새로운 땜질 합금은, 주 성분인 주석(Sn)과 아연(Zn)을 약 10 대 1 의 비율로 합금하여 주석(Sn)-아연(Zn) 2원 합금 상태도 상에서 용융점이 200℃ 정도인 가장 낮은 저융점 공정합금으로 하였다. 그리고 용융 상태에서의 점도, 젖음성, 응고속도 및 응고 후 광택 등의 땜질특성을 고려하여 비스무스(Bi)와 안티몬(Sb)을 각각 0.1∼3.0 wt%(중량 퍼센트), 납(Pb)을 0.1∼3.0 wt%(중량 퍼센트)의 범위로 합금하였다.On the other hand, the novel brazing alloy of the present invention alloys tin (Sn) and zinc (Zn) at a ratio of about 10 to 1, and has a melting point of 200 ° C on the state of tin (Sn) -zinc (Zn) binary alloy. It was set as the lowest low melting process alloy of degree. Bismuth (Bi) and antimony (Sb) 0.1 to 3.0 wt% (weight percent) and lead (Pb) 0.1 to Alloyed in the range of 3.0 wt% (weight percent).

Description

납(Pb)의 함량을 미량으로 줄인 땜질(solder)용 주석(Sn)-아연(Zn)-비스무스(Bi)-안티몬(Sb)-납(Pb) 합금Tin (Sn) -zinc (Zn) -bismuth (Bi) -antimony (Sb) -lead (Pb) alloys for solders with very low lead (Pb) content

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (2)

동 및 동합금을 땜질하는 땜질재(solder)로서 미량의 납(Pb)을 함유하는 땜질용 합금에 국한한다.It is limited to soldering alloys containing trace amounts of lead (Pb) as solders for soldering copper and copper alloys. 미량의 납(Pb)을 함유하는 땜질재(solder)의 합금성분을 다음과 같이 국한한다.The alloying components of the solder containing trace amounts of lead (Pb) are limited as follows. (1) 비스무스(Bi) : 0.1∼3.0 wt%(중량 백분률)(1) Bismuth (Bi): 0.1 to 3.0 wt% (weight percentage) (2) 안티몬(Sb) : 0.1∼3.0 wt%(중량 백분률)(2) Antimony (Sb): 0.1-3.0 wt% (weight percentage) (3) 납(Pb) : 0.1∼3.0 wt%(중량 백분률)(3) Lead (Pb): 0.1 to 3.0 wt% (weight percentage) (4) 주석(Sn)과 아연(Zn) : 나머지로서 주석(Sn) 대 아연(Zn)의 합금비율을 약 10 대 1 로 한다.(4) Tin (Sn) and zinc (Zn): The balance of tin (Sn) to zinc (Zn) is about 10: 1. ※ 참고사항 : 최초출원 내용에 의한 것임.※ Note: This is based on the initial application.
KR1019950012936A 1995-05-19 1995-05-19 The solder alloy of sn-zn-bi-sb-pb for reducing pb KR0156648B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950012936A KR0156648B1 (en) 1995-05-19 1995-05-19 The solder alloy of sn-zn-bi-sb-pb for reducing pb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950012936A KR0156648B1 (en) 1995-05-19 1995-05-19 The solder alloy of sn-zn-bi-sb-pb for reducing pb

Publications (2)

Publication Number Publication Date
KR960040547A true KR960040547A (en) 1996-12-17
KR0156648B1 KR0156648B1 (en) 1998-11-16

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KR1019950012936A KR0156648B1 (en) 1995-05-19 1995-05-19 The solder alloy of sn-zn-bi-sb-pb for reducing pb

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KR0156648B1 (en) 1998-11-16

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