KR0152425B1 - Aligner - Google Patents
AlignerInfo
- Publication number
- KR0152425B1 KR0152425B1 KR1019980005700A KR19980005700A KR0152425B1 KR 0152425 B1 KR0152425 B1 KR 0152425B1 KR 1019980005700 A KR1019980005700 A KR 1019980005700A KR 19980005700 A KR19980005700 A KR 19980005700A KR 0152425 B1 KR0152425 B1 KR 0152425B1
- Authority
- KR
- South Korea
- Prior art keywords
- aligner
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/074—Features related to the fluid pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4298087A JP2509134B2 (ja) | 1992-10-09 | 1992-10-09 | プリント配線基板の露光方法及び装置 |
JP4350226A JPH0822571B2 (ja) | 1992-12-04 | 1992-12-04 | 露光装置におけるフィルムの加圧装置 |
JP5242220A JPH0772552A (ja) | 1993-09-03 | 1993-09-03 | 露光装置 |
KR1019930020824A KR100205199B1 (ko) | 1992-10-09 | 1993-10-08 | 필름마스크를 이용한 노광방법 및 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR0152425B1 true KR0152425B1 (en) | 1999-10-01 |
Family
ID=27333020
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930020824A KR100205199B1 (ko) | 1992-10-09 | 1993-10-08 | 필름마스크를 이용한 노광방법 및 장치 |
KR1019980005700A KR0152425B1 (en) | 1992-10-09 | 1998-02-24 | Aligner |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930020824A KR100205199B1 (ko) | 1992-10-09 | 1993-10-08 | 필름마스크를 이용한 노광방법 및 장치 |
Country Status (3)
Country | Link |
---|---|
KR (2) | KR100205199B1 (ko) |
GB (1) | GB2271430A (ko) |
TW (1) | TW329340U (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5970310A (en) * | 1996-06-12 | 1999-10-19 | Hitachi, Ltd. | Method for manufacturing multilayer wiring board and wiring pattern forming apparatus |
JP3678144B2 (ja) * | 2000-12-22 | 2005-08-03 | ウシオ電機株式会社 | フィルム回路基板の周辺露光装置 |
JP2003029414A (ja) * | 2001-07-19 | 2003-01-29 | Adtec Engineeng Co Ltd | 露光装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04225360A (ja) * | 1990-12-26 | 1992-08-14 | Adotetsuku Eng:Kk | プリント配線基板の製造におけるフィルムマスクの密着方法及びその装置 |
-
1993
- 1993-09-25 TW TW086209914U patent/TW329340U/zh unknown
- 1993-09-28 GB GB9319933A patent/GB2271430A/en not_active Withdrawn
- 1993-10-08 KR KR1019930020824A patent/KR100205199B1/ko not_active IP Right Cessation
-
1998
- 1998-02-24 KR KR1019980005700A patent/KR0152425B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB9319933D0 (en) | 1993-11-17 |
KR940010872A (ko) | 1994-05-26 |
TW329340U (en) | 1998-04-01 |
KR100205199B1 (ko) | 1999-07-01 |
GB2271430A (en) | 1994-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A107 | Divisional application of patent | ||
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130102 Year of fee payment: 16 |
|
EXPY | Expiration of term |