KR0151738B1 - Chip mounter for adjusting width between two heads and rotating circuit board - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a width adjustment between two heads and a circuit board rotating chip mounter that allows simultaneous insertion and mounting of a chip-type electronic component by a two-head adjustable width. In a chip mounter that sucks and mounts a chip on a circuit board by a pair of heads mounted on the XY orthogonal robot 2 on the frame 1, the width between the two heads I ₁ and I ₂ can be adjusted. The head unit 13 configured and the circuit board positioning unit 6 configured to rotate the completed circuit board 8 can be configured to simultaneously suck and mount electronic components (chips). will be.

Description

Width-to-Head Width and Circuit Board Rotary Chip Mounters

1 is an explanatory diagram showing chip suction and mounting of a conventional chip mounter.

2 is a perspective view showing the configuration of the present invention.

3 is an explanatory diagram for explaining a state in which a chip is sucked and mounted in accordance with the present invention.

4 is a block diagram of a two-head unit of the present invention.

5 and 6 are mounting position calculation chart according to the present invention.

* Explanation of symbols for main parts of the drawings

1: mainframe 2: XY orthogonal robot

6: Circuit Board Positioning Unit 8: Circuit Board

14: Head width moving motor 15: Circuit board positioning unit rotation part

151: roller 153: coupling part

16: Servomotor I ₁ , I ₂ : Head

㉮: Spiral drive shaft ㉯: Pulley

㉰: motor for nozzle shaft movement ㉱: timing belt

㉲: Spiral shaft ㉳: Nozzle

㉴: θaxis motor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a width adjustment between two heads for mounting a chip-shaped electronic component on a circuit board and a circuit board rotating chip mounter. The present invention relates to a width adjustment between two heads and a circuit board rotating chip mounter for suction and mounting.

The conventional general chip mounter includes two heads I ₁ and I ₂ , an XY table for moving the heads, a supply unit H for supplying chips, and a positioning unit (as shown in FIG. ₁ ). u) and positioning pins (P) and a circuit board (PCB) positioning unit for fixing the circuit board (U), a reference rail for loading and unloading the circuit board to the circuit board positioning unit (U) ( R) and the moving (variable) rail r.

In the mounting process, the circuit board is first loaded into the circuit board positioning unit U through the rails R and r.

Thereafter, the circuit board positioning unit U determines and fixes the position of the circuit board.

When the positioning of the circuit board is completed, the head I ₁ is moved to the adsorption position ① specified in the program so that one chip is adsorbed.

After that, the head I ₂ is moved to a predetermined adsorption position ② to adsorb the two chips.

In this way, when the chip is sucked, the head I ₁ is moved to the predetermined mounting position ⑤ to mount one chip, and then the head I ₂ is moved to the predetermined mounting position ⑥ to mount the remaining chips. The suction and mounting stroke is completed.

However, in the conventional technical means operated as described above, the two heads I ₁ and I ₂ are fixed to perform individual adsorption and individual mounting, which leads to an excessive demand for mounting time and mounting. There was a problem that causes a decrease in efficiency.

The present invention has been made in order to solve the conventional drawbacks as described above, the two-head (Two) that can significantly shorten the mounting time by the simultaneous suction, mounting means of the two-head and maximize the mounting efficiency (Two The purpose is to provide a width adjustment between the head and the circuit board rotary chip mounter (Chip Mounter).

As a characteristic element of the present invention for achieving the above object, two heads (I ₁ ), (I ₂ ) and the servo motor (I) to automatically adjust the head width in order to execute the individual suction, mounting by simultaneous suction, mounting 16) and a spiral drive shaft (A), and a circuit board (8) supplied from an XY table (2) and a loader (4) capable of moving the two head unit (13) to a designated position. By the circuit board positioning unit 6 which can be received and fixed, and the rotation part 15 and the servomotor 16 which can rotate the circuit board positioning unit 6 at the time of simultaneous mounting of a chip,

Upon adsorption; The XY table moves the head unit to one stage ① specified in the program, and at the same time, the head width moving motor is rotated to fit the predetermined suction points (F ₁ ) and (F ₂ ), and the width of the head is adjusted and adsorbed. ,

When mounted; The two mounting point ② specified group from the program (P _1), the head both in (P ₂₎ about the (P ₁₎ to calculate the relative distance and an angle (θ) of (P _2), to match the calculated distance ( While adjusting the width of I ₁ ) and (I ₂ ), the circuit board positioning unit 6 is rotated in the opposite direction (-θ) by the calculated angle, and the coordinates of the mounting point are calculated by the rotation. The centers of the two heads are matched using the XY table. At this time, the rotation of the θ axis of the two heads is corrected to compensate for the phenomenon that the mounting direction of the chip components and the direction of the circuit board pattern are shifted by θ while the circuit board positioning unit rotates. The mounting direction of the chip parts is rotated by -θ using a motor so that the mounting direction can be adjusted and mounted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Above the main frame 1, an XY orthogonal robot 2, which is an X-Y table for moving the head to a predetermined position in the program, is provided to be supported by the frame 3.

One side of the XY orthogonal robot 2 is provided with a loader 4 which is a path for feeding the circuit board 8 into the circuit board positioning part, and the other side of the XY orthogonal robot 2 is provided with the circuit board 8 in the circuit board positioning part. The unloader 5 which is a path | route to discharge is each installed and comprised.

In the center of the main base 1, a circuit board positioning unit 6 for fixing the circuit board 8 is provided. In front of the unit 6, a chip (mounting part) can be sucked by the head. The component supply part 9 to supply is comprised.

On the other hand, in the orthogonal robot 2, parts mounting heads I ₁ and I ₂ having respective head motors are provided in the form of two heads so that the mounting direction θ at the time of chip mounting can be adjusted. .

In the loader 4 and the unloader 5, cylinders 11, 11 'and forward and backward operating for loading and unloading the circuit board 8 in the circuit board positioning unit 6 are rotated. The drive motor 12 which performs a stop function is provided and comprised.

In addition, the head for mounting the parts (I ₁ ), (I ₂ ) is a two-head unit (13) having a lane interval that can be simultaneously adsorbed by forming a nozzle shaft inward from the moving portion so that the mutual width (interval) to achieve a minimum value Installed in

The two-head unit 13 includes a nozzle shaft moving motor ㉲ having a spiral shaft 시키는 for converting a rotational motion from the motor into a vertical movement of the nozzle and configured of a servo motor so as to know the height of the nozzle; A θ-axis motor 하는 rotating along the mounting direction of the chip; It consists of a combination of ultra-fine nozzles for easy chip adsorption.

In addition, the head head moving motor 14 is provided on the side of the two head unit 13, and the spirals are different in the spiral direction so that the widths of the two heads can be adjusted (opened and narrowed) according to the rotation of the motor. The drive shaft ㉮ and the two helical shaft ㉲ are installed in the reverse direction by a pulley.

In addition, a lower portion of the circuit board positioning unit 6 has a roller 151 for smoothly rotating it, a servo motor 16 for rotating the circuit board positioning unit, and a coupling part 153 for transmitting a rotational motion of the motor. Consists of.

In the figure, reference numeral 10 denotes a circuit board positioning pin for stably fixing the circuit board.

Referring to the effects of the present invention having such a configuration as follows.

First, when the circuit board 8 enters the circuit board positioning unit 6 through the loader 4, the circuit board 8 is positioned (fixed).

After that, change the nozzle of each (I ₁ ) and (I ₂ ) according to the value specified in the program (to use the nozzle suitable for the chip part).

Thereafter, the intermediate positions of the adsorption points F ₁ and F ₂ of the predetermined stage are obtained.

The head is moved by using the XY table to be located at the center of the two heads I ₁ and I ₂ to the intermediate position thus obtained, and at the same time the width between the two suction points F ₁ and F ₂ and the two heads I ₁ The distance between the two heads I ₁ and I ₂ is adjusted by rotating the motor 14 for moving the head so that the widths between the two parts I ₂ and I ₂ coincide.

At the same time as the above operation, the component supply unit 9 supplies components at a predetermined suction point.

When the parts supply operation is completed, each of the heads I ₁ and I ₂ rotates the nozzle axial movement motor 위해 to lower the two heads I ₁ and I _{2 in} order to adsorb the chip components simultaneously. Adsorb the components simultaneously (see Figure 4).

After the adsorption is completed, the two shafts I ₁ and I ₂ are simultaneously raised by rotating the motor 용 for moving the nozzle shaft.

When the ascent is completed, at P1 and P2 of the mounting position ②, the relative distance of P2 to P1 is calculated around the mounting point P1, and the head moving motor ㉰ is rotated to match the calculated distance with the head widths.

At the same time, calculate the relative angle of P2 with respect to P1 centering on P1 of mounting point ② (the calculated angle is called θ), then move the axis of the two head axes (same as the axis movement direction of X axis) and P1 of mounting point ② The servomotor 16 is rotated by -θ so that and P2 are in parallel.

According to the rotation, the coordinates on which the parts are to be mounted are moved, and the coordinate values P1 and P2 are the same as in FIG.

That is, when the final mounting coordinates are P1 'and P2', the two point coordinates x1 'and y1' of P1 'are

x1 '= (-xa) cosθ + (-ya) sinθ + xa

y1 '= (xa) sinθ + (-ya) cosθ + ya

Become,

The two point coordinates of P2 ', x2' and y2 ',

x2 '= (-xa) cosθ + (-ya) sinθ + xa

y2 '= (xa) sinθ + (-ya) cosθ + ya

Becomes

Two heads in the middle position of the two mounting point obtained in the (I _1), Do (I ₂₎ center-to circuit board 8 is rotated matching at the same time by moving the XY table, the two heads (I _1), (I ₂₎ Move it.

Thereafter, when the circuit board 8 rotates, the direction in which the chip is mounted and the pattern direction of the circuit board 8 are different from each other, so that the two heads I ₁ and I ₂ simultaneously with the rotation of the circuit board positioning unit 6. Rotate the two heads by -θ using the rotating motor㉴ of.

When the above operation is completed, since the state can be mounted at the same time by using the lower motor 하 of the two heads to lower at the same time.

Subsequently, when the operation is completed, the vacuum of the two heads is broken to simultaneously detach and detach the two chip parts attached to the nozzle ㉳.

When the operation is completed, the two heads I ₁ and I ₂ rotate the head raising motor 상승 to raise.

As the operation is completed, one cycle is completed.

On the other hand, in order to simultaneously mount and install the chip components, the heads I ₁ and I ₂ are moved to F3 and F4 at the next suction point ③, and the above-described one cycle is repeated and the unloader 5 is completed. The circuit board 8 is carried out by using an unloading device having a).

Therefore, the simultaneous adsorption of the chip components at the two adsorption points F1 and F2 is possible, and the simultaneous mounting at the two points P1 and P2, which are mounting points, can be enabled.

It is noted that it is preferable to simultaneously perform the width adjustment between the two heads, the rotation of the circuit board positioning unit, the movement of the XY table, and the θ-axis rotation of the two heads in the above process.

As described above, according to the width adjustment between the two heads of the present invention and the circuit board rotating chip mounter, the head moves to an adsorption point to simultaneously adsorb two chips, and then moves to a mounting point to perform simultaneous mounting. As well as shortening the mounting time, it is expected to maximize the mounting efficiency.

Claims (3)

In a chip mounter that sucks and mounts a chip on a circuit board by a pair of heads mounted on the XY orthogonal robot 2 on the main frame 1, the width between the two heads I ₁ and I ₂ can be adjusted. The two-head unit 13 and the circuit board positioning unit 6 configured to rotate the completed positioning of the circuit board 8 are configured to simultaneously suck and mount electronic components (chips). Width-to-head and chip-board rotary chip mounters, characterized in that the two-head. The method of claim 1, wherein the two head unit (13); The spiral drive shaft 된 which is fixedly fixed by the pulley ㉯ differently in a spiral direction so that the width (interval) between the heads I ₁ and I ₂ can be adjusted according to the rotation of the head width moving motor 14. It consists of a spiral shaft 시킨 connected to the nozzle shaft movement motor 위한 for raising and lowering the nozzle shaft with a timing belt ㉲, and a yaw shaft motor ㉳ for controlling the nozzle 설치된 installed to move up and down by this helical shaft 특징. Width adjustment between the two heads and the chip mounter. The circuit board positioning unit (6) of claim 1, further comprising: a circuit board positioning unit (6); A circuit board positioning unit rotating part (15) having a roller (151) for smoothly rotating the unit (6) and a coupling part (153) for transmitting the turning force from the servomotor (16). Width adjustable between heads and chip mounter with circuit board rotation.