KR0148228B1 - 플라즈마 처리장치 - Google Patents

플라즈마 처리장치

Info

Publication number
KR0148228B1
KR0148228B1 KR1019940032143A KR19940032143A KR0148228B1 KR 0148228 B1 KR0148228 B1 KR 0148228B1 KR 1019940032143 A KR1019940032143 A KR 1019940032143A KR 19940032143 A KR19940032143 A KR 19940032143A KR 0148228 B1 KR0148228 B1 KR 0148228B1
Authority
KR
South Korea
Prior art keywords
electrodes
electrode
ground shield
narrow gap
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019940032143A
Other languages
English (en)
Korean (ko)
Other versions
KR950015623A (ko
Inventor
스삐까 마시로
Original Assignee
니시히라 순지
아네르바 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니시히라 순지, 아네르바 가부시기가이샤 filed Critical 니시히라 순지
Publication of KR950015623A publication Critical patent/KR950015623A/ko
Application granted granted Critical
Publication of KR0148228B1 publication Critical patent/KR0148228B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H10P50/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32697—Electrostatic control

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
KR1019940032143A 1993-11-30 1994-11-30 플라즈마 처리장치 Expired - Lifetime KR0148228B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29992993A JP3343629B2 (ja) 1993-11-30 1993-11-30 プラズマ処理装置
JP93-299929 1993-11-30

Publications (2)

Publication Number Publication Date
KR950015623A KR950015623A (ko) 1995-06-17
KR0148228B1 true KR0148228B1 (ko) 1998-11-02

Family

ID=17878640

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940032143A Expired - Lifetime KR0148228B1 (ko) 1993-11-30 1994-11-30 플라즈마 처리장치

Country Status (4)

Country Link
US (1) US5502355A (enExample)
JP (1) JP3343629B2 (enExample)
KR (1) KR0148228B1 (enExample)
TW (1) TW262569B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100900595B1 (ko) * 2005-01-28 2009-06-02 어플라이드 머티어리얼스, 인코포레이티드 플라즈마 한정 및 유동 컨덕턴스 강화 방법 및 장치

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6902683B1 (en) 1996-03-01 2005-06-07 Hitachi, Ltd. Plasma processing apparatus and plasma processing method
JP3019002B2 (ja) * 1996-09-20 2000-03-13 日本電気株式会社 ドライエッチング装置及びドライエッチング方法
US6022749A (en) * 1998-02-25 2000-02-08 Advanced Micro Devices, Inc. Using a superlattice to determine the temperature of a semiconductor fabrication process
JP4672169B2 (ja) * 2001-04-05 2011-04-20 キヤノンアネルバ株式会社 プラズマ処理装置
JP4853049B2 (ja) * 2006-03-02 2012-01-11 大日本印刷株式会社 プラズマ処理方法
US9184072B2 (en) * 2007-07-27 2015-11-10 Mattson Technology, Inc. Advanced multi-workpiece processing chamber
JP5264231B2 (ja) 2008-03-21 2013-08-14 東京エレクトロン株式会社 プラズマ処理装置
US9263350B2 (en) * 2014-06-03 2016-02-16 Lam Research Corporation Multi-station plasma reactor with RF balancing
CN108028164B (zh) * 2015-09-11 2020-12-29 应用材料公司 具有开槽接地板的等离子体模块
US20200051793A1 (en) 2018-08-13 2020-02-13 Skc Solmics Co., Ltd. Ring-shaped element for etcher and method for etching substrate using the same
US20240136159A1 (en) * 2022-10-25 2024-04-25 Applied Materials, Inc. Metallic Shield For Stable Tape-Frame Substrate Processing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269620A (ja) * 1985-09-24 1987-03-30 Anelva Corp プラズマ処理装置
JP2918892B2 (ja) * 1988-10-14 1999-07-12 株式会社日立製作所 プラズマエッチング処理方法
US5252892A (en) * 1989-02-16 1993-10-12 Tokyo Electron Limited Plasma processing apparatus
KR0165898B1 (ko) * 1990-07-02 1999-02-01 미다 가쓰시게 진공처리방법 및 장치
US5173641A (en) * 1990-09-14 1992-12-22 Tokyo Electron Limited Plasma generating apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100900595B1 (ko) * 2005-01-28 2009-06-02 어플라이드 머티어리얼스, 인코포레이티드 플라즈마 한정 및 유동 컨덕턴스 강화 방법 및 장치

Also Published As

Publication number Publication date
KR950015623A (ko) 1995-06-17
JPH07153743A (ja) 1995-06-16
US5502355A (en) 1996-03-26
TW262569B (enExample) 1995-11-11
JP3343629B2 (ja) 2002-11-11

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