TW262569B - - Google Patents
Info
- Publication number
- TW262569B TW262569B TW083110238A TW83110238A TW262569B TW 262569 B TW262569 B TW 262569B TW 083110238 A TW083110238 A TW 083110238A TW 83110238 A TW83110238 A TW 83110238A TW 262569 B TW262569 B TW 262569B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29992993A JP3343629B2 (ja) | 1993-11-30 | 1993-11-30 | プラズマ処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW262569B true TW262569B (zh) | 1995-11-11 |
Family
ID=17878640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083110238A TW262569B (zh) | 1993-11-30 | 1994-11-05 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5502355A (zh) |
JP (1) | JP3343629B2 (zh) |
KR (1) | KR0148228B1 (zh) |
TW (1) | TW262569B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI490965B (zh) * | 2007-07-27 | 2015-07-01 | Mattson Tech Inc | 改良的多工件處理室及其裝置與方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6902683B1 (en) | 1996-03-01 | 2005-06-07 | Hitachi, Ltd. | Plasma processing apparatus and plasma processing method |
JP3019002B2 (ja) * | 1996-09-20 | 2000-03-13 | 日本電気株式会社 | ドライエッチング装置及びドライエッチング方法 |
US6022749A (en) * | 1998-02-25 | 2000-02-08 | Advanced Micro Devices, Inc. | Using a superlattice to determine the temperature of a semiconductor fabrication process |
JP4672169B2 (ja) * | 2001-04-05 | 2011-04-20 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
US20060172542A1 (en) * | 2005-01-28 | 2006-08-03 | Applied Materials, Inc. | Method and apparatus to confine plasma and to enhance flow conductance |
JP4853049B2 (ja) * | 2006-03-02 | 2012-01-11 | 大日本印刷株式会社 | プラズマ処理方法 |
JP5264231B2 (ja) * | 2008-03-21 | 2013-08-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US20170076917A1 (en) * | 2015-09-11 | 2017-03-16 | Applied Materials, Inc. | Plasma Module With Slotted Ground Plate |
JP6965313B2 (ja) | 2018-08-13 | 2021-11-10 | エスケーシー ソルミックス カンパニー,リミテッド | エッチング装置用リング状部品及びこれを用いた基板のエッチング方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6269620A (ja) * | 1985-09-24 | 1987-03-30 | Anelva Corp | プラズマ処理装置 |
JP2918892B2 (ja) * | 1988-10-14 | 1999-07-12 | 株式会社日立製作所 | プラズマエッチング処理方法 |
US5252892A (en) * | 1989-02-16 | 1993-10-12 | Tokyo Electron Limited | Plasma processing apparatus |
KR0165898B1 (ko) * | 1990-07-02 | 1999-02-01 | 미다 가쓰시게 | 진공처리방법 및 장치 |
US5173641A (en) * | 1990-09-14 | 1992-12-22 | Tokyo Electron Limited | Plasma generating apparatus |
-
1993
- 1993-11-30 JP JP29992993A patent/JP3343629B2/ja not_active Expired - Fee Related
-
1994
- 1994-11-05 TW TW083110238A patent/TW262569B/zh not_active IP Right Cessation
- 1994-11-21 US US08/345,458 patent/US5502355A/en not_active Expired - Lifetime
- 1994-11-30 KR KR1019940032143A patent/KR0148228B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI490965B (zh) * | 2007-07-27 | 2015-07-01 | Mattson Tech Inc | 改良的多工件處理室及其裝置與方法 |
Also Published As
Publication number | Publication date |
---|---|
KR950015623A (ko) | 1995-06-17 |
JPH07153743A (ja) | 1995-06-16 |
JP3343629B2 (ja) | 2002-11-11 |
KR0148228B1 (ko) | 1998-11-02 |
US5502355A (en) | 1996-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |