KR0144313B1 - Heat Sink Plating Device for Semiconductor Packages - Google Patents
Heat Sink Plating Device for Semiconductor PackagesInfo
- Publication number
- KR0144313B1 KR0144313B1 KR1019940027136A KR19940027136A KR0144313B1 KR 0144313 B1 KR0144313 B1 KR 0144313B1 KR 1019940027136 A KR1019940027136 A KR 1019940027136A KR 19940027136 A KR19940027136 A KR 19940027136A KR 0144313 B1 KR0144313 B1 KR 0144313B1
- Authority
- KR
- South Korea
- Prior art keywords
- tape
- heat sink
- cutting
- semiconductor package
- plating
- Prior art date
Links
Abstract
본 발명은 반도체 패키지의 히트싱크 도금방지용 테이프 접착장치에 관한 것이다. 가이드레일(2)의 소정위치 하부로 테이프(10)를 수납시키는 수납부(3)와 테이프(10)가 안치되어 절단작업을 도와주는 커팅플레이트(4)를 구비하고, 이 상부의 일정 높이에는 테이프(10)를 절단한 후 히트싱크(16)에 부착할 수 있는 테이프 커팅장치(6)를 테이프 부착 작업이 용이하고 대량으로 작업을 수행하여 반도체 패키지의 생산성을 향상시키는 효과가 있다.The present invention relates to a tape bonding apparatus for preventing heat sink plating of a semiconductor package. An accommodating part 3 for accommodating the tape 10 under the predetermined position of the guide rail 2 and a cutting plate 4 that supports the cutting operation by placing the tape 10 therein, and at a predetermined height thereon After cutting the tape 10, the tape cutting device 6, which may be attached to the heat sink 16, may be easily attached to the tape, and the work may be performed in large quantities, thereby improving productivity of the semiconductor package.
Description
제1도는 본 발명의 테이프 접착장치의 전체 구성 개략도1 is a schematic view of the overall configuration of the tape applying apparatus of the present invention
제2도는 본 발명의 테이프 커팅장치 요부 사시도2 is a perspective view of the main portion of the tape cutting device of the present invention
제3도의 (a)(b)(c)는 본 발명의 테이프 커팅장치의 작동 상태도(A) (b) (c) of FIG. 3 is an operating state diagram of the tape cutting device of the present invention.
제4도는 본 발명의 테이프 접착장치로 리드프레임에 몰딩된 패키지에 히트싱크가 덮어지도록 테이프를 접착시키는 상태의 평면도4 is a plan view of a state in which the tape is bonded so that the heat sink is covered on the package molded in the lead frame by the tape bonding apparatus of the present invention.
제5도는 본 발명의 테이프 접착장치로 반도체 패키지의 히트싱크가 테이프로 접착된 상태의 반도체 패키지 구조도5 is a structure diagram of a semiconductor package in which a heat sink of a semiconductor package is bonded with a tape by the tape bonding device of the present invention.
제6도는 본 발명의 접착장치로 이동되는 반도체 패키지의 히트싱크 표면에 부착된 테이프를 압압시키는 상태의 작동 상태도6 is an operational state diagram of a state in which the tape attached to the heat sink surface of the semiconductor package to be moved to the bonding apparatus of the present invention is pressed
*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1:입력매거진2;가이드레일1: input magazine 2; guide rail
3;수납부4;커팅플레이트3; storage part 4; cutting plate
5;요홈6;커팅장치5; groove 6; cutting device
7;커팅펀치8;커팅부7; cutting punch 8; cutting part
9;흡착공10;테이프9; adsorption hole 10; tape
11;압압장치12;푸셔11; pressing device 12; pusher
13;롤러15;리드프레임13; roller 15; lead frame
16;히트싱크17;반도체패키지16; Heatsink 17; Semiconductor Package
본 발명은 반도체 패키지의 히트싱크 도금방지용 테이프 접착장치에 관한 것으로서, 특히 히트싱크(Heat sink)가 실장된 패키지를 도금 처리전에 패키지 표면으로 노출된 히트싱크에 도금방지용 테이프를 접착할 수 있도록 한 반도체 패키지의 히트싱크 도금방지용 테이프 접착장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink plating preventing tape adhering device of a semiconductor package, and more particularly, a semiconductor in which a heat sink mounted package can be attached to a heat sink exposed to the surface of a package before plating treatment. The present invention relates to a tape attaching device for preventing heat sink plating of a package.
일반적으로 반도체 패키지는 컴파운드재로 패키지 완료된 제품의 리드프레임에 솔더로 도금을 실시한다.In general, a semiconductor package is plated with a solder on a lead frame of a packaged product made of a compound material.
그러나, 히트싱크가 실장된 반도체 패키지에서는 솔더도금을 실시하게 되면 패키지의 외부로 노출된 히트싱크의 표면에도 도금이 됨에 따라 이를 제거하는 추가적인 공정이 필요하였다.However, in the semiconductor package in which the heat sink is mounted, when solder plating is performed, the surface of the heat sink exposed to the outside of the package is also plated, and thus an additional process of removing the heat sink is required.
따라서, 이러한 문제점을 보완하고자 도금 공정 수행전에 패키지 외부로 노출된 히트싱크의 표면에 도금방지용 테이프를 작업자가 수공으로 부착하였으나 이는 작업성 저하로 반도체 패키지의 생산성을 저하시켜 결과적으로 인건비 상승 및 제품단가가 높아지는 등의 문제점이 있었다.Therefore, in order to compensate for this problem, a worker attaches a plating prevention tape on the surface of the heat sink exposed to the outside of the package by hand before performing the plating process, but this lowers the productivity of the semiconductor package due to the deterioration of workability and consequently increases labor cost and product cost. There was a problem such as increases.
본 발명은 상기와 같은 종래의 문제점을 해결하기 위하여 안출한 것으로서, 히트싱크가 실장되어 패키지 몰드된 리드프레임을 도금공정전에 도금방지용 테이프를 히트싱크 표면에 부착할 수 있도록 접착장치를 구비하되 입, 출력 매거진 사이의 가이드 레일 소정위치에 상,하로 테이프를 커팅하여 히트싱크 표면에 부착하는 커팅 장치 및 커팅플레이트를 구비하여 된 것을 목적으로 한다.The present invention has been made in order to solve the above-mentioned conventional problems, the heat sink is mounted is provided with an adhesive device to attach the anti-plating tape to the heat sink surface before the plating process of the lead-frame packaged lead frame, An object of the present invention is to provide a cutting device and a cutting plate for cutting a tape up and down at a predetermined position on a guide rail between output magazines and attaching the tape to a heat sink surface.
이하, 첨부된 도면에 의하여 본 발명을 상세하게 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 발명의 테이프 접착장치의 전체구성 개략도로서, 입력매거진(1)에 히트싱크(16)가 실장된 패키지(18) 몰드된 리드프레임(15)을 히트싱크(16)가 상부로 위치되도록 다수개 적재하고 이를 내부의 엘리베이터(도면에 도시되지 않음)를 이용하여 단계적으로 상승시킨 후 스트립푸셔로 적재되어 있는 리드프레임을 밀어주면 그 리드프레임(15)은 가이드레일(2)의 일측에 안착된다.FIG. 1 is a schematic diagram showing the overall structure of the tape bonding apparatus of the present invention, in which the heat sink 16 is positioned upward in the lead frame 15 in which the package 18 in which the heat sink 16 is mounted is mounted on the input magazine 1. Load it as many as possible and raise it step by step using an elevator (not shown in the figure), and then push the lead frame loaded with the strip pusher, and the lead frame 15 is located on one side of the guide rail 2. It is seated.
이때 도금방지용 테이프(10)는 입력매거진(1)과 출력매거진(14)사이에 연결 형성된 가이드레일(20의 소정위치 하부로 구비된 수납부(3)에 적재된 상태에서 테이프(10)가 커팅플레이트(4) 상부면에 안치된다.In this case, the plating preventing tape 10 is cut in the state in which the tape 10 is loaded in the receiving part 3 provided below the predetermined position of the guide rail 20 formed between the input magazine 1 and the output magazine 14. It is placed on the upper surface of the plate 4.
이 상태에서 도면 제3도 (a )(b )(c )에서와 같이 가이드레일(2)상부에 위치한 커팅장치(6)의 커팅펀치(7)가 하부로 하강하여 커팅플레이트(4)에 형성된 요홈(5)으로 커팅펀치(7)가 삽입되면서 커팅플레이트(4) 상부면에 안치된 테이프(10)를 반도체 패키지(17)의 히트싱크(16) 면적에 해당하는 크기만큼 절단시킨다.In this state, the cutting punch 7 of the cutting device 6 located above the guide rail 2 is lowered to a lower portion of the cutting plate 4 as shown in FIG. 3 (a) (b) (c). As the cutting punch 7 is inserted into the recess 5, the tape 10 placed on the upper surface of the cutting plate 4 is cut by a size corresponding to the area of the heat sink 16 of the semiconductor package 17.
이렇게 절단된 테이프(10)는 커팅펀치(7) 내부에 형성된 흡착공(9)의 흡입력으로 테이프(10)가 커팅펀치(7)의 커팅부(8)의 저부면에 흡착된 상태로 유지되고, 이어서 커팅장치(6)의 작동 순서에 따라 커팅펀치(7)가 상부로 상승하게 된다.The tape 10 thus cut is maintained in a state in which the tape 10 is adsorbed to the bottom surface of the cutting portion 8 of the cutting punch 7 by the suction force of the suction hole 9 formed in the cutting punch 7. Subsequently, the cutting punch 7 is raised upward according to the operation order of the cutting device 6.
이렇게 테이프(10)를 절단시켜 가이드레일(2)상부의 소정위치에 커팅장치(6)의 커팅펀치(7)에 절단된 테이프(10)가 부착된 상태로 유지되면 입력매거진(1)에서 이동하는 패키지(18)몰드된 리드프레임(15)이 이동하여 가이드레일(2)을 따라 테이프 접착장치의 커팅장치(6)로 이동된다.When the tape 10 is cut and the tape 10 cut to the cutting punch 7 of the cutting device 6 is maintained at a predetermined position on the guide rail 2, the tape 10 is moved in the input magazine 1. The molded lead frame 15 is moved to the cutting device 6 of the tape bonding apparatus along the guide rail 2.
패키지 몰드된 리드프레임(15)이 커팅장치(6) 하측부위에 놓여지면 커팅장치(6)가 하강하여 커팅펀치(7)의 커팅부(8) 저부면에 흡착된 테이프(10)를 리드프레임(15)의 히트싱크(16)표면에 접착시킨다.When the package-molded lead frame 15 is placed on the lower portion of the cutting device 6, the cutting device 6 is lowered, and the tape 10 adsorbed to the bottom surface of the cutting portion 8 of the cutting punch 7 is lead frame. It adhere | attaches on the surface of the heat sink 16 of (15).
이렇게 히트싱크(16)에 테이프(10)가 접착되면 커팅펀치(7)는 테이프(10)와 분리된 후 상부측으로 상승 회복되고, 리드프레임(15)은 가이드레일(2)을 따라 출력매거진(14)측으로 이송되며, 이어서 커팅플레이트(4)와 출력매거진(14)사이에 구비된 압압장치(11)에 의해 히트싱크(16)표면에 부착된 테이프(10)를 압압시킨다.When the tape 10 is attached to the heat sink 16 in this manner, the cutting punch 7 is separated from the tape 10 and then recovered upward. The lead frame 15 is disposed along the guide rail 2. 14), and then the tape 10 attached to the surface of the heat sink 16 is pressed by the pressing device 11 provided between the cutting plate 4 and the output magazine 14.
상기 압압장치(11)는 도면 제6도에서와 같이 압압롤러(13)가 푸셔(12)와 연결되어 가이드레일(2)을 따라 이송하는 리드프레임(15)의 히트싱크(16) 표면에 부착된 테이프(10)를 왕복으로 푸셔(12)에 의해 이송하는 롤러(13)를 이동시켜 복수회 이상 압압시킴에 따라 테이프(10)의 접착력을 향상시키도록 한다.The pressing device 11 is attached to the surface of the heat sink 16 of the lead frame 15, the pressing roller 13 is connected to the pusher 12 and transported along the guide rail 2 as shown in FIG. The adhesive force of the tape 10 is improved by moving the roller 13 for conveying the tape 10 by the pusher 12 in a reciprocating manner and pressing the tape 10 a plurality of times.
상기한 도금방지용 테이프(10)는 각기 다른 히트싱크(16)의 크기에 따라 표면을 덮을 수 있을 정도의 크기로 유지하며 출력매거진(14)으로 출력된 리드프레임(15)을 수거하여 도금공정을 수행함에 따라 히트싱크의 표면에 도금이 되지 않도록하여 용이한 작업공정을 수행시킬 수 있는 것이다.The anti-plating tape 10 is maintained at a size enough to cover the surface according to the size of the different heat sinks 16 and the plating process is performed by collecting the lead frame 15 outputted to the output magazine 14. As it is performed to prevent the plating on the surface of the heat sink can be carried out an easy work process.
상기한 커팅장치(6)의 커팅펀치(7)는 다수개 이상을 구비시켜 리드프레임(15)에 다수개 구비되는 패키지(18)마다 도금방지용 테이프(10)를 동시에 절단시켜 부착할 수 있도록 하여 작업성을 최대화 시킨 것이다.The cutting punch 7 of the cutting device 6 is provided with a plurality or more so that the plating prevention tape 10 for each package 18 provided in the lead frame 15 can be cut and attached at the same time. It maximizes workability.
이상에서와 같이 본 발명은 패키지 몰드된 리드프레임의 히트싱크 표면을 도금공정전에 커팅장치로 테이프를 절단시키고 절단된 테이프를 접착장치로 부착하므로서 테이프 부착 작업이 용이하고 대량으로 작업을 수행하여 반도체 패키지의 생산성을 향상시키는 효과가 있다.As described above, the present invention cuts the tape with a cutting device before the plating process on the heatsink surface of the package-molded lead frame and attaches the cut tape with an adhesive device, thereby facilitating tape attaching operation and performing a large amount of semiconductor package. This has the effect of improving the productivity.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940027136A KR0144313B1 (en) | 1994-10-24 | 1994-10-24 | Heat Sink Plating Device for Semiconductor Packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940027136A KR0144313B1 (en) | 1994-10-24 | 1994-10-24 | Heat Sink Plating Device for Semiconductor Packages |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960015877A KR960015877A (en) | 1996-05-22 |
| KR0144313B1 true KR0144313B1 (en) | 1998-07-01 |
Family
ID=66687249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940027136A KR0144313B1 (en) | 1994-10-24 | 1994-10-24 | Heat Sink Plating Device for Semiconductor Packages |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0144313B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100471370B1 (en) * | 2001-12-22 | 2005-03-08 | 주식회사 융진 | coating layer remove system on welding area using and method the masking tape |
-
1994
- 1994-10-24 KR KR1019940027136A patent/KR0144313B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960015877A (en) | 1996-05-22 |
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