KR0137442B1 - Both printed circuit board - Google Patents
Both printed circuit boardInfo
- Publication number
- KR0137442B1 KR0137442B1 KR1019930006674A KR930006674A KR0137442B1 KR 0137442 B1 KR0137442 B1 KR 0137442B1 KR 1019930006674 A KR1019930006674 A KR 1019930006674A KR 930006674 A KR930006674 A KR 930006674A KR 0137442 B1 KR0137442 B1 KR 0137442B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive pattern
- circuit board
- printed circuit
- double
- sided printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
본 발명은 양면의 도전패턴점유면적비율이 큰 양면인쇄회로기판에 있어서의 휘어짐을 방지하는 것을 목적으로 하는 것으로서, 기판본체(1)의 양면에 도전패턴(2)를 형성하고, 표면(3)의 도전패턴(2)의 점유면적을 이면(4)의 도전패턴(2)의 점유면적보다도 크게 형성한 양면인쇄회로기판에 있어서 상기한 표면(3)의 점유면적을 크게한 도전패턴(2)내에 양면인쇄회로기판의 길이방향에 대해 수직방향으로 가늘고 긴 슬릿(5)을 형성한 양면인쇄회로기판이다.An object of the present invention is to prevent warpage in a double-sided printed circuit board having a large conductive pattern occupying area ratio of both surfaces. The conductive pattern 2 is formed on both surfaces of the substrate body 1, and the surface 3 is formed. In the double-sided printed circuit board in which the occupied area of the conductive pattern 2 is larger than the occupied area of the conductive pattern 2 on the back surface 4, the conductive pattern 2 having the larger occupied area of the surface 3 is obtained. A double-sided printed circuit board having a slits 5 elongated in a direction perpendicular to the longitudinal direction of the double-sided printed circuit board.
Description
제1도는 본 발명의 일실시예를 나타내는 양면인쇄회로기판의 표면도.1 is a surface view of a double-sided printed circuit board showing one embodiment of the present invention.
제2도는 본 발명의 일실시예를 나타내는 양면인쇄횔기판의 이면도.2 is a rear view of a double-sided printed substrate showing an embodiment of the present invention.
제3도는 양면인쇄회로기판본체의 길이방향과 평행으로 세로로 절단한 측면도.3 is a side view cut vertically in parallel with the longitudinal direction of the double-sided printed circuit board main body.
제4도는 종래의 양면인쇄회로기판본체의 길이방향과 평행으로 세로로 절단한 측면도.Figure 4 is a side view cut vertically in parallel with the longitudinal direction of the conventional double-sided printed circuit board main body.
*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1:양면인쇄회로기판본체(기판본체)1: Duplex printed circuit board main body
2:도전패턴3:표면2: conductive pattern 3: surface
4:이면5:슬릿4: back side 5: slit
본 발명은 양면인쇄회로기판에 관한 것이다.The present invention relates to a double-sided printed circuit board.
양면에 도전패턴을 형성해서된 양면인쇄회로기판이 예를들면 일본국 실개소 63-73965호 공보에 제안되어 있다.A double-sided printed circuit board having conductive patterns formed on both surfaces thereof is proposed, for example, in Japanese Patent Application Laid-Open No. 63-73965.
또, 이와같은 양면인쇄회로기판에 있어서는, 전기적인 외부산란에 대한 차폐효과를 높이기 위해 한쪽면의 도전패턴점유면적을 다른쪽면의 도전패턴 점유면적보다 넓게 하는 것이 통상 행해지고 있다.In addition, in such a double-sided printed circuit board, in order to increase the shielding effect against electrical external scattering, it is common practice to make the conductive pattern occupying area of one side larger than the conductive pattern occupying area of the other side.
상기한 종래의 기술에 있어서 양면의 도전패턴 점유면적비율이 큰 경우, 기판에 천공하기 위해 펀칭(punching)하는 때에 뽑아내기 쉽게 하기 위한 가열시 및 납땜질하는 때의 가열시에, 양면인쇄회로기판은 본체의 길이방향과 평행으로 세로로 절단한 측면도인 제4도에 나타내는 바와같이 가열된 때의 본체(1)과 도전패턴(2)의 열팽창율에서는 도전패턴(2)의 열팽창율쪽이 큰 점, 또한 한쪽면(3)상의 도전패턴(2)의 점유면적이 다른쪽면(4)의 도전패턴(2)보다도 크다는 점 때문에 가열하는 것에 의해 한쪽면(3)이 호의 외부원주면이 되는 것과 같이 활모양으로 휘어버린다.In the above-described conventional technique, when the area ratio of the conductive patterns on both sides is large, the double-sided printed circuit board at the time of heating at the time of punching to punch the substrate and at the time of brazing at the time of brazing. As shown in FIG. 4, which is a side view vertically cut parallel to the longitudinal direction of the main body, the thermal expansion rate of the conductive pattern 2 is greater in the thermal expansion rate of the main body 1 and the conductive pattern 2 when heated. In addition, since the occupied area of the conductive pattern 2 on one side 3 is larger than the conductive pattern 2 of the other side 4, the heating is performed such that one side 3 becomes the outer circumferential surface of the arc. Bend the bow.
이때, 도전패턴(2)의 열팽창량은 필연적으로 도전패턴(2)이 길게 배치되어 있는 길이방향이 많아지기 때문에 길이방향으로 휘어짐이 발생해 버린다.At this time, the thermal expansion amount of the conductive pattern 2 inevitably increases the longitudinal direction in which the conductive pattern 2 is arranged long, so that warpage occurs in the longitudinal direction.
따라서, 본 발명은 상기와 같은 문제점에 감안하여 이루어진 것으로 양면의 도전패턴점유면적비율이 큰 양면인쇄회로기판에 있어서의 휘는 것을 방지하는 것을 목적으로 한다.Accordingly, the present invention has been made in view of the above problems, and an object thereof is to prevent warpage in a double-sided printed circuit board having a large conductive pattern occupying area ratio on both sides.
상기한 과제를 해결하기 위해 가로와 세로의 칫수가 다른 기판본체(1)에 길이방향으로 기판본체(1)의 양면에 도전패턴(2)를 형성하고 한쪽면의 도전패턴(2)의 점유면적을 다른쪽면의 도전패턴(2)의 점유면적보다도 크게 형성한 양면인쇄회로기판에 있어서, 상기한 도전패턴(2)의 점유면적이 큰 한쪽면에 형성된 도전패턴(2)내에 슬릿(slit)(5)을 형성하고, 그 슬릿(5)은 양면인쇄회로기판의 길이방향에 대하여 수직방향으로 가늘고 길게 형성한 것이다.In order to solve the above problems, the conductive pattern 2 is formed on both sides of the substrate body 1 in the longitudinal direction on the substrate body 1 having different dimensions in the horizontal and vertical dimensions, and the occupied area of the conductive pattern 2 on one side thereof is formed. In a double-sided printed circuit board having a larger than the occupied area of the conductive pattern 2 on the other side, a slit (slit) in the conductive pattern 2 formed on one surface having a large occupied area of the conductive pattern 2. 5), and the slits 5 are thin and long in the vertical direction with respect to the longitudinal direction of the double-sided printed circuit board.
양면인쇄회로기판은 가열된 때의 본체와 도전패턴의 열팽창율에서는 도전패턴의 열팽창율쪽이 큰것과 또한 한쪽면의 도전패턴 점유면적이 다른쪽의 도전패턴보다도 큰 것에서, 가열하므로서 활모양으로 휘어져 버린다.The double-sided printed circuit board is bent in a bow shape by heating when the thermal expansion rate of the main body and the conductive pattern when heated is larger in the thermal expansion rate of the conductive pattern and the area occupied by the conductive pattern on one side is larger than the other conductive pattern. .
이때, 도전패턴의 열팽창량은 필연적으로 도전패턴이 길게 배치되어 있는 길이방향이 많아지기 때문에 길이방향으로 휘어져버리지만 길이방향과 수직인 가늘고 긴 슬릿에 의해 길이방향의 열팽창을 슬릿으로 분산시키기 때문에 휘어지는 것을 억제한다.At this time, the thermal expansion amount of the conductive pattern inevitably bends in the longitudinal direction because the longitudinal direction in which the conductive pattern is arranged is increased, but the thermal expansion in the longitudinal direction is dispersed by the slender slits perpendicular to the longitudinal direction. Suppress it.
또한, 한쪽면의 도전패턴의 점유면적이 다른 도전패턴의 점유면적보다 큰 양면인쇄기판에 있어서의 가열시 및 냉각시의 휘어짐이 극력 억제될 수가 있다.Further, the warpage during heating and cooling in the double-sided printed board having a larger occupied area of the conductive pattern on one side than the occupied area of the other conductive pattern can be suppressed as much as possible.
[실시예]EXAMPLE
이하, 본 발명의 실시예를 각 도면을 사용해서 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described using each drawing.
제1도 및 제2도는 동일한 양면인쇄회로기판의 표면과 이면의 도전패턴을 나타낸 도면이다.1 and 2 show conductive patterns on the front and back surfaces of the same double-sided printed circuit board.
1은 양면인쇄회로기판본체이며, 제1도 및 제2도에 나타내는 상하방향이 긴 길이방향으로서 양면에 도전패턴(2)을 배치하고 있다.Reference numeral 1 is a double-sided printed circuit board main body, and the conductive patterns 2 are arranged on both surfaces in the longitudinal direction of the vertical direction shown in FIGS. 1 and 2.
제1도에 나타내는 한쪽면(이하, 표면(3)이라 한다)의 도전패턴(2)는 주로 전원이 접속되고, 전기적인 외부산란을 방지하기 위한 차폐효과를 발생시키기 위해 가능한한 대부분의 공간을 점유하고 있다.The conductive pattern 2 on one side (hereinafter referred to as the surface 3) shown in FIG. 1 is mainly connected to a power source, so that most of the space is possible in order to generate a shielding effect for preventing electrical external scattering. Occupy.
제2도에 나타내는 다른쪽면(이하, 이면(4)라 한다)에는 주로 땜납에 의해 실장부품을 이면(4)상에 장착시키는 면이며, 도전패턴(2)는 주로 실장부품끼리를 접속하는 배선이 되는 것이다.The other surface (hereinafter referred to as the back surface 4) shown in FIG. 2 is a surface on which the mounting parts are mainly mounted on the back surface 4 by solder, and the conductive pattern 2 is mainly a wiring for connecting the mounting parts. It will be.
양면인쇄회로기판본체(1) 자체를 적게 하기 위해 이면(4)상에는 고밀도로 실장부품을 장착하기 위해, 실장부품 상호간을 접속하기 위한 도전패턴(2)는 여러갈래로 분기되어 있고, 인접하는 도전패턴(2)와의 접촉을 피하기 위한 공간도 형성하지 않으면 안되어 도전패턴(2)의 점유면적은 표면(3)에 비해 적게 되어 있다.In order to mount the mounting parts with high density on the back surface 4 so as to reduce the double-sided printed circuit board body 1 itself, the conductive patterns 2 for connecting the mounting parts to each other are divided into several branches, and adjacent conductive A space for avoiding contact with the pattern 2 must also be formed, and the area occupied by the conductive pattern 2 is smaller than that of the surface 3.
표면(3)의 도전패턴(2)내에는 본체(1)의 길이방향과 수직으로 형성된 가늘고 긴 슬릿(5)가 형성되어 있다.In the conductive pattern 2 of the surface 3, an elongate slit 5 formed perpendicular to the longitudinal direction of the main body 1 is formed.
양면인쇄회로기판은 종래의 제4도에 나타내는 바와같이 가열된 때에 본체(1)과 도전패턴(2)와의 열팽창율에서는, 도전패턴(2)의 열팽창율쪽이 큰 점과, 또한 표면(3)과 이면(4)에 형성된 도전패턴(2)의 점유면적의 비율이 다른 점 때문에 가열하므로서 표면(3)이 호의 외부원주면이 되도록 활모양으로 휘어져 버린다.When the double-sided printed circuit board is heated as shown in FIG. 4 of the related art, the thermal expansion rate of the conductive pattern 2 is greater in the thermal expansion rate between the main body 1 and the conductive pattern 2 and the surface 3. Due to the difference in the ratio of the occupied area of the conductive pattern 2 formed on the back surface 4 to the back surface 4, the surface 3 is bent in a bow shape so as to become the outer circumferential surface of the arc.
이때, 도전패턴(2)의 열팽창율은 필연적으로 도전패턴(2)가 길게 배치되어 있는 길이방향이 많아지기 때문에 길이방향으로 휘어져 버린다.At this time, the thermal expansion rate of the conductive pattern 2 inevitably bends in the longitudinal direction because the longitudinal direction in which the conductive pattern 2 is disposed is increased.
그러나, 길이방향과 수직인 가늘고 긴 슬릿(5)에 의해 길이방향의 열팽창이 슬릿(5)로 분산되므로서 제3도에 나타내는 바와 같이 양면인쇄회로기판의 휘어짐을 억제할 수가 있다.However, as the elongated slits 5 perpendicular to the longitudinal direction are dispersed in the slits 5 in the longitudinal direction, the warpage of the double-sided printed circuit board can be suppressed as shown in FIG.
이 실시예에 있어서, 슬릿(5)은 도전패턴(2)내에 배치된 것이지만 슬릿(5)의 한쪽끝이 도전패턴(2)을 가로지르는 것이라도 되며, 특히 배치에 구애되는 것은 아니다.In this embodiment, the slit 5 is disposed in the conductive pattern 2, but one end of the slit 5 may cross the conductive pattern 2, and is not particularly limited to the arrangement.
또한, 슬릿(5)은 도전패턴(2)의 폭이 좁고, 길이방향과 수직인 가늘고 긴 슬릿을 형성하기가 곤란한 것 때문에 길이방향과 평행으로 형성하여 열팽창을 분산시키기 위한 것이다.In addition, since the slit 5 has a narrow width of the conductive pattern 2 and it is difficult to form an elongate slit perpendicular to the longitudinal direction, the slit 5 is formed in parallel with the longitudinal direction to disperse thermal expansion.
본 발명에 의하면, 양면에 도전패턴이 형성되며, 한쪽면의 도전패턴의 점유면적이 다른쪽면의 도전패턴의 점유면적보다 큰 양면인쇄기판에 있어서의 가열시 및 냉각시의 휘어짐을 억제할 수가 있다.According to the present invention, the conductive patterns are formed on both sides, and the warping during heating and cooling in the double-sided printed board having a larger occupied area of the conductive pattern on one side than the occupied area of the conductive pattern on the other side can be suppressed. .
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP92-103052 | 1992-04-22 | ||
| JP4103052A JPH05299785A (en) | 1992-04-22 | 1992-04-22 | Double-sided printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930022933A KR930022933A (en) | 1993-11-24 |
| KR0137442B1 true KR0137442B1 (en) | 1998-06-15 |
Family
ID=14343905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019930006674A KR0137442B1 (en) | 1992-04-22 | 1993-04-21 | Both printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH05299785A (en) |
| KR (1) | KR0137442B1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100322119B1 (en) * | 1998-07-31 | 2002-05-09 | 윤종용 | Planar broadband dipole antenna for linearly polariged waves |
| JP2001210744A (en) | 2000-01-25 | 2001-08-03 | Nec Corp | Circuit board |
| KR100389113B1 (en) * | 2001-06-21 | 2003-06-25 | 주식회사 태화인서트 | Device Adhering Method for FPCB |
| TW564533B (en) * | 2002-10-08 | 2003-12-01 | Siliconware Precision Industries Co Ltd | Warpage-preventing substrate |
| JP4692460B2 (en) * | 2006-10-05 | 2011-06-01 | 日立電線株式会社 | Optical module |
| JP4538069B2 (en) * | 2008-11-28 | 2010-09-08 | 株式会社東芝 | Printed wiring board |
| JP6604505B2 (en) * | 2015-09-10 | 2019-11-13 | パナソニックＩｐマネジメント株式会社 | Light emitting device |
-
1992
- 1992-04-22 JP JP4103052A patent/JPH05299785A/en active Pending
-
1993
- 1993-04-21 KR KR1019930006674A patent/KR0137442B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR930022933A (en) | 1993-11-24 |
| JPH05299785A (en) | 1993-11-12 |
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