JPH1041667A - Shielding structure of circuit board - Google Patents
Shielding structure of circuit boardInfo
- Publication number
- JPH1041667A JPH1041667A JP19024196A JP19024196A JPH1041667A JP H1041667 A JPH1041667 A JP H1041667A JP 19024196 A JP19024196 A JP 19024196A JP 19024196 A JP19024196 A JP 19024196A JP H1041667 A JPH1041667 A JP H1041667A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- case
- shield
- flange
- embossment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は回路基板のシールド
構造に関し、特に回路基板に取り付けるシールドケース
の構造に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a shield structure of a circuit board, and more particularly, to a structure of a shield case attached to the circuit board.
【０００２】[0002]
【従来の技術】回路基板上の回路の全部、あるいは一部
をシールドする必要のある場合がある。このシールドケ
ースには二種類があって、厳重なシールドを必要とする
重シールド型と、多少シールドに漏れ（例えばシールド
ケースと回路基板との間に隙間）があっても簡便に、手
間をかけないで取り付けられる簡易型とである。本発明
はこの重シールド型の方のシールドケースに関する。2. Description of the Related Art In some cases, it is necessary to shield all or part of a circuit on a circuit board. There are two types of shield cases, a heavy shield type that requires a strict shield, and a simple and time-consuming one even if there is some leakage in the shield (for example, a gap between the shield case and the circuit board). It is a simple type that can be installed without using. The present invention relates to the shield case of the heavy shield type.
【０００３】重シールド型シールドケースは、例えば銅
を主体とする金属板を隙間のない箱形（回路基板の部品
取り付け面に接する面は開かれ、フランジ部で回路基板
に取り付けられる）に成形されたもので、回路基板のア
ース（グラウンド；ＧＮＤ）面（パッド）となるべく低
いインピーダンスで接続される必要がある。The heavy-shield type shield case is formed by, for example, forming a metal plate mainly made of copper into a box shape having no gap (a surface in contact with a component mounting surface of a circuit board is opened and mounted on a circuit board at a flange portion). It must be connected to the ground (ground; GND) surface (pad) of the circuit board with as low impedance as possible.
【０００４】従来は図４に示す、特開平２−２２９２５
号公報に記載されているような方法が用いられた。図４
において、（シールド）ケース１から例えば金属板を折
り曲げる方法で形成されたフランジ部２に孔をあけ、ネ
ジ５で回路基板３に取り付け（締め付け）る。この場
合、ネジ５はケース１を回路基板３に固定すると共に、
回路基板３のアース面（パッド）に電気的に接続する。
従って、ケース１と回路基板３のアース面との間のイン
ピーダンスを下げるため、ネジ５の本数は可能な限り多
くする必要がある。Conventionally, as shown in FIG.
The method described in the publication was used. FIG.
In (2), a hole is formed in the flange portion 2 formed by, for example, bending a metal plate from the (shield) case 1 and attached (fastened) to the circuit board 3 with the screw 5. In this case, the screw 5 fixes the case 1 to the circuit board 3 and
It is electrically connected to the ground surface (pad) of the circuit board 3.
Therefore, in order to reduce the impedance between the case 1 and the ground surface of the circuit board 3, it is necessary to increase the number of screws 5 as much as possible.
【０００５】[0005]
【発明が解決しようとする課題】図４に示したような従
来のシールドケースの場合、（シールド）ケース１を多
数のネジ５で回路基板３に取り付けているため、ネジは
一本一本手作業で締め付ける必要があって、工数がかか
る問題がある。In the case of a conventional shield case as shown in FIG. 4, the (shield) case 1 is attached to the circuit board 3 with a large number of screws 5, so that each screw is handled one by one. It is necessary to tighten by work, and there is a problem that it takes man-hours.
【０００６】本発明の目的は、（シールド）ケースと回
路基板のアース面（パッド）と間のインピーダンスを充
分に低く保ちながら、取り付けネジの本数を最少に押さ
えた回路基板のシールド構造を提供することである。An object of the present invention is to provide a shield structure of a circuit board which minimizes the number of mounting screws while keeping the impedance between the (shield) case and the ground plane (pad) of the circuit board sufficiently low. That is.
【０００７】[0007]
【課題を解決するための手段】本発明によれば、フラン
ジを有するシールドケースを、このフランジ部で回路基
板上に取り付けるようにした回路基板のシールド構造で
あって、前記フランジ部に設けられて前記回路基板の取
り付け面に向けて突出した凸部と、前記凸部に対応した
回路基板上の位置に設けられアース電位となるスルーホ
ールと、前記凸部を対応スルーホールに嵌合せしめたと
きに両者を固定接続するハンダとを含むことを特徴とす
る回路基板のシールド構造が得られる。According to the present invention, there is provided a shield structure for a circuit board in which a shield case having a flange is mounted on the circuit board at the flange portion, wherein the shield case is provided on the flange portion. When a convex portion protruding toward the mounting surface of the circuit board, a through hole provided at a position on the circuit board corresponding to the convex portion and serving as a ground potential, and the convex portion fitted in the corresponding through hole And a solder for fixedly connecting the two to each other.
【０００８】そして、前記フランジ部と前記回路基板と
の間を締め付けるネジを更に含むことを特徴としてい
る。[0008] Further, it is characterized in that it further comprises a screw for fastening between the flange portion and the circuit board.
【０００９】また、前記凸部は前記フランジの長手方向
に沿って複数設けられているか、または、前記フランジ
の長手方向に沿って長形に形成されていることを特徴と
している。[0009] Further, the present invention is characterized in that a plurality of the protrusions are provided along the longitudinal direction of the flange, or are formed to be elongated along the longitudinal direction of the flange.
【００１０】[0010]
【発明の実施の形態】本発明の作用は次の通りである。
（シールド）ケースと回路基板のアース面（パッド）と
の間のインピーダンスは、エンボスと回路基板に設けた
スルーホールとの半田接続で低く保ちながら、ネジの本
数はケースを回路基板に（機械的に）固定するのに必要
な数に限定する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The operation of the present invention is as follows.
(Shield) The impedance between the case and the ground plane (pad) of the circuit board is kept low by the solder connection between the embossment and the through hole provided on the circuit board. To the number required to fix.
【００１１】以下に、本発明の実施例について図面を参
照して説明する。An embodiment of the present invention will be described below with reference to the drawings.
【００１２】図１は本発明の実施例の構成を示す斜視図
であり、図４と同等部分は同一符号にて示している。な
お、重複する説明は省略する。FIG. 1 is a perspective view showing the configuration of an embodiment of the present invention, and the same parts as those in FIG. 4 are denoted by the same reference numerals. In addition, overlapping description is omitted.
【００１３】図１において、ケース１のフランジ部２に
凸部であるエンボス６を設けると共に、最少数のネジ５
でケース１（のフランジ部２）を回路基板３に取り付け
る。図１のフランジ部２と基板３との固定構造として
は、図３の断面図に示すように、フランジ部２に設けら
れたエンボス６が下方に円錐状に突出し、このエンボス
６に対応する位置に、回路基板３にはスルーホール（メ
ッキされた孔）４が設けられる。In FIG. 1, a flange 2 of a case 1 is provided with an embossing 6 which is a projection, and a minimum number of screws 5 are provided.
Then, the case 1 (the flange portion 2) is attached to the circuit board 3. As a fixing structure between the flange portion 2 and the substrate 3 in FIG. 1, as shown in the sectional view of FIG. 3, an emboss 6 provided on the flange portion 2 projects conically downward, and a position corresponding to the emboss 6 The circuit board 3 is provided with through holes (plated holes) 4.
【００１４】このスルーホール４は回路基板３の部品取
り付け面（表面）、あるいはプリント面（裏面）でアー
ス面（パッド；プリント）に接続されている。フローソ
ルダリング工程（半田槽の中で半田を溶融し、この溶融
半田をポンプで吹き上げて、その上を電気部品を搭載し
た回路基板３を搬送することで、電気部品を回路基板３
に半田付けする一般的な工程）時、スルーホール４から
吹きあがる半田で、エンボス６とスルーホール４を半田
付けする。The through-hole 4 is connected to a ground surface (pad; print) on the component mounting surface (front surface) or the printed surface (back surface) of the circuit board 3. Flow soldering process (solder is melted in a solder bath, the molten solder is blown up by a pump, and the circuit board 3 on which the electric component is mounted is conveyed on the melted solder.
At the time of the general process of soldering), the emboss 6 and the through hole 4 are soldered with the solder blown up from the through hole 4.
【００１５】図２に示すように、エンボス６の代わり
に、フランジ２の長手方向に沿って長形の長エンボス
６’を設け、この長エンボス６’に対応する長さの長孔
状のスルーホール４を回路基板３に設けて、同様にフロ
ーソルダリング工程で長エンボス６’と、スルーホール
４を半田付けしても良い。この場合、特にケース１と回
路基板３のアース面との間のインピーダンスを低くする
ことができる。As shown in FIG. 2, instead of the embossment 6, an elongated long embossment 6 'is provided along the longitudinal direction of the flange 2, and an elongated through hole having a length corresponding to the long embossment 6' is provided. The hole 4 may be provided in the circuit board 3 and the long emboss 6 ′ and the through hole 4 may be soldered in a flow soldering process. In this case, the impedance between the case 1 and the ground surface of the circuit board 3 can be particularly reduced.
【００１６】[0016]
【発明の効果】以上説明したように本発明は、（シール
ド）ケースと回路基板のアース面との間のインピーダン
スを低く保ちながら、ケースを回路基板に固定するネジ
を最小限に保つことにより、（重）シールドケースの取
り付け工数を最少にできる効果がある。As described above, the present invention reduces the impedance between the (shield) case and the ground plane of the circuit board while keeping the screws for fixing the case to the circuit board to a minimum. (Heavy) This has the effect of minimizing the number of steps for mounting the shield case.
【図１】本発明の実施例の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.
【図２】本発明の他の実施例の斜視図である。FIG. 2 is a perspective view of another embodiment of the present invention.
【図３】エンボスとスルーホールの取り付け関係を説明
する断面図である。FIG. 3 is a cross-sectional view illustrating an attachment relationship between an emboss and a through hole.
【図４】従来のシールドケースの一例の斜視図である。FIG. 4 is a perspective view of an example of a conventional shield case.
１ ケース ２ フランジ部 ３ 回路基板 ４ スルーホール ５ ネジ ６ エンボス ６´ 長エンボス DESCRIPTION OF SYMBOLS 1 Case 2 Flange part 3 Circuit board 4 Through hole 5 Screw 6 Emboss 6 'Long emboss
Claims (4)
のフランジ部で回路基板上に取り付けるようにした回路
基板のシールド構造であって、前記フランジ部に設けら
れて前記回路基板の取り付け面に向けて突出した凸部
と、前記凸部に対応した回路基板上の位置に設けられア
ース電位となるスルーホールと、前記凸部を対応スルー
ホールに嵌合せしめたときに両者を固定接続するハンダ
とを含むことを特徴とする回路基板のシールド構造。1. A shield structure for a circuit board, wherein a shield case having a flange is mounted on a circuit board at the flange, wherein the shield case is provided on the flange and protrudes toward a mounting surface of the circuit board. A convex portion, a through hole provided at a position on the circuit board corresponding to the convex portion and having a ground potential, and a solder for fixedly connecting the two when the convex portion is fitted into the corresponding through hole. A shield structure for a circuit board, characterized in that:
締め付けるネジを更に含むことを特徴とする請求項１記
載の回路基板のシールド構造。2. The circuit board shield structure according to claim 1, further comprising a screw for tightening a gap between said flange portion and said circuit board.
って複数設けられていることを特徴とする請求項１また
は２記載の回路基板のシールド構造。3. The shield structure for a circuit board according to claim 1, wherein a plurality of the protrusions are provided along a longitudinal direction of the flange.
って長形に形成されていることを特徴とする請求項１ま
たは２記載の回路基板のシールド構造。4. The shield structure for a circuit board according to claim 1, wherein said convex portion is formed in an elongated shape along a longitudinal direction of said flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19024196A JPH1041667A (en) | 1996-07-19 | 1996-07-19 | Shielding structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19024196A JPH1041667A (en) | 1996-07-19 | 1996-07-19 | Shielding structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1041667A true JPH1041667A (en) | 1998-02-13 |
Family
ID=16254861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19024196A Withdrawn JPH1041667A (en) | 1996-07-19 | 1996-07-19 | Shielding structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1041667A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006973A (en) * | 2003-08-01 | 2004-01-08 | Kitagawa Ind Co Ltd | Structure and method for shielding electromagnetic wave |
| US6881894B2 (en) | 2000-10-13 | 2005-04-19 | Nec Lcd Technologies, Ltd. | EMI shielding structures |
| JP2006216782A (en) * | 2005-02-03 | 2006-08-17 | Kitagawa Ind Co Ltd | Method for obtaining contact and fixing between shield case and conductive material |
| JP2006303255A (en) * | 2005-04-21 | 2006-11-02 | Alps Electric Co Ltd | Mounting structure of high-frequency apparatus |
| JP2014502426A (en) * | 2010-12-08 | 2014-01-30 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electric circuit device and method of manufacturing electric circuit device |
| KR101452729B1 (en) * | 2008-10-14 | 2014-10-23 | 삼성전자주식회사 | Shield Can and Manufacturing Method thereof |
-
1996
- 1996-07-19 JP JP19024196A patent/JPH1041667A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881894B2 (en) | 2000-10-13 | 2005-04-19 | Nec Lcd Technologies, Ltd. | EMI shielding structures |
| JP2004006973A (en) * | 2003-08-01 | 2004-01-08 | Kitagawa Ind Co Ltd | Structure and method for shielding electromagnetic wave |
| JP2006216782A (en) * | 2005-02-03 | 2006-08-17 | Kitagawa Ind Co Ltd | Method for obtaining contact and fixing between shield case and conductive material |
| JP4689287B2 (en) * | 2005-02-03 | 2011-05-25 | 北川工業株式会社 | Contact and fixing method between shield case and conductive material |
| JP2006303255A (en) * | 2005-04-21 | 2006-11-02 | Alps Electric Co Ltd | Mounting structure of high-frequency apparatus |
| KR101452729B1 (en) * | 2008-10-14 | 2014-10-23 | 삼성전자주식회사 | Shield Can and Manufacturing Method thereof |
| JP2014502426A (en) * | 2010-12-08 | 2014-01-30 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electric circuit device and method of manufacturing electric circuit device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20031007 |