US6881894B2 - EMI shielding structures - Google Patents
EMI shielding structures Download PDFInfo
- Publication number
- US6881894B2 US6881894B2 US09/975,791 US97579101A US6881894B2 US 6881894 B2 US6881894 B2 US 6881894B2 US 97579101 A US97579101 A US 97579101A US 6881894 B2 US6881894 B2 US 6881894B2
- Authority
- US
- United States
- Prior art keywords
- contact
- shield member
- aperture
- emi shield
- emi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
Definitions
- the present invention generally relates to electronic assemblies surrounded by enclosures that prevent passage of electromagnetic or radio frequency interference (RFI).
- Enclosing structures combine shield members with ground planes associated with the electronic assemblies.
- the present invention relates to structures for electrically connecting shield members to ground planes.
- EMI electromagnetic interference
- RFID radio frequency interference
- a suitable form of EMI shield comprises an enclosure surrounding an electronic assembly.
- the enclosure often has several parts suitably connected to form an electro-conductive structure around the assembly. Required parts include a ground plane associated with the electronic assembly and an EMI shield member, electrically connected to the ground plane.
- JP-B2 7-63114 describes an EMI shielding structure wherein an EMI shield member has a shield plate fixed to its inner surface. After placing the EMI shield member in desired alignment over an electronic assembly, application of pressure brings the shield plate into resilient contact with a ground plane of a printed circuit.
- JP-A 9-138389 describes an EMI shielding structure using a frame ground consisting of two metal strips.
- the frame ground is soldered to an EMI shield member and also to a ground plane of a printed circuit.
- JP-A 10-62756 describes an EMI shielding structure wherein an EMI shield member, which has been pressed out to form protuberances, is used, and the protuberances are brought into contact with a ground plane of a printed circuit.
- JP-A 7-248481 describes an EMI shielding structure wherein an EMI shield member is formed with a ground terminal, and the ground terminal is fitted into a connector terminal on a ground plane of a printed circuit.
- JP-A 7-333638 describes an EMI shielding structure wherein an EMI shielding film covers a printed circuit.
- the EMI shielding film consists of a conductive layer, an insulating layer, and an adhesive layer. With the adhesive layer, the EMI shielding film is adhered to the printed circuit.
- a printed circuit 110 supports electronic components, not shown, that are protected by an EMI shield member 112 .
- a plurality of conic contact protuberances, only one shown at 111 are formed on the printed circuit 110 . Each contact protuberance is part of the ground plane of the printed circuit 110 .
- Modules are now widely used as electronic assemblies. Such modules are required to grow thinner and thinner to increase their competitive powers in market. A reduction in thickness of a module inevitably requires a reduction in thickness of at least some of its parts. The reduction in thickness of modules causes a drop in stiffness of the final product, such as a liquid crystal display (LCD), against bending stress.
- LCD liquid crystal display
- the EMI shielding structure is installed in such a LCD, application of pressure to the surface of the LCD may cause loose contact between some of the conical contact protuberances 111 and the EMI shield member 112 . Occurrence of such loose contact may cause abnormality in image produced by the LCD.
- each conical contact protuberance 111 and the EMI shield member 112 makes a point contact.
- an increased number of contact protuberances 111 are required to provide a sufficiently low resistance of the electrical connection between the EMI shield member 112 and the ground plane of the printed circuit 110 .
- the thickness, as indicated at B, of the EMI shield member 112 adds to an elevation of the remote surface of the EMI shield member 112 from the printed circuit 110 . If each contact protuberance 111 has the height A, the final elevation of the remote surface of the EMI shield member 112 can be expressed as the sum (A+B).
- the EMI shielding structure shown in FIG. 11 is satisfactory to some extent. However, a need remains for an EMI shielding structure, which is free from the above-mentioned shortcomings inherent with the EMI shielding structure shown in FIG. 11 .
- An object of the present invention is to provide an EMI shielding structure, which provides a reliable and continuing electrical connection between an EMI shield member and a ground plane of a printed circuit as well as a reduction in elevation of the remote surface of the EMI shield member from the printed circuit and an elimination of difficulty in confirming whether the electrical connection is made after completion of the assembly.
- an EMI shielding structure comprising:
- an EMI shield member formed with an aperture receiving the contact protuberance
- the EMI shield member having a contact wall defining the aperture, the aperture defining contact wall being in contact with the contact protuberance received in the aperture.
- FIG. 1 shows a schematic cross-sectional view of a portion of an EMI shielding structure according to a first embodiment of the present invention.
- FIG. 2 shows a schematic perspective view of the portion of the EMI shielding structure shown in FIG. 1 .
- FIG. 3 shows a schematic cross-sectional view of a portion of an EMI shielding structure according to a second embodiment of the present invention.
- FIG. 4 shows a schematic perspective view of the portion of the EMI shielding structure shown in FIG. 3 .
- FIG. 5 shows a schematic cross-sectional view of a portion of an EMI shielding structure according to a third embodiment of the present invention.
- FIG. 6 shows a schematic perspective view of the portion of the EMI shielding structure shown in FIG. 5 .
- FIG. 7 shows a schematic cross-sectional view of a portion of an EMI shielding structure according to a fourth embodiment of the present invention.
- FIG. 8 shows a schematic perspective view of the portion of the EMI shielding structure shown in FIG. 7 .
- FIG. 9 shows a schematic cross-sectional view of a portion of an EMI shielding structure according to a fifth embodiment of the present invention.
- FIG. 10 shows a schematic perspective view of the portion of the EMI shielding structure shown in FIG. 9 .
- FIG. 11 shows a schematic cross-sectional view of a portion of an EMI shielding structure according to a less preferred embodiment.
- FIGS. 1 and 2 illustrate a portion of a printed circuit 10 of an electronic assembly.
- the printed circuit 10 supports electronic components, not shown, that are protected by an EMI shield member 11 .
- a plurality of contact protuberances of conductive material, only one being shown at 12 are formed on the printed circuit 10 in alignment with apertures of the EMI shield member 11 , respectively.
- Each contact protuberance is part of the ground plane of the printed circuit 10 .
- the EMI shield member 11 has a plurality of contact walls, only one being shown at 13 , defining the plurality of apertures, respectively. After placing the EMI shield member 11 in desired alignment over the electronic assembly, application of pressure brings each aperture defining contact wall 13 into contact with the corresponding one of the contact protuberances 12 . After completed, the contact protuberances 12 overlaps the apertures of the EMI shield member 11 , respectively.
- each contact protuberance 12 is a circular cone.
- the circular cone is a closed surface consisting of a base bounded by a circle and a side surface consisting of all line segments joining a vertex with the points on the boundary of the base.
- Each contact protuberance 12 has its base on the printed circuit 10 and has its vertex within a level elevated by a height A (see FIG. 1 ).
- each aperture defining contact wall 13 into contact with the side surface of the corresponding one of the conic contact protuberances 12 .
- the vertexes of conic contact protuberances 12 are protruded through the apertures beyond the remote surface of the EMI shield member 11 .
- the side surface of each conic contact protuberance 12 is in contact with the corresponding one of the aperture defining contact walls 13 along a closed contact curve.
- the apertures are circular apertures.
- the EMI shielding structure according to the embodiment has increased contact area between the EMI shield member 11 and the contact protuberances 12 . Accordingly, electrical continuity between the EMI shield member 11 and the ground plane of the printed circuit 10 can be held above a satisfactorily high level.
- the increased contact area lowers electric contact resistance, thus providing effective shielding.
- Electric resistance between the contact protuberances 12 and the shielding cover 11 in the EMI shielding structure of FIGS. 1 and 2 , and electric resistance between the contact protuberances 111 and the EMI shield member 112 in the EMI shielding structure of FIG. 11 are measured in terms of (average), ( ⁇ n ⁇ 1 ), (maximum), and (minimum). The results are:
- This table clearly shows, as an advantage of the EMI shielding structure of FIGS. 1 and 2 , that the electric connection between the cover 11 and the ground plane of the circuit 10 has low electric resistance. This low electric resistance causes a remarkably high performance as a shield for EMI.
- the height A of the protuberances determines the final elevation of the EMI shield member 11 from the circuit 10 , which is less than the final elevation of the EMI shield member 112 from the circuit 110 , which is defined as a sum (A+B), in the EMI shielding structure of FIG. 11 .
- the present invention has been applied to an electric assembly identified by 7628C-18M. The elevation from the circuit has been reduced by 0.4 mm.
- each of the protuberances is a circular cone.
- the invention is not limited to the form of a circular cone. In other embodiment, a cone with a base that is bounded by any desired simple closed curve may be used.
- the second embodiment is substantially the same as the first embodiment in that the apertures of the EMI shield member receive the contact protuberances on the printed circuit, respectively.
- contact protuberances only one being shown at 20 , can be resiliently deformed between a printed circuit 10 and an EMI shield member 11 , which property the contact protuberances 12 of the first embodiment fail to possess.
- each contact protuberance 20 has spaced parallel bent lines.
- the spaced bent lines define two edge portions resting on the printed circuit 10 , and four-sided pantograph-like structure between the two edge portions.
- the four-sided pantograph-like structure includes two lower flat sides connected, via the bent lines, to the two edge portions, respectively, and two upper flat sides connected, via the bent lines, to the two lower plane sides, respectively.
- the upper two flat sides are connected to each other via the bent line at the ridge of the structure.
- the contact protuberance 20 can be deformed resiliently by increasing the angle around the bent line at the ridge and reducing the angle around each of the other bent lines.
- the EMI shield member 11 is formed with rectangular apertures, each being defined by four-sided contact wall 13 .
- the third embodiment is substantially the same as the first embodiment in that the circular apertures of the EMI shield member receive the contact protuberances on the printed circuit, respectively.
- contact protuberances only one being shown at 32 , have spherical side surfaces.
- each aperture defining contact wall 33 into contact with the spherical side surface of the corresponding one of the contact protuberances 32 .
- the tops of spherical contact protuberances 32 are located in the apertures as high as the remote surface of the EMI shield member 31 .
- the spherical side surface of each contact protuberance 32 is in contact with the corresponding one of the aperture defining contact walls 33 along an edge of the wall 33 .
- the top of spherical side surface of each contact protuberance 32 is elevated from the printed circuit 30 by a height A, and this height determines the final elevation of the remote surface of the EMI shield member 31 from the printed circuit 30 .
- the fourth embodiment is substantially the same as the first embodiment in that the circular apertures of the EMI shield member receive the contact protuberances on the printed circuit, respectively.
- contact protuberances only one being shown at 40 , are right cylinders, respectively, each having cylindrical side surface.
- Each cylindrical contact protuberance 40 is dimensioned so that it may be fitted into one of circular apertures defined by contact walls 13 of an EMI shield member 11 .
- the diameter of each cylindrical contact protuberance 40 is substantially the same as the diameter of the one circular aperture.
- each circular aperture defining contact wall 13 into contact with the cylindrical side surface of the corresponding one of the contact protuberances 40 .
- the upper portions of contact protuberances 40 close the circular apertures with their tops as high as the remote surface of the EMI shield member 11 .
- the cylindrical side surface of each contact protuberance 40 is in contact with the corresponding one of the aperture defining contact walls 13 .
- each contact protuberance 40 is elevated from the printed circuit 10 by a height, and this height determines the final elevation of the remote surface of the EMI shield member 11 from the printed circuit 10 .
- This height is not limited to this illustrated example and may take any desired value as long as the contact protuberance 40 is elevated less further from the printed circuit 10 than the remote surface of the EMI shield member 11 is elevated from the printed circuit 10 .
- the fifth embodiment is substantially the same as the fourth embodiment in that the circular apertures of the EMI shield member receive the contact protuberances on the printed circuit, respectively.
- contact protuberances are different from the contact protuberances 40 in that each contact protuberance 50 includes a first portion 50 a between a printed circuit 10 and an EMI shield member 11 and an integral second portion 50 b fitted into aperture defined by contact wall 13 of the EMI shield member 11 .
- the first and second portions 50 a and 50 b are coaxial cylinders, respectively.
- the first portion 50 a is formed on printed circuit 10 as part of a ground plane thereof.
- the second portion 50 b is formed on the top of the first portion 50 a.
- the second portion 50 b has a uniform cross sectional area less than a uniform cross sectional area of the first portion 50 a. In other words, the diameter of the second portion 50 b is less than the diameter of the first portion 50 a.
- the second portion 50 b of each contact protuberance 50 is dimensioned so that it may be fitted into one of circular apertures defined by contact walls 13 of the EMI shield member 11 . In this embodiment, the diameter of the second portion 50 b of each contact protuberance 50 is substantially the same as the diameter of the one circular aperture.
- each circular aperture defining contact wall 13 into contact with the cylindrical side surface of the second portion 50 b of the corresponding one of the contact protuberances 50 .
- the second portions 50 b of contact protuberances 50 close the circular apertures with their tops as high as the remote surface of the EMI shield member 11 .
- the first portion 50 a of each contact protuberance 50 allows the surface of the EMI shield member 11 to rest on the top thereof at around the associated second portion 50 b .
- the cylindrical side surface of the second portion 50 b of each contact protuberance 50 is in contact with the corresponding one of the aperture defining contact walls 13 .
- the EMI shield member 11 can be easily placed in desired alignment over the electronic assembly by allowing its apertures to receive the second portions 50 b. Besides, the first portions 50 a support the EMI shield member 11 to secure a space between the printed circuit 10 and the EMI shield member 11 .
- the first and second portions 50 a and 50 b of each contact protuberance 50 have uniform cross sectional areas and cylindrical side surfaces.
- the present invention is not limited to the first and second portions having cylindrical side surfaces, respectively.
- the side surfaces of the first and second portions 50 a and 50 b may have any cross sectional profile.
- the cross sectional profile of the side surface of the second portion 50 b may be a polygon, e.g., a triangle, a rectangle, a pentagon, and a hexagon.
- the second portion 50 b of each contact protuberance 50 has such a height that the top thereof is as high as the remote surface of the EMI shield member 11 .
- This height is not limited to this illustrated example and may take any desired value as long as the top of the second portion 50 b is elevated less further from the printed circuit 10 than the remote surface of the EMI shield member 11 is elevated from the printed circuit 10 .
- the EMI shielding structure according to each of the preceding embodiments has increased contact area between the EMI shield member and the contact protuberances. Accordingly, electrical continuity between the EMI shield member and the ground plane of the printed circuit can be held above a satisfactorily high level.
- the height of the protuberances determines the final elevation of the shielding cover from the circuit, which is less than the final elevation of the EMI shield member 112 from the circuit 110 , which is defined as a sum (A+B), in the EMI shielding structure of FIG. 11 .
Abstract
Description
Ave. | σn−1 | Max. | Min. | ||
|
16.95 Ω | 8.73 Ω | 28.14 Ω | 4.80 Ω | ||
|
1.04 Ω | 0.53 Ω | 1.70 Ω | 0.47 Ω | ||
Claims (18)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000313212A JP3683171B2 (en) | 2000-10-13 | 2000-10-13 | High frequency shield structure |
US09/975,791 US6881894B2 (en) | 2000-10-13 | 2001-10-12 | EMI shielding structures |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000313212A JP3683171B2 (en) | 2000-10-13 | 2000-10-13 | High frequency shield structure |
US09/975,791 US6881894B2 (en) | 2000-10-13 | 2001-10-12 | EMI shielding structures |
Publications (2)
Publication Number | Publication Date |
---|---|
US20030070824A1 US20030070824A1 (en) | 2003-04-17 |
US6881894B2 true US6881894B2 (en) | 2005-04-19 |
Family
ID=26602034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/975,791 Expired - Lifetime US6881894B2 (en) | 2000-10-13 | 2001-10-12 | EMI shielding structures |
Country Status (2)
Country | Link |
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US (1) | US6881894B2 (en) |
JP (1) | JP3683171B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070181338A1 (en) * | 2006-02-03 | 2007-08-09 | Benq Corporation | Assembled device and signal feeding structure thereof |
US20100230153A1 (en) * | 2007-11-26 | 2010-09-16 | Kazuto Satou | Electronic circuit board and electronic circuit board sheild method and construction |
US20120257369A1 (en) * | 2011-04-08 | 2012-10-11 | Hon Hai Precision Industry Co., Ltd. | Emi shield and electronic device using the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011209683A (en) * | 2010-03-12 | 2011-10-20 | Sumitomo Electric Device Innovations Inc | Optical transceiver |
JP6350763B2 (en) * | 2015-12-02 | 2018-07-04 | 日本精工株式会社 | Structure of the board on which electronic components are mounted and the case that houses the board |
JP6597406B2 (en) * | 2016-03-03 | 2019-10-30 | 富士通コネクテッドテクノロジーズ株式会社 | Electronics |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS57135793A (en) | 1981-02-12 | 1982-08-21 | Yuasa Shoji Co Ltd | Manufacture of match head drug |
JPS59173397A (en) | 1983-03-03 | 1984-10-01 | キンバリ−・クラ−ク・コ−ポレ−シヨン | Moisture resistant soft tissue product |
JPS60129197A (en) | 1983-12-14 | 1985-07-10 | Ebara Infilco Co Ltd | Drying method of water-contg. solid matter |
JPH0666090A (en) | 1992-08-20 | 1994-03-08 | Kajima Corp | Sediment extracting device for shield machine |
JPH06152176A (en) | 1992-11-11 | 1994-05-31 | Hitachi Ltd | Structure for securing inside shielding plate of electronic apparatus, electronic apparatus having such structure and method of detaching inside shielding plate of electronic apparatus having such structure |
JPH06283877A (en) | 1993-03-25 | 1994-10-07 | Nec Corp | High frequency shielding apparatus |
JPH07248481A (en) | 1994-03-11 | 1995-09-26 | Toshiba Corp | Liquid crystal display device |
JPH07333638A (en) | 1994-06-09 | 1995-12-22 | Hitachi Ltd | Liquid crystal display device |
JPH09138389A (en) | 1995-11-16 | 1997-05-27 | Hitachi Ltd | Liquid crystal display device |
US5704117A (en) * | 1995-06-08 | 1998-01-06 | Northern Telecom Limited | Method of assembling an EMI shield around an electronic component |
JPH1041667A (en) | 1996-07-19 | 1998-02-13 | Nec Eng Ltd | Shielding structure of circuit board |
JPH1062756A (en) | 1996-08-15 | 1998-03-06 | Hitachi Ltd | Liquid crystal display device |
KR19980021705A (en) | 1996-09-18 | 1998-06-25 | 김광호 | Shielding Device for Electromagnetic Shielding |
US5814761A (en) * | 1995-09-07 | 1998-09-29 | Shakti Audio Innovations | Passive EMI dissipation apparatus and method |
US5825634A (en) * | 1995-12-22 | 1998-10-20 | Bfgoodrich Avionics Systems, Inc. | Circuit board having an EMI shielded area |
US6051781A (en) * | 1997-09-24 | 2000-04-18 | Autosplice, Inc. | Surface mount electromagnetic frequency interference shield clip |
JP2000156588A (en) | 1998-11-19 | 2000-06-06 | Sharp Corp | Shield structure of chip part |
US6144557A (en) * | 1999-04-09 | 2000-11-07 | Lucent Technologies, Inc. | Self-locking conductive pin for printed wiring substrate electronics case |
US6297967B1 (en) * | 1997-02-05 | 2001-10-02 | Nokia Mobile Phones Ltd. | Self-securing RF screened housing |
-
2000
- 2000-10-13 JP JP2000313212A patent/JP3683171B2/en not_active Expired - Fee Related
-
2001
- 2001-10-12 US US09/975,791 patent/US6881894B2/en not_active Expired - Lifetime
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS57135793A (en) | 1981-02-12 | 1982-08-21 | Yuasa Shoji Co Ltd | Manufacture of match head drug |
JPS59173397A (en) | 1983-03-03 | 1984-10-01 | キンバリ−・クラ−ク・コ−ポレ−シヨン | Moisture resistant soft tissue product |
JPS60129197A (en) | 1983-12-14 | 1985-07-10 | Ebara Infilco Co Ltd | Drying method of water-contg. solid matter |
JPH0666090A (en) | 1992-08-20 | 1994-03-08 | Kajima Corp | Sediment extracting device for shield machine |
JPH06152176A (en) | 1992-11-11 | 1994-05-31 | Hitachi Ltd | Structure for securing inside shielding plate of electronic apparatus, electronic apparatus having such structure and method of detaching inside shielding plate of electronic apparatus having such structure |
JPH06283877A (en) | 1993-03-25 | 1994-10-07 | Nec Corp | High frequency shielding apparatus |
JPH07248481A (en) | 1994-03-11 | 1995-09-26 | Toshiba Corp | Liquid crystal display device |
JPH07333638A (en) | 1994-06-09 | 1995-12-22 | Hitachi Ltd | Liquid crystal display device |
US5704117A (en) * | 1995-06-08 | 1998-01-06 | Northern Telecom Limited | Method of assembling an EMI shield around an electronic component |
US5814761A (en) * | 1995-09-07 | 1998-09-29 | Shakti Audio Innovations | Passive EMI dissipation apparatus and method |
JPH09138389A (en) | 1995-11-16 | 1997-05-27 | Hitachi Ltd | Liquid crystal display device |
US5825634A (en) * | 1995-12-22 | 1998-10-20 | Bfgoodrich Avionics Systems, Inc. | Circuit board having an EMI shielded area |
JPH1041667A (en) | 1996-07-19 | 1998-02-13 | Nec Eng Ltd | Shielding structure of circuit board |
JPH1062756A (en) | 1996-08-15 | 1998-03-06 | Hitachi Ltd | Liquid crystal display device |
KR19980021705A (en) | 1996-09-18 | 1998-06-25 | 김광호 | Shielding Device for Electromagnetic Shielding |
US6297967B1 (en) * | 1997-02-05 | 2001-10-02 | Nokia Mobile Phones Ltd. | Self-securing RF screened housing |
US6051781A (en) * | 1997-09-24 | 2000-04-18 | Autosplice, Inc. | Surface mount electromagnetic frequency interference shield clip |
JP2000156588A (en) | 1998-11-19 | 2000-06-06 | Sharp Corp | Shield structure of chip part |
US6144557A (en) * | 1999-04-09 | 2000-11-07 | Lucent Technologies, Inc. | Self-locking conductive pin for printed wiring substrate electronics case |
Non-Patent Citations (1)
Title |
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Japanese Office Action dated Aug. 12, 2004. |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070181338A1 (en) * | 2006-02-03 | 2007-08-09 | Benq Corporation | Assembled device and signal feeding structure thereof |
US20100230153A1 (en) * | 2007-11-26 | 2010-09-16 | Kazuto Satou | Electronic circuit board and electronic circuit board sheild method and construction |
US8362370B2 (en) | 2007-11-26 | 2013-01-29 | Nec Display Solutions, Ltd. | Electronic circuit board and electronic circuit board shield method and construction |
US20120257369A1 (en) * | 2011-04-08 | 2012-10-11 | Hon Hai Precision Industry Co., Ltd. | Emi shield and electronic device using the same |
Also Published As
Publication number | Publication date |
---|---|
JP3683171B2 (en) | 2005-08-17 |
JP2002124794A (en) | 2002-04-26 |
US20030070824A1 (en) | 2003-04-17 |
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