CN214505994U - Connecting device and circuit board stacking device - Google Patents
Connecting device and circuit board stacking device Download PDFInfo
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- CN214505994U CN214505994U CN202120670143.9U CN202120670143U CN214505994U CN 214505994 U CN214505994 U CN 214505994U CN 202120670143 U CN202120670143 U CN 202120670143U CN 214505994 U CN214505994 U CN 214505994U
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- circuit board
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Abstract
The utility model relates to a connecting device and circuit board pile device. The connecting device comprises a metal frame and at least one connector. The metal frame body is provided with a plurality of bending parts and at least one straight and flat part, wherein the straight and flat part is positioned between two adjacent bending parts. The connector is connected to the straight portion of the metal frame, wherein the connector comprises an insulator and a plurality of conductive elements. The insulator is arranged on the straight part of the metal frame body. Each conductive element part is positioned in the insulator and is provided with a first conductive terminal and a second conductive terminal which protrude out of the insulator, wherein the first conductive terminal and the second conductive terminal respectively protrude out of two corresponding surfaces of the insulator. By simply adjusting the bent portion and the straight portion, the connecting device can be applied to circuit boards of various sizes or dimensions.
Description
Technical Field
The utility model relates to a connecting device and use connecting device's circuit board pile device.
Background
In order to reduce the area occupied by the printed circuit board in the electronic products (e.g., mobile phones, computers, etc.), the prior art has been to cut the printed circuit board into two pieces and connect the two pieces of printed circuit board with each other by an interposer (interposer) to form a printed circuit board stacking apparatus. Generally, the interposer is a Ball Grid Array (BGA) interposer and has solder balls disposed on opposite surfaces thereof. The printed circuit boards are soldered to opposite surfaces of the interposer by solder balls through a two-time Surface Mounting Technology (SMT) such that the printed circuit boards are electrically connected to each other through the interposer. However, in the SMT process, the Integrated Circuit (IC) parts on the pcb may be damaged by the high temperature solder oven or the pcb may be warped due to thermal stress.
On the other hand, the intermediate board is difficult to separate from the printed circuit board after being soldered by the solder balls, and if the parts in the subsequent printed circuit board stacking structure are failed to cause poor product, the stacking structure is not easy to disassemble for repair.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a connecting device that can solve the above problems, the connecting device including a metal frame and at least one connector. The metal frame body is provided with a plurality of bending parts and at least one straight and flat part, wherein the straight and flat part is positioned between two adjacent bending parts. The connector is connected to the straight portion of the metal frame, wherein the connector comprises an insulator and a plurality of conductive elements. The insulator is arranged on the straight part of the metal frame body. Each conductive element part is positioned in the insulator and is provided with a first conductive terminal and a second conductive terminal which protrude out of the insulator, wherein the first conductive terminal and the second conductive terminal protrude out of two corresponding surfaces of the insulator.
In one or more embodiments of the present invention, the first conductive terminal and the second conductive terminal of the conductive element are configured to be pressed and elastically deformed.
In one or more embodiments of the present invention, the first conductive terminal and the second conductive terminal of the conductive element are configured to be pressed to be elastically deformed, and the conductive element is C-shaped.
In one or more embodiments of the present invention, the first conductive terminal and the second conductive terminal of the conductive element are disposed to be elastically deformed by pressure, and the first conductive terminal and the second conductive terminal are respectively inclined to two corresponding surfaces of the insulator.
In one or more embodiments of the present invention, the insulator is disposed on an inner sidewall of the metal frame.
In one or more embodiments of the present invention, the metal frame body is a closed ring shape.
In one or more embodiments of the present invention, the height of the straight portion is the same as the height of the insulator of the connector.
In one or more embodiments of the present invention, the straight portion is a grounding copper layer of the connector.
In one or more embodiments of the present invention, the straight portion is a first grounding copper layer of the connector, and the connector further includes a second grounding copper layer, wherein the conductive element of the connector is disposed between the first grounding copper layer and the second grounding copper layer.
Another objective of the present invention is to provide a circuit board stacking device, which includes a first circuit board, a second circuit board and a connecting device. The first circuit board comprises a plurality of first connecting pads. The second circuit board comprises a plurality of second connecting pads. The connecting device is arranged between the first circuit board and the second circuit board, wherein the connecting device comprises a metal frame body and a connector. The metal frame body is provided with a plurality of bending parts and at least one straight and flat part, wherein the straight and flat part is positioned between two adjacent bending parts. The connector is connected to the straight portion of the metal frame, wherein the connector comprises an insulator and a plurality of conductive elements. The insulator is arranged on the straight part of the metal frame body. The conductive element is partially positioned in the insulator and is provided with a first conductive terminal and a second conductive terminal which protrude out of the insulator, wherein the first conductive terminal and the second conductive terminal are respectively positioned on two corresponding surfaces of the insulator, the first connecting pads are respectively abutted against the first conductive terminals of the conductive element, and the second connecting pads are respectively abutted against the second terminals of the conductive element.
In one or more embodiments of the present invention, the first circuit board and the second circuit board are press-fit to connect the device, so that the first conductive terminal and the second conductive terminal of the conductive element are pressed and elastically deformed.
In one or more embodiments of the present invention, the metal frame, the first circuit board, and the second circuit board together form a signal shielding region.
In one or more embodiments of the present invention, the metal frame body is a closed ring, and the insulator is disposed on an inner side wall of the metal frame body.
In one or more embodiments of the present invention, the height of the straight portion is the same as the height of the insulator of the connector.
In one or more embodiments of the present invention, the straight portion is a grounding copper layer of the connector.
In one or more embodiments of the present invention, the straight portion is a first grounding copper layer of the connector, and the connector further includes a second grounding copper layer, wherein the conductive element of the connector is disposed between the first grounding copper layer and the second grounding copper layer.
In summary, the metal frame of the connecting device has a plurality of bending portions, so that the connecting device has a relatively large degree of freedom in adjusting the shape, and the connector disposed on the metal frame can also relatively freely adjust the arrangement positions of the plurality of conductive elements, so as to connect various types of circuit boards. In addition, the metal frame between the circuit boards can further protect the electronic components arranged inside the metal frame from being interfered by electromagnetic waves.
The above description is only for the purpose of illustrating the problems to be solved, the technical means for solving the problems, the efficacy of the invention, and the like, and the details of the invention will be described in detail in the following embodiments and the related drawings.
Drawings
To the accomplishment of the foregoing and related ends, the principles briefly described above will be explained in more detail with reference to embodiments, illustrated in the accompanying drawings. These drawings depict the invention by way of example only and are not therefore to be considered limiting of its scope. The principles of the present invention will be clearly explained with reference to the accompanying drawings, in which additional features and details are fully described, and in which:
fig. 1 is an exploded perspective view of a circuit board stacking apparatus according to some embodiments of the present invention.
Fig. 2 is a schematic bottom view of a connection device according to some embodiments of the present invention.
Fig. 3 is a schematic side view of a connection device according to some embodiments of the present invention.
Fig. 4 is a schematic side view of a circuit board stacking apparatus and a connecting apparatus according to some embodiments of the present invention.
[ description of main element symbols ]
100: the circuit board stacking device 110 a: first circuit board
111 a: first connection pad 110 b: second circuit board
111 b: second connection pads 113a,113 b: opening holes
115: the locking piece 200: connecting frame body
210: the metal frame 211: a bent part
213: straight flat portion 220: connector with a locking member
220 a: first connector 220 b: second connector
221: insulator 221 a: upper surface of
221 b: lower surface 223: conductive element
223 a: first conductive terminal 223 b: second conductive terminal
H1, H2: height G1: first grounding copper layer
G2: second grounding copper layer
Detailed Description
In the following description, numerous implementation details are set forth in order to provide a more thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, details of these implementations are not necessary. In addition, for the sake of simplicity, some conventional structures and elements are shown in the drawings.
Referring to fig. 1, fig. 1 is an exploded view of a circuit board stacking apparatus 100 according to one or more embodiments of the present invention, wherein the circuit board stacking apparatus 100 includes a first circuit board 110a, a second circuit board 110b and a connecting frame 200. In practical use, the connecting frame 200 is located between the first circuit board 110a and the second circuit board 110b, so that the first circuit board 110a and the second circuit board 110b are electrically connected to each other through the connecting frame 200 and can transmit electrical signals to each other.
Please refer to fig. 1 to fig. 4. Fig. 2 is a schematic bottom view of a connection frame 200 according to some embodiments of the present invention. Fig. 3 is a schematic side view of a connection frame 200 according to some embodiments of the present invention. Fig. 4 is a schematic side view of the circuit board stacking apparatus 100 and the connecting frame 200 according to some embodiments of the present invention, wherein the connecting frame 200 connects the first circuit board 110a and the second circuit board 110 b. In some embodiments of the present invention, the circuit board stacking apparatus 100 includes a first circuit board 110a, a second circuit board 110b and a connecting frame 200. The first circuit board 110a includes a plurality of first connection pads 111 a. The second circuit board 110b includes a plurality of second connection pads 111 b. The connection frame 200 is disposed between the first circuit board 110a and the second circuit board 110b, and the connection frame 200 includes a metal frame 210 and one or more connectors 220. The metal frame 210 has a plurality of bending portions 211 and a plurality of straight portions 213, wherein the straight portions 213 are disposed between two adjacent bending portions 211. The connector 220 is connected to the straight flat portion 213 of the metal frame 210 and located between two adjacent bent portions 211, wherein the connector 220 includes an insulator 221 (e.g., an insulating layer) and a plurality of conductive elements 223, and a height H1 of the straight flat portion 213 is the same as a height H2 of the insulator 221 of the connector 220. The insulator 221 is disposed on the sidewall (e.g., the insulator 221 is stacked on the inner sidewall or the outer sidewall of the straight portion 213 of the metal frame 210). Each conductive element 223 is at least partially disposed in the insulator 221 and has a first conductive terminal 223a and a second conductive terminal 223b protruding from the insulator 221, wherein the first conductive terminal 223a and the second conductive terminal 223b respectively protrude from two corresponding surfaces of the insulator 221. For example, the first conductive terminal 223a and the second conductive terminal 223b respectively protrude from the upper surface 221a and the lower surface 221b of the insulator 221.
When the connection frame 200 is connected to the first circuit board 110a and the second circuit board 110b, the first connection pads 111a respectively abut against the first conductive terminals 223a of the conductive elements 223, and the second connection pads 111b respectively abut against the second conductive terminals 223b of the conductive elements 223. In addition, the metal frame 210 of the connection frame 200 has a plurality of bending portions 211, and the number and the inclination angle of the straight portions 213 are different according to the number arrangement and the bending condition of the bending portions 211, so that the connection frame 200 has a great freedom of adjusting the shape, and the connector 220 on the sidewall of the metal frame 210 can also adjust the arrangement and extension direction of the plurality of conductive elements 223, so that the connection frame 200 is suitable for use between the first circuit board 110a and the second circuit board 110b with various types or sizes. In addition, the metal frame 210 located between the first circuit board 110a and the second circuit board 110b can further protect the electronic components disposed therein from electromagnetic interference.
In one or more embodiments of the present invention, the straight flat portion 213 serves as the first grounding copper layer G1 of the connector 220 and is used for providing the grounding function of the connector 220. In addition, the connector 220 further includes a second grounding copper layer G2, wherein a part or all of the conductive elements 223 of the connector 220 are disposed between the first grounding copper layer G1 and the second grounding copper layer G2, but the invention is not limited thereto. In other words, the first grounding copper layer G1 and the second grounding copper layer G2 may be the outermost and innermost grounding metal layers of the connecting frame 200, respectively. In addition, the first grounding copper layer G1 and the second grounding copper layer G2 may be made of a conductive material such as copper or copper alloy, but the present invention is not limited thereto.
Specifically, the first circuit board 110a and the second circuit board 110b may be formed by cutting (for example, using a laser cutting technology) a single double-sided Printed Circuit Board (PCB), but the invention is not limited thereto. In addition, the first circuit board 110a and the second circuit board 110b may have regular shapes such as square, rectangle, polygon, etc., or other irregular shapes. In other words, the first circuit board 110a and the second circuit board 110b may have any suitable shape, and the first circuit board 110a and the second circuit board 110b may have the same or different shapes and sizes. In some embodiments of the present invention, the size (e.g., length, width, area, etc.) of the first circuit board 110a is smaller than the size of the second circuit board 110 b. In some embodiments of the present invention, the first circuit board 110a and the second circuit board 110b may be a single-sided printed circuit board (s i ng l a layer PCB) or a multi-layered printed circuit board (mu lt i-l a layer PCB). In addition, the first connecting pad 111a and the second connecting pad 111b may include a solder pad and/or a solder ball formed on the first circuit board 110a and the second circuit board 110b, which is not limited in the present invention.
In some embodiments of the present invention, the connection frame 200 is a Land Grid Array (LGA) connection device (or LGA/LGA connection device), but the present invention is not limited thereto. The metal frame 210 is made of a metal material, and the metal frame 210 is made of copper or a copper alloy and is integrally formed. For example, the metal frame 210 is manufactured by bending a copper plate, so that the metal frame 210 may have a plurality of bending portions 211 with different bending degrees or the same bending degree, and a user may freely adjust the shape of the metal frame 210 through a plurality of processing methods. As shown in fig. 2, the metal frame 210 is a closed ring, and the metal frame 210 is a pentagon, but the shape of the metal frame 210 can be adjusted according to actual requirements, so that the metal frame 210 can be a triangle, a quadrangle (for example, a rectangle, a trapezoid, or a rhombus), a hexagon, other polygons, or a circle. In addition, the "closed ring" is not limited to the geometric shape of the metal frame 210. In other embodiments of the present invention, the metal frame 210 may also have a gap, and thus the metal frame 210 may also be a non-closed ring, which is not limited by the present invention.
In addition, the insulator 221 of the connector 220 is made of an insulating material, and the insulator 221 may be made of, for example, epoxy resin composition, but the present invention is not limited thereto. In some embodiments of the present invention, the conductive elements 223 are arranged in a single row in the insulator 221 of the connector 220, so that when the connector 220 has a single or multiple stacked (e.g., two or three) insulators 221, the connector 220 also has a single row or multiple rows of conductive elements 223, which is not limited by the present invention.
In some embodiments of the present invention, the conductive element 223 is made of a conductive material, wherein the first conductive terminal 223a and the second conductive terminal 223b of the conductive element 223 are configured to be pressed to be elastically deformed, so that the first conductive terminal 223a and the second conductive terminal 223b are made of a conductive material having elasticity, wherein the first conductive terminal 223a and the second conductive terminal 223b may be made of beryllium copper alloy, for example, but the present invention is not limited thereto. Therefore, when the first circuit board 110a and the second circuit board 110b are press-fit with the connector 220 of the connecting frame 200, even though there may be a tolerance between the first circuit board 110a and the second circuit board 110b, the elastic force generated by the pressing of the first conductive terminal 223a and the second conductive terminal 223b causes the first conductive terminal 223a and the second conductive terminal 223b to tightly abut against the first connecting pad 111a and the second connecting pad 111b, respectively, so that the first circuit board 110a and the second circuit board 110b can transmit electrical signals firmly to each other via the conductive element 223.
In some embodiments of the present invention, the first conductive terminal 223a and the second conductive terminal 223b of the conductive element 223 are integrally formed, and the conductive element 223 is substantially C-shaped, wherein the first conductive terminal 223a and the second conductive terminal 223b are respectively inclined to the corresponding two surfaces of the insulator 221. In other words, the straight line connecting the proximal end and the distal end of the first conductive terminal 223a corresponding to the upper surface 221a is inclined to the upper surface 221a, but the present invention is not limited thereto. Similarly, the line connecting the proximal end and the distal end of the second conductive terminal 223b corresponding to the lower surface 221b is also inclined to the corresponding surface from which it extends. In other embodiments of the present invention, the first conductive terminal 223a and the second conductive terminal 223b of the conductive element 223 are non-integrally formed (for example, the first conductive terminal 223a and the second conductive terminal 223b are combined), the conductive element 223 has a conductive pillar extending through the insulator 221, and opposite ends of the conductive pillar are respectively connected to the first conductive terminal 223a and the second conductive terminal 223b, wherein the first conductive terminal 223a and the second conductive terminal 223b may be, for example, a metal spring sheet, so that the first conductive terminal 223a and the second conductive terminal 223b are pressed to elastically deform, but the present invention is not limited thereto.
In one or more embodiments of the present invention, the connection frame 200 includes a first connector 220a and a second connector 220b, wherein the insulator 221 of the first connector 220a and the insulator 221 of the second connector 220b extend toward the same direction or different directions, respectively. For example, the insulator 221 of the first connector 220a is rectangular, the insulator 221 of the second connector 220b is rectangular, and the longest side of the insulator 221 of the first connector 220a and the longest side of the insulator 221 of the second connector 220b extend in the same or different directions. In addition, the conductive elements 223 of the first connector 220a and the conductive elements 223 of the second connector 220b are continuously arranged along the longest side of the corresponding insulator 221, and thus are respectively arranged and extended in the same or different directions, whereby the first connector 220a and the second connector 220b can be electrically connected between the first circuit board 110a and the second circuit board 110b with various types and sizes, which is not limited by the invention.
In one or more embodiments of the present invention, the first circuit board 110a, the second circuit board 110b and the metal frame 210 together form a signal shielding region to protect electronic components located inside the signal shielding region from electromagnetic wave interference, wherein the electronic components may be active components (e.g., an integrated circuit chip or a diode) or passive components (e.g., a capacitor, a resistor, an inductor, etc.), but the present invention is not limited thereto.
In one or more embodiments of the present invention, the first circuit board 110a has one or more openings 113a, the second circuit board 110b has one or more openings 113b, the openings 113a and the openings 113b correspond to and align with each other, wherein the openings 113a are disposed at corners (corner) of the first circuit board 110a and penetrate through the first circuit board 110a, and the openings 113b are disposed at corners of the second circuit board 110b and penetrate through the second circuit board 110 b. In some embodiments of the present invention, the openings 113a and 113b have smooth inner walls. In other embodiments, the openings 113a and 113b are screw holes for screw locking, and the openings 113a and 113b have inner threaded walls, but the present invention is not limited thereto.
Specifically, the detachable locking member 115 is configured to pass through the opening 113a and the corresponding opening 113b, so as to fix the first circuit board 110a and the second circuit board 110b to each other and clamp the connecting frame 200. The locking member 115 may be, for example, a screw element or a snap element, wherein the screw element may include a bolt and a nut, but the invention is not limited thereto. Since the openings 113a,113b and the locking members 115 are designed to easily disassemble and assemble the circuit board stacking apparatus 100, it is able to replace the conventional surface mounting technology, thereby avoiding the damage or deformation of the parts on the first circuit board 110a and the second circuit board 110b caused by the high temperature solder furnace in the surface mounting technology. In addition, since the locking member 115 of the circuit board stacking apparatus 100 is easily detachable, if the internal components of the connection frame 200 are failed, the circuit board stacking apparatus 100 can be easily detached and maintained.
In summary, the metal frame of the connection frame has a plurality of bending portions, so that the connection device has a relatively large degree of freedom in adjusting the shape, and the connector disposed on the metal frame can also relatively freely adjust the arrangement positions of the plurality of conductive elements, so as to connect various types of circuit boards. In addition, the metal frame between the circuit boards can further protect the electronic components arranged inside the metal frame from being interfered by electromagnetic waves.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed with the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make modifications or changes equivalent to the equivalent embodiment of the above embodiments without departing from the scope of the present invention, but all the modifications, changes and modifications of the above embodiments by the technical spirit of the present invention are within the scope of the present invention.
Claims (16)
1. A connection device, comprising:
the metal frame body is provided with a plurality of bending parts and at least one straight flat part, wherein the straight flat part is positioned between two adjacent bending parts; and
at least one connector connected to the straight portion of the metal frame, wherein the connector includes:
an insulator disposed on the straight portion of the metal frame; and
each conductive element is partially positioned in the insulator and is provided with a first conductive terminal and a second conductive terminal which protrude out of the insulator, wherein the first conductive terminal and the second conductive terminal respectively protrude out of two corresponding surfaces of the insulator.
2. The connecting device of claim 1, wherein the first conductive terminal and the second conductive terminal of each conductive element are configured to be elastically deformed by being pressed.
3. The connecting device of claim 1, wherein the first conductive terminal and the second conductive terminal of each conductive element are configured to be elastically deformed by being pressed, and the conductive element is C-shaped.
4. The connecting device as claimed in claim 1, wherein the first conductive terminal and the second conductive terminal of each conductive element are configured to be elastically deformed by being pressed, and the first conductive terminal and the second conductive terminal are respectively inclined to the two corresponding surfaces of the insulator.
5. The connecting device of claim 1, wherein the insulator is disposed on an inner sidewall of the metal frame.
6. The connecting device of claim 1 wherein the metal frame is closed loop.
7. The connecting device of claim 1, wherein the straight portion has a height equal to a height of the insulator of the connector.
8. The connector of claim 1, wherein the straight portion is a ground copper layer of the connector.
9. The connector of claim 1, wherein the straight portion is a first grounded copper layer of the connector, the connector further comprising a second grounded copper layer, wherein the conductive element of the connector is disposed between the first grounded copper layer and the second grounded copper layer.
10. A circuit board stacking apparatus, comprising:
a first circuit board including a plurality of first connection pads;
the second circuit board comprises a plurality of second connecting pads; and
a connecting device disposed between the first circuit board and the second circuit board, wherein the connecting device comprises:
the metal frame body is provided with a plurality of bending parts and at least one straight flat part, wherein the straight flat part is positioned between two adjacent bending parts; and
at least one connector connected to the straight portion of the metal frame, wherein the connector includes:
an insulator disposed on the straight portion of the metal frame; and
each conductive element is partially positioned in the insulator and is provided with a first conductive terminal and a second conductive terminal which protrude out of the insulator, wherein the first conductive terminal and the second conductive terminal are respectively positioned on two corresponding surfaces of the insulator, the first connecting pads are respectively abutted against the first conductive terminals of the conductive elements, and the second connecting pads are respectively abutted against the second terminals of the conductive elements.
11. The apparatus of claim 10, wherein the first circuit board and the second circuit board press the connecting device, so that the first conductive terminal and the second conductive terminal of the conductive element are pressed to be elastically deformed.
12. The apparatus of claim 10, wherein the metal frame, the first circuit board and the second circuit board together form a signal shielding region.
13. The apparatus of claim 10, wherein the metal frame is a closed ring, and the insulator is disposed on an inner sidewall of the metal frame.
14. The circuit board stacking apparatus of claim 10, wherein the height of the straight portion is the same as the height of the insulator of the connector.
15. The circuit board stacking apparatus of claim 10, wherein the straight portion is a grounding copper layer of the connector.
16. The apparatus of claim 10, wherein the straight portion is a first grounding copper layer of the connector, the connector further comprising a second grounding copper layer, wherein the conductive element of the connector is disposed between the first grounding copper layer and the second grounding copper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120670143.9U CN214505994U (en) | 2021-04-01 | 2021-04-01 | Connecting device and circuit board stacking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120670143.9U CN214505994U (en) | 2021-04-01 | 2021-04-01 | Connecting device and circuit board stacking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214505994U true CN214505994U (en) | 2021-10-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120670143.9U Active CN214505994U (en) | 2021-04-01 | 2021-04-01 | Connecting device and circuit board stacking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214505994U (en) |
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2021
- 2021-04-01 CN CN202120670143.9U patent/CN214505994U/en active Active
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