TWM616784U - Connection device and circuit board stack device - Google Patents

Abstract

A connection device includes a metal frame and at least one connector. The metal frame has a plurality of bending portions and at least one flat straight portion, in which the flat straight portion is located between adjacent two of the bending portions. The connector is connected to the flat straight portion, in which the connector has a dielectric body and a plurality of conductive elements. The dielectric body is located on the flat straight portion of the metal frame. Each conductive element is partially in the dielectric body and has a first conductive terminal and a second conductive terminal which protrude from the dielectric body, and the first conductive terminal and the second conductive terminal protrude from two corresponding surfaces of the dielectric body, respectively.

Description

Connecting device and circuit board stacking device

The model relates to a connecting device and a circuit board stacking device using the connecting device.

In order to reduce the area occupied by the printed circuit board in electronic products (for example, mobile phones, computers, etc.), the prior art divides the printed circuit board into two pieces, and uses an interposer to connect the two printed circuit boards to each other. Connect to form a printed circuit board stacking device. Generally speaking, the interposer is a ball grid array (BGA) interposer and has solder balls arranged on opposite surfaces thereof. The printed circuit board is soldered to the opposite surface of the interposer through the two surface mounting technology (SMT) with solder balls, so that the printed circuit boards are electrically connected to each other through the interposer. However, in the above SMT process, the high temperature tin furnace may damage the integrated circuit (IC) parts on the printed circuit board or cause the printed circuit board to warp and deform due to thermal stress.

On the other hand, the interposer is difficult to separate from each other after soldering with solder balls and the printed circuit board. If the parts of the subsequent printed circuit board stack structure malfunction and cause product failure, it will not be conducive to disassembling the stack structure. repair.

In view of this, one purpose of the present invention is to provide a connecting device that can solve the above-mentioned problems. The connecting device includes a metal frame and at least one connector. The metal frame has a plurality of bending parts and at least a straight flat part, wherein the straight flat part is located between two adjacent ones of the plurality of bending parts. The connector is connected to the straight flat part of the metal frame, wherein the connector includes an insulator and a plurality of conductive elements. The insulator is arranged on the straight flat part of the metal frame. Each conductive element is partially located in the insulator and has a first conductive terminal and a second conductive terminal protruding from the insulator, wherein the first conductive terminal and the second conductive terminal protrude from the corresponding two surfaces of the insulator.

In one or more embodiments of the present invention, the first conductive terminal and the second conductive terminal of the conductive element are configured to be compressed and elastically deformed.

In one or more embodiments of the present invention, the first conductive terminal and the second conductive terminal of the conductive element are configured to be elastically deformed under pressure, and the conductive element is C-shaped.

In one or more embodiments of the present invention, the first conductive terminal and the second conductive terminal of the conductive element are configured to be compressed After elastic deformation, the first conductive terminal and the second conductive terminal are respectively inclined on the corresponding two surfaces of the insulator.

In one or more embodiments of the present invention, the insulation system is arranged on the inner side wall of the metal frame.

In one or more embodiments of the present invention, the metal frame has a closed ring shape.

In one or more embodiments of the present invention, the height of the straight portion is the same as the height of the insulator of the connector.

In one or more embodiments of the present invention, the straight flat portion is a grounding copper layer of the connector.

In one or more embodiments of the present invention, the straight portion is the first grounded copper layer of the connector, and the connector further includes a second grounded copper layer, wherein the conductive element of the connector is disposed on the first grounded copper layer and the first grounded copper layer. Between two grounded copper layers.

Another object of the present invention is to provide a circuit board stacking device, which includes a first circuit board, a second circuit board and a connecting device. The first circuit board includes a plurality of first connection pads. The second circuit board includes a plurality of second connection pads. The connecting device is arranged between the first circuit board and the second circuit board, wherein the connecting device includes a metal frame and a connector. The metal frame has a plurality of bending parts and at least a straight flat part, wherein the straight flat part is located between two adjacent ones of the plurality of bending parts. The connector is connected to the straight flat part of the metal frame, wherein the connector includes an insulator and a plurality of conductive elements. The insulator is arranged on the straight flat part of the metal frame. The conductive element is partly located in the insulator and has a convex The first conductive terminal and the second conductive terminal of the insulator, wherein the first conductive terminal and the second conductive terminal are respectively located on the corresponding two surfaces of the insulator, the first connection pads respectively abut the first conductive terminal of the conductive element, and the second connection The pads respectively abut against the second conductive terminals of the conductive element.

In one or more embodiments of the present invention, the first circuit board and the second circuit board are press-fitted with the connecting device, so that the first conductive terminal and the second conductive terminal of the conductive element are compressed and deformed elastically.

In one or more embodiments of the present invention, the metal frame, the first circuit board, and the second circuit board jointly form a signal shielding area.

In one or more embodiments of the present invention, the metal frame has a closed ring shape, and the insulation system is disposed on the inner side wall of the metal frame.

In one or more embodiments of the present invention, the height of the straight portion is the same as the height of the insulator of the connector.

In one or more embodiments of the present invention, the straight flat portion is a grounding copper layer of the connector.

In one or more embodiments of the present invention, the straight portion is the first grounded copper layer of the connector, and the connector further includes a second grounded copper layer, wherein the conductive element of the connector is disposed on the first grounded copper layer and the first grounded copper layer. Between two grounded copper layers.

In summary, the metal frame of the connecting device has a plurality of bending parts, so the connecting device has a considerable degree of freedom in adjusting the appearance, so that the connector provided on the metal frame can also adjust the plurality of conductive elements quite freely. Arrangement position to facilitate the connection of multiple types of circuit boards. In addition, the metal frame located between the circuit boards can further protect the internal electronic components from electromagnetic interference.

The above description is only used to explain the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

Hereinafter, multiple implementations of the present invention will be disclosed in schematic form. For the sake of clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplification of the drawings, some conventionally used structures and elements will be shown in the drawings in a simple and schematic manner.

Please refer to Figure 1. Figure 1 shows an exploded view of the circuit board stacking device 100 in one or more embodiments of the present invention. The circuit board stacking device 100 includes a first circuit board 110a, a second circuit board 110b, and a connecting frame.体200. In actual use, the connecting frame 200 is located between the first circuit board 110a and the second circuit board 110b, whereby the first circuit board 110a and the second circuit board 110b are electrically connected to each other through the connecting frame 200 and can communicate with each other Telecommunications signal.

Please refer to Figures 1 to 4 at the same time. FIG. 2 shows a schematic top view of the connecting frame 200 in some embodiments of the present invention. FIG. 3 shows a schematic side view of the connecting frame 200 in some embodiments of the present invention. FIG. 4 shows a schematic side view of the circuit board stacking device 100 and the connecting frame 200 in some embodiments of the present invention, wherein the connecting frame 200 is connected to the first circuit board 110a and the second circuit board 110b. In some embodiments of the present invention, the circuit board stacking device 100 includes a first circuit board 110 a, a second circuit board 110 b, and a connection frame 200. The first circuit board 110a includes a plurality of first connection pads 111a. The second circuit board 110b includes a plurality of second connection pads 111b. The connection frame 200 is disposed between the first circuit board 110 a and the second circuit board 110 b. The connection frame 200 includes a metal frame 210 and one or more connectors 220. The metal frame 210 has a plurality of bending portions 211 and a plurality of straight flat portions 213, wherein the straight flat portion 213 is disposed between two adjacent bending portions 211. The connector 220 is connected to the straight flat portion 213 of the metal frame 210 and is located between the two adjacent bent portions 211. The connector 220 includes an insulator 221 (for example, an insulating layer) and a plurality of conductive elements 223. The height H1 is the same as the height H2 of the insulator 221 of the connector 220. The insulator 221 is disposed on the side wall (for example, the insulator 221 is stacked on the inner side wall or the outer side wall of the straight portion 213 of the metal frame 210). Each conductive element 223 is at least partially located in the insulator 221 and has a first conductive terminal 223a and a second conductive terminal 223b protruding from the insulator 221, wherein the first conductive terminal 223a and the second conductive terminal 223b respectively protrude from the insulator 221 Corresponds to two surfaces. For example, the first conductive terminal 223a and the second conductive terminal 223b protrude from the upper surface 221a and the lower surface 221b of the insulator 221, respectively.

When the connection frame 200 is connected to the first circuit board 110a and the second circuit board 110b, the plurality of first connection pads 111a respectively abut the first conductive terminals 223a of the plurality of conductive elements 223, and the plurality of second connection pads 111b respectively abut The second conductive terminals 223b of a plurality of conductive elements 223 are connected. In addition, the metal frame 210 connecting the frame body 200 has a plurality of bending portions 211. The number and inclination angles of the straight and flat portions 213 are also different according to the number of the bent portions 211 and the bending conditions. Therefore, the connecting frame body 200 has a considerable With a large degree of freedom in appearance adjustment, the connector 220 on the side wall of the metal frame 210 can also adjust the arrangement and extension direction of the plurality of conductive elements 223 quite freely, so that the connection frame 200 is suitable for multiple types or sizes of first circuits Between the board 110a and the second circuit board 110b. In addition, the metal frame 210 located between the first circuit board 110a and the second circuit board 110b can further protect the electronic components disposed therein from being easily interfered by electromagnetic waves.

In one or more embodiments of the present invention, the straight portion 213 serves as the first grounding copper layer G1 of the connector 220 and is used to provide the connector 220 with a grounding function. In addition, the connector 220 further includes a second grounded copper layer G2, wherein part or all of the conductive elements 223 of the connector 220 are disposed between the first grounded copper layer G1 and the second grounded copper layer G2, but the present invention does not This is limited. In other words, the first grounded copper layer G1 and the second grounded copper layer G2 may be ground metal layers connected to the outermost and innermost sides of the frame 200, respectively. In addition, the first grounded copper layer G1 and the second grounded copper layer G2 can be made of, for example, a conductive material of copper metal or copper alloy, but the present invention is not limited to this.

Specifically, the first circuit board 110a and the second circuit board 110b may be formed by cutting a whole double layer printed circuit board (PCB) (for example, using laser cutting technology), but the present invention Not limited to this. In addition, the first circuit board 110a and the second circuit board 110b may have regular shapes such as squares, rectangles, polygons, or other irregular shapes. In other words, the first circuit board 110a and the second circuit board 110b can have any suitable shapes, and the first circuit board 110a and the second circuit board 110b can have the same or different shapes and sizes. In some embodiments of the present invention, the size (for example, length, width, area, etc.) of the first circuit board 110a is smaller than the size of the second circuit board 110b. In some embodiments of the present invention, the first circuit board 110a and the second circuit board 110b may be a single layer PCB or a multi-layer PCB. In addition, the first connection pad 111a and the second connection pad 111b may include solder pads and/or solder balls formed on the first circuit board 110a and the second circuit board 110b, and the present invention is not limited thereto. .

In some embodiments of the present invention, the connecting frame 200 is a land grid array (LGA) connecting device (or LGA/LGA connecting device), but the present invention is not limited to this. The metal frame 210 is made of a metal material, and the metal frame 210 is, for example, made of copper or copper alloy and is integrally formed. For example, the metal frame 210 is made by bending a copper plate. Therefore, the metal frame 210 may have a plurality of different bending degrees or a plurality of bending portions 211 with the same bending degree, and the user can use various processing methods. The shape of the metal frame 210 can be adjusted freely. It can be seen from Figure 2 that the metal frame 210 is a closed ring, and the metal frame 210 is pentagonal, but the shape of the metal frame 210 can be adjusted according to actual needs. Therefore, the metal frame 210 can be triangular or quadrilateral (for example, rectangular). , Trapezoid or rhombus), hexagon, other polygons or circles. In addition, the “closed ring” used herein is not used to limit the geometric shape of the metal frame 210. In other embodiments of the present invention, the metal frame 210 may also have a gap, so the metal frame 210 may also have a non-closed ring shape, and the present invention is not limited to this.

In addition, the insulator 221 of the connector 220 is made of insulating material, and the insulator 221 can be made of, for example, an epoxy resin composition, but the present invention is not limited to this. In some embodiments of the present invention, conductive elements 223 arranged in a single row are arranged in the insulator 221 of the connector 220. Therefore, when the connector 220 has a single or multiple stacked (for example, two or three) insulators 221, the connector 220 also has conductive elements 223 arranged in a single row or in multiple rows, and the present invention is not limited to this.

In some embodiments of the present invention, the conductive element 223 is made of a conductive material, and the first conductive terminal 223a and the second conductive terminal 223b of the conductive element 223 are configured to be compressed and elastically deformed, so the first conductive terminal 223a The second conductive terminal 223b and the second conductive terminal 223b are made of elastic conductive material. The first conductive terminal 223a and the second conductive terminal 223b can be made of beryllium copper alloy, but the present invention is not limited thereto. Therefore, when the first circuit board 110a and the second circuit board 110b are press-fitted to the connector 220 of the frame 200, even though the first circuit board 110a and the second circuit board 110b may have a tolerance, the first conductive terminals 223a and The elastic force generated by the pressure of the second conductive terminal 223b will cause the first conductive terminal 223a and the second conductive terminal 223b to tightly abut the first connection pad 111a and the second connection pad 111b, respectively, so that the first circuit board 110a and the second circuit board 110a and the second The circuit board 110b can stably transmit electrical signals to each other via the conductive element 223.

In some embodiments of the present invention, the first conductive terminal 223a and the second conductive terminal 223b of the conductive element 223 are integrally formed, and the conductive element 223 is approximately C-shaped, wherein the first conductive terminal 223a and the second conductive terminal 223b They are inclined to the corresponding two surfaces of the insulator 221 respectively. In other words, the line formed by the first conductive terminal 223a corresponding to the closest end and the farthest end of the upper surface 221a will be inclined to the upper surface 221a, but the present invention is not limited to this. Similarly, the straight line formed by the second conductive terminal 223b corresponding to the nearest end and the farthest end of the lower surface 221b will also be inclined to the corresponding extended surface. In other embodiments of the present invention, the first conductive terminal 223a and the second conductive terminal 223b of the conductive element 223 are not integrally formed (for example, the first conductive terminal 223a and the second conductive terminal 223b are combined), and the conductive element 223 has conductive pillars extending through the insulator 221, and opposite ends of the conductive pillars are respectively connected to the first conductive terminal 223a and the second conductive terminal 223b. The first conductive terminal 223a and the second conductive terminal 223b can be, for example, metal springs. So that the first conductive terminal 223a and the second conductive terminal 223b are compressed and deformed elastically, but the present invention is not limited to this.

In one or more embodiments of the present invention, the connection frame 200 includes a first connector 220a and a second connector 220b, wherein the insulator 221 of the first connector 220a and the insulator 221 of the second connector 220b face the same Or extend in different directions. For example, the insulator 221 of the first connector 220a is rectangular, and the insulator 221 of the second connector 220b is rectangular, the longest side of the insulator 221 of the first connector 220a and the longest side of the insulator 221 of the second connector 220b They extend in the same or different directions. In addition, the conductive elements 223 of the first connector 220a and the conductive elements 223 of the second connector 220b are continuously arranged along the longest side of the corresponding insulator 221, and thus extend in the same or different directions respectively, thereby the first connection The connector 220a and the second connector 220b can be electrically connected between the first circuit board 110a and the second circuit board 110b of various types and sizes, and the present invention is not limited thereto.

In one or more embodiments of the present invention, the first circuit board 110a, the second circuit board 110b, and the metal frame 210 jointly form a signal shielding area to protect the electronic components inside them from electromagnetic wave interference. The electronic components can be active components (for example, integrated circuit chips or diodes) or passive components (for example, capacitors, resistors, inductors, etc.), but the present invention is not limited to this.

In one or more embodiments of the present invention, the first circuit board 110a has one or more openings 113a, the second circuit board 110b has one or more openings 113b, and the openings 113a and the openings 113b correspond to each other. Aligned, wherein the opening 113a is provided at the corner of the first circuit board 110a and penetrates the first circuit board 110a, and the opening 113b is provided at the corner of the second circuit board 110b and penetrates the second circuit board 110b . In some embodiments of the present invention, the opening 113a and the opening 113b have smooth inner walls. In other embodiments, the opening 113a and the opening 113b are screw holes for screw locking, and the opening 113a and the opening 113b have threaded inner walls, but the present invention is not limited thereto.

Specifically, the detachable locking member 115 is used to pass through the opening 113a and the corresponding opening 113b at the same time, so as to fix the first circuit board 110a and the second circuit board 110b to each other and clamp the connection frame 200 at the same time. The locking member 115 may be, for example, a screw element or a snap element, etc. The screw element may include a bolt and a nut, but the present invention is not limited thereto. Since the design of the opening 113a, the opening 113b, and the locking member 115 can be easily disassembled and combined with the circuit board stacking device 100, it can replace the conventional surface mounting technology, thereby avoiding the high temperature tin furnace in the surface mounting technology from causing the first circuit board Parts on 110a and the second circuit board 110b are damaged or deformed. In addition, since the locking member 115 used in the circuit board stacking device 100 can be easily disassembled, if the internal components of the connecting frame 200 fail, the circuit board stacking device 100 can be easily disassembled and repaired.

In summary, the metal frame connecting the frame body has a plurality of bending parts, so the connecting device has a considerable degree of freedom in adjusting the appearance, so that the connector provided on the metal frame can also adjust the plurality of conductive elements quite freely. The arrangement of the components to facilitate the connection of various types of circuit boards. In addition, the metal frame located between the circuit boards can further protect the internal electronic components from electromagnetic interference.

The above description is only used to explain the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

100: Circuit board stacking device 110a: The first circuit board 111a: The first connection pad 110b: second circuit board 111b: second connection pad 113a, 113b: cut-out 115: lock firmware 200: Connect the frame 210: metal frame 211: Bending part 213: Straight 220: Connector 220a: first connector 220b: second connector 221: Insulator 221a: upper surface 221b: lower surface 223: conductive element 223a: first conductive terminal 223b: second conductive terminal H1, H2: height G1: The first ground copper layer G2: second ground copper layer

In order to achieve the above advantages and features, the principles briefly described above will be explained in more detail with reference to the embodiments, and the specific embodiments are shown in the accompanying drawings. These drawings only exemplarily describe the present invention, and therefore do not limit the scope of the present invention. The principle of the present invention will be clearly explained through the drawings, and additional features and details will be fully described, among which: Figure 1 shows a three-dimensional exploded view of a circuit board stacking device in some embodiments of the present invention; Figure 2 shows a schematic top view of the connecting device in some embodiments of the present invention; Figure 3 shows a schematic side view of the connecting device in some embodiments of the present invention; and FIG. 4 shows a schematic side view of the circuit board stacking device and the connecting device in some embodiments of the present invention.

100: Circuit board stacking device

110a: The first circuit board

110b: second circuit board

111b: second connection pad

113a, 113b: opening

115: lock firmware

200: Connecting device

211: Bending part

213: Straight

220: Connector

220a: first connector

220b: second connector

221: Insulator

223: conductive element

223a: first conductive terminal

H1, H2: height

G1: The first ground copper layer

G2: second ground copper layer

Claims (16)

A connecting device includes: a metal frame body with a plurality of bent parts and at least a straight flat part, wherein the straight flat part is located between two adjacent ones of the bent parts; and at least one connector connected to The straight portion of the metal frame, wherein the connector includes: an insulator disposed on the straight portion of the metal frame; and a plurality of conductive elements, each of the conductive elements is partially located in the insulator and has The first conductive terminal and the second conductive terminal protruding from the insulator, wherein the first conductive terminal and the second conductive terminal respectively protrude from the corresponding two surfaces of the insulator. The connecting device according to claim 1, wherein the first conductive terminal and the second conductive terminal of each of the conductive elements are configured to be compressed and elastically deformed. The connection device according to claim 1, wherein the first conductive terminal and the second conductive terminal of each of the conductive elements are configured to be compressed and elastically deformed, and the conductive elements are C-shaped. The connection device according to claim 1, wherein the first conductive terminal and the second conductive terminal of each of the conductive elements are configured to be compressed and elastically deformed, and the first conductive terminal and the second conductive terminal are respectively inclined On the corresponding two surfaces of the insulator. The connection device according to claim 1, wherein the insulation system is disposed on the inner side wall of the metal frame. The connecting device according to claim 1, wherein the metal frame has a closed ring shape. The connecting device according to claim 1, wherein the height of the straight portion is the same as the height of the insulator of the connector. The connection device according to claim 1, wherein the straight portion is a grounding copper layer of the connector. The connection device according to claim 1, wherein the straight portion is a first grounded copper layer of the connector, and the connector further includes a second grounded copper layer, wherein the conductive elements of the connector are disposed on the first ground copper layer. Between a grounded copper layer and the second grounded copper layer. A circuit board stacking device includes: a first circuit board including a plurality of first connecting pads; a second circuit board including a plurality of second connecting pads; and a connecting device arranged on the first circuit board and the second circuit Between the plates, wherein the connecting device includes: a metal frame with a plurality of bending parts and at least a straight part, wherein the The straight flat part is located between two adjacent ones of the bent parts; and at least one connector is connected to the straight flat part of the metal frame, wherein the connector includes: an insulator disposed on the metal frame And a plurality of conductive elements, each of the conductive elements is partially located in the insulator and has a first conductive terminal and a second conductive terminal protruding from the insulator, wherein the first conductive terminal and the The second conductive terminals are respectively located on two corresponding surfaces of the insulator, the first connection pads respectively abut the first conductive terminals of the conductive elements, and the second connection pads respectively abut the second conductive elements of the conductive elements. Conductive terminal. The circuit board stacking device according to claim 10, wherein the first circuit board and the second circuit board are pressed against the connecting device, so that the first conductive terminal and the second conductive terminal of the conductive elements are compressed and elastic Deformed. The circuit board stacking device according to claim 10, wherein the metal frame, the first circuit board, and the second circuit board jointly form a signal shielding area. The circuit board stacking device according to claim 10, wherein the metal frame has a closed ring shape, and the insulation system is disposed on the inner side wall of the metal frame. The circuit board stacking device according to claim 10, wherein the height of the straight flat portion is the same as the height of the insulator of the connector. The circuit board stacking device according to claim 10, wherein the straight flat portion is a grounding copper layer of the connector. The circuit board stacking device according to claim 10, wherein the straight portion is a first grounded copper layer of the connector, the connector further includes a second grounded copper layer, and the conductive elements of the connector are disposed on Between the first grounded copper layer and the second grounded copper layer.

Images