KR0132416Y1 - 웨이퍼 스크래치 방지용 클램프 링 - Google Patents
웨이퍼 스크래치 방지용 클램프 링 Download PDFInfo
- Publication number
- KR0132416Y1 KR0132416Y1 KR2019950038044U KR19950038044U KR0132416Y1 KR 0132416 Y1 KR0132416 Y1 KR 0132416Y1 KR 2019950038044 U KR2019950038044 U KR 2019950038044U KR 19950038044 U KR19950038044 U KR 19950038044U KR 0132416 Y1 KR0132416 Y1 KR 0132416Y1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- clamp ring
- pressing
- pressing surface
- inclined support
- Prior art date
Links
- 230000002265 prevention Effects 0.000 claims abstract description 11
- 238000006748 scratching Methods 0.000 abstract description 5
- 230000002393 scratching effect Effects 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 description 9
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (1)
- 가압면(11b)의 웨이퍼 누름 각도를 1° 20’이하로 비교적 작게 하고, 그 가압면(11b)과 경사 지지면(11d)이 만나는 모서리 부위의 곡률을 RO.3 MAX 비교적 크게 하여 구성한 것을 특징으로 하는 웨이퍼 스크래치 방지용 클램핑 링.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950038044U KR0132416Y1 (ko) | 1995-12-04 | 1995-12-04 | 웨이퍼 스크래치 방지용 클램프 링 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950038044U KR0132416Y1 (ko) | 1995-12-04 | 1995-12-04 | 웨이퍼 스크래치 방지용 클램프 링 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970046818U KR970046818U (ko) | 1997-07-31 |
KR0132416Y1 true KR0132416Y1 (ko) | 1999-02-01 |
Family
ID=19431890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950038044U KR0132416Y1 (ko) | 1995-12-04 | 1995-12-04 | 웨이퍼 스크래치 방지용 클램프 링 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0132416Y1 (ko) |
-
1995
- 1995-12-04 KR KR2019950038044U patent/KR0132416Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR970046818U (ko) | 1997-07-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100207451B1 (ko) | 반도체 웨이퍼 고정장치 | |
KR100294062B1 (ko) | 웨이퍼 처리 챔버에서의 돔형 페데스탈용 클램프 링 | |
US5569350A (en) | Mechanism and method for mechanically removing a substrate | |
JPH11111819A (ja) | ウェハーの固定方法及び露光装置 | |
US20220102178A1 (en) | Reticle pod having anti-collision gap structure | |
KR960009989B1 (ko) | 웨이퍼재치용시트 확장방법 | |
KR0132416Y1 (ko) | 웨이퍼 스크래치 방지용 클램프 링 | |
US20030201593A1 (en) | Block suction apparatus | |
ATE319185T1 (de) | Anordnung zum tragen eines substrates während eines angepassten schneidverfahrens | |
KR100325905B1 (ko) | 다이본딩장치 | |
JP2821678B2 (ja) | 基板の吸着装置 | |
US5268067A (en) | Wafer clamping method | |
CN219811473U (zh) | 一种平边朝外铝盘下盖及晶圆料盘 | |
US6165276A (en) | Apparatus for preventing plasma etching of a wafer clamp in semiconductor fabrication processes | |
JPH06132387A (ja) | 真空吸着ステージ | |
CN218036465U (zh) | 一种芯片外观光学检测装置 | |
JP3162886B2 (ja) | 処理装置 | |
CN220627772U (zh) | 可即时破真空的晶圆吸附平台 | |
CN219526775U (zh) | 载片装置以及等离子体设备 | |
CN217453330U (zh) | 一种光学镜片抛光清洗用夹具 | |
JPS60204506A (ja) | 基板の搬出・搬入装置 | |
KR200171679Y1 (ko) | 반도체웨이퍼척 | |
KR200198450Y1 (ko) | 반도체 웨이퍼 검사장비의 척 | |
CN209831436U (zh) | 一种密封性薄片夹持装置 | |
KR20070036270A (ko) | 플라즈마 처리장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
UA0108 | Application for utility model registration |
Comment text: Application for Utility Model Registration Patent event code: UA01011R08D Patent event date: 19951204 |
|
UA0201 | Request for examination |
Patent event date: 19951204 Patent event code: UA02012R01D Comment text: Request for Examination of Application |
|
UG1501 | Laying open of application | ||
E701 | Decision to grant or registration of patent right | ||
UE0701 | Decision of registration |
Patent event date: 19980724 Comment text: Decision to Grant Registration Patent event code: UE07011S01D |
|
REGI | Registration of establishment | ||
UR0701 | Registration of establishment |
Patent event date: 19980926 Patent event code: UR07011E01D Comment text: Registration of Establishment |
|
UR1002 | Payment of registration fee |
Start annual number: 1 End annual number: 3 Payment date: 19980924 |
|
UG1601 | Publication of registration | ||
UR1001 | Payment of annual fee |
Payment date: 20010817 Start annual number: 4 End annual number: 4 |
|
UR1001 | Payment of annual fee |
Payment date: 20020820 Start annual number: 5 End annual number: 5 |
|
UR1001 | Payment of annual fee |
Payment date: 20030814 Start annual number: 6 End annual number: 6 |
|
UR1001 | Payment of annual fee |
Payment date: 20040820 Start annual number: 7 End annual number: 7 |
|
UR1001 | Payment of annual fee |
Payment date: 20050822 Start annual number: 8 End annual number: 8 |
|
UR1001 | Payment of annual fee |
Payment date: 20060818 Start annual number: 9 End annual number: 9 |
|
UR1001 | Payment of annual fee |
Payment date: 20070827 Start annual number: 10 End annual number: 10 |
|
UR1001 | Payment of annual fee |
Payment date: 20080820 Start annual number: 11 End annual number: 11 |
|
UR1001 | Payment of annual fee |
Payment date: 20090828 Start annual number: 12 End annual number: 12 |
|
FPAY | Annual fee payment |
Payment date: 20100825 Year of fee payment: 13 |
|
UR1001 | Payment of annual fee |
Payment date: 20100825 Start annual number: 13 End annual number: 13 |
|
EXPY | Expiration of term |