KR0132405B1 - 오존을사용하는아세트산무수물또는아세트산무수물및아세트산의혼합물의정제방법 - Google Patents
오존을사용하는아세트산무수물또는아세트산무수물및아세트산의혼합물의정제방법Info
- Publication number
- KR0132405B1 KR0132405B1 KR1019930012748A KR930012748A KR0132405B1 KR 0132405 B1 KR0132405 B1 KR 0132405B1 KR 1019930012748 A KR1019930012748 A KR 1019930012748A KR 930012748 A KR930012748 A KR 930012748A KR 0132405 B1 KR0132405 B1 KR 0132405B1
- Authority
- KR
- South Korea
- Prior art keywords
- acetic anhydride
- mixture
- acetic acid
- acetic
- column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C51/00—Preparation of carboxylic acids or their salts, halides or anhydrides
- C07C51/42—Separation; Purification; Stabilisation; Use of additives
- C07C51/487—Separation; Purification; Stabilisation; Use of additives by treatment giving rise to chemical modification
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C51/00—Preparation of carboxylic acids or their salts, halides or anhydrides
- C07C51/54—Preparation of carboxylic acid anhydrides
- C07C51/573—Separation; Purification; Stabilisation; Use of additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S203/00—Distillation: processes, separatory
- Y10S203/20—Power plant
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP92-179903 | 1992-07-07 | ||
| JP17990392A JP3220234B2 (ja) | 1992-07-07 | 1992-07-07 | オゾンによる無水酢酸または無水酢酸および酢酸の混合物の精製法 |
| JP312607/1992 | 1992-10-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940002212A KR940002212A (ko) | 1994-02-16 |
| KR0132405B1 true KR0132405B1 (ko) | 1998-04-13 |
Family
ID=16073924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019930012748A Expired - Lifetime KR0132405B1 (ko) | 1992-07-07 | 1993-07-07 | 오존을사용하는아세트산무수물또는아세트산무수물및아세트산의혼합물의정제방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5362365A (enExample) |
| EP (1) | EP0578193B1 (enExample) |
| JP (1) | JP3220234B2 (enExample) |
| KR (1) | KR0132405B1 (enExample) |
| CN (1) | CN1034924C (enExample) |
| DE (1) | DE69305254T2 (enExample) |
| TW (1) | TW247312B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160037795A (ko) * | 2014-09-26 | 2016-04-06 | 주식회사 에코프로 | 고순도 알루미늄 산화물 제조방법 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1040101C (zh) * | 1993-08-18 | 1998-10-07 | 大世吕化学工业株式会社 | 乙酸酐或乙酸酐和乙酸的制备方法 |
| EP0645362A1 (en) * | 1993-09-17 | 1995-03-29 | Daicel Chemical Industries, Ltd. | Process for producing highly purified acetic acid |
| JP3659042B2 (ja) * | 1999-01-14 | 2005-06-15 | 三菱化学株式会社 | ポリアルキレンエーテルグリコールの製造方法 |
| JP4368026B2 (ja) * | 2000-02-17 | 2009-11-18 | ダイセル化学工業株式会社 | 粗製無水酢酸の精製法及び無水酢酸を用いたポリオキシテトラメチレングリコールの製造法 |
| KR100709018B1 (ko) * | 2000-02-17 | 2007-04-18 | 다이셀 화학 공업 주식회사 | 무수초산, 조제 무수초산의 정제법 및 무수초산을 이용한폴리옥시테트라메틸렌글리콜의 제조법 |
| JP2002037756A (ja) * | 2000-05-18 | 2002-02-06 | Daicel Chem Ind Ltd | 無水酢酸 |
| JP4861563B2 (ja) * | 2001-04-24 | 2012-01-25 | 昭和電工株式会社 | 低級脂肪族カルボン酸の精製方法、該精製方法による低級脂肪族カルボン酸の製造方法及び該製造方法により得られた低級脂肪族カルボン酸 |
| KR20030043702A (ko) | 2001-11-26 | 2003-06-02 | 간사이 페인트 가부시키가이샤 | 폴리벤족사졸 전구체 및 그것을 이용하는 피복용 조성물 |
| JP2004131389A (ja) * | 2002-10-08 | 2004-04-30 | Daicel Chem Ind Ltd | カルボン酸の製造方法及び製造システム |
| US7208625B1 (en) * | 2006-08-04 | 2007-04-24 | Lyondell Chemical Technology, L.P. | Removing permanganate-reducing impurities from acetic acid |
| EP3398930B1 (en) * | 2017-03-22 | 2019-11-20 | Daicel Corporation | Method for producing acetic acid |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2255421A (en) * | 1936-07-25 | 1941-09-09 | Shell Dev | Process for purification of carboxylic acids |
| US2278831A (en) * | 1941-03-21 | 1942-04-07 | Du Pont | Purification of aliphatic acids and anhydrides |
| US2893923A (en) * | 1954-05-28 | 1959-07-07 | Celanese Corp | Purification of acetic acid by azeotropic distillation |
| JPS4830615A (enExample) * | 1971-08-24 | 1973-04-23 | ||
| US3928434A (en) * | 1973-04-02 | 1975-12-23 | Union Carbide Corp | Oxidative removal of impurities from acetic acid |
| JPS5564545A (en) * | 1978-11-06 | 1980-05-15 | Daicel Chem Ind Ltd | Purification of acetic acid |
| DE3329781A1 (de) * | 1983-08-18 | 1985-02-28 | Hoechst Ag, 6230 Frankfurt | Verfahren zur abtrennung von jod und dessen verbindungen aus den bei der carbonylierung von dimethylether, methylacetat oder methanol erhaltenen carbonylierungsprodukten |
| JPS60222439A (ja) * | 1984-04-20 | 1985-11-07 | Daicel Chem Ind Ltd | 粗製無水酢酸の精製法 |
| JPS612052A (ja) * | 1984-06-15 | 1986-01-08 | Iseki & Co Ltd | 穀粒用自動水分計 |
| JPH0635418B2 (ja) * | 1984-08-27 | 1994-05-11 | ダイセル化学工業株式会社 | 酢酸の精製方法 |
| US5155266A (en) * | 1987-12-23 | 1992-10-13 | Hoechst Celanese Corporation | Purification of acetic acid with ozone in the presence of an oxidation catalyst |
| CA1313676C (en) * | 1987-12-23 | 1993-02-16 | Mark Owen Scates | Purification of acetic acid with ozone |
| US5155265A (en) * | 1987-12-23 | 1992-10-13 | Hoechst Celanese Corporation | Purification of acetic acid with ozone followed by treatment with activated carbon and/or an ion-exchange resin |
| US5202481A (en) * | 1987-12-23 | 1993-04-13 | Hoechst Celanese Corporation | Purification of acetic acid produced by the low water carbonylation of methanol by treatment with ozone |
| CA2004586A1 (en) * | 1988-12-09 | 1990-06-09 | G. Paull Torrence | Treatment of acetic acid with hydrogen in the presence of a hydrogenation catalyst |
-
1992
- 1992-07-07 JP JP17990392A patent/JP3220234B2/ja not_active Expired - Lifetime
-
1993
- 1993-06-25 TW TW082105057A patent/TW247312B/zh not_active IP Right Cessation
- 1993-07-06 EP EP93110769A patent/EP0578193B1/en not_active Expired - Lifetime
- 1993-07-06 US US08/088,035 patent/US5362365A/en not_active Expired - Lifetime
- 1993-07-06 DE DE69305254T patent/DE69305254T2/de not_active Expired - Fee Related
- 1993-07-07 CN CN93108242A patent/CN1034924C/zh not_active Expired - Lifetime
- 1993-07-07 KR KR1019930012748A patent/KR0132405B1/ko not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160037795A (ko) * | 2014-09-26 | 2016-04-06 | 주식회사 에코프로 | 고순도 알루미늄 산화물 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69305254D1 (de) | 1996-11-14 |
| JP3220234B2 (ja) | 2001-10-22 |
| TW247312B (enExample) | 1995-05-11 |
| EP0578193A1 (en) | 1994-01-12 |
| DE69305254T2 (de) | 1997-03-06 |
| CN1085539A (zh) | 1994-04-20 |
| CN1034924C (zh) | 1997-05-21 |
| KR940002212A (ko) | 1994-02-16 |
| EP0578193B1 (en) | 1996-10-09 |
| US5362365A (en) | 1994-11-08 |
| JPH0625071A (ja) | 1994-02-01 |
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| KR0144154B1 (ko) | 아세트산 및 아세트산 무수물의 제조방법 | |
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| KR0132405B1 (ko) | 오존을사용하는아세트산무수물또는아세트산무수물및아세트산의혼합물의정제방법 | |
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| JPWO1995005356A1 (ja) | 無水酢酸又は無水酢酸及び酢酸の製造方法 | |
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| EP1360165B1 (en) | Method for reducing eda in acetic anhydride production |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19930707 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19940425 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19930707 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19970620 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19970923 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19971210 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 19971210 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20001130 Start annual number: 4 End annual number: 4 |
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| PR1001 | Payment of annual fee |
Payment date: 20011205 Start annual number: 5 End annual number: 5 |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
Payment date: 20111118 Start annual number: 15 End annual number: 15 |
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| FPAY | Annual fee payment |
Payment date: 20121121 Year of fee payment: 16 |
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| PR1001 | Payment of annual fee |
Payment date: 20121121 Start annual number: 16 End annual number: 16 |
|
| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |
Termination date: 20140107 Termination category: Expiration of duration |