KR0125333Y1 - Apparatus for mounting electronic part - Google Patents

Apparatus for mounting electronic part Download PDF

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Publication number
KR0125333Y1
KR0125333Y1 KR2019930011956U KR930011956U KR0125333Y1 KR 0125333 Y1 KR0125333 Y1 KR 0125333Y1 KR 2019930011956 U KR2019930011956 U KR 2019930011956U KR 930011956 U KR930011956 U KR 930011956U KR 0125333 Y1 KR0125333 Y1 KR 0125333Y1
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KR
South Korea
Prior art keywords
adsorption
nozzle
direction drive
mounting
component
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KR2019930011956U
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Korean (ko)
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KR950002548U (en
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이성찬
오병준
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김광호
삼성전자주식회사
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Priority to KR2019930011956U priority Critical patent/KR0125333Y1/en
Publication of KR950002548U publication Critical patent/KR950002548U/en
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Publication of KR0125333Y1 publication Critical patent/KR0125333Y1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 고안은 인식장치 및 X-Y테이블에서 Y축의 동기 구동수단의 활용으로 부품실장시간의 손실을 극소화함으로써 실장 시간을 현저히 단축하는 한편, 실장정도의 대폭향상을 기할 수 있도록 한 전자부품 실장장치에 관한 것으로, 특히, 본체(A)의 X-Y테이블(1) 상부 양측에, 구동모터(21),(31)를 가지며 동기구동되는 나선형태의 Y방향 구동축(2),(3)을 설치하고, 이에, 흡착노즐(51)이 설치된 노즐헤드(5)와 상기 흡착노즐(51)에 흡착되는 부품의 흡착상태를 하방으로부터 촬영가능한 인식장치(61)가 설치된 부품인식용 카메라 헤드(61) 및 구동모터(41)를 가지는 X방향 구동축(4)을 직교되게 설치구성 하여서 된 것이다.The present invention relates to an electronic component mounting apparatus which can significantly reduce the mounting time by minimizing the loss of component mounting time by utilizing the synchronous driving means of the Y axis in the recognition device and the XY table, and at the same time, greatly improve the mounting accuracy. In particular, on both sides of the upper portion of the XY table 1 of the main body A, the helical Y-direction drive shafts 2 and 3 having the drive motors 21 and 31 are synchronously driven, and thus, A part recognition camera head 61 and a driving motor provided with a nozzle head 5 provided with an adsorption nozzle 51 and a recognition device 61 capable of capturing an adsorption state of components adsorbed to the adsorption nozzle 51 from below. 41 is installed by orthogonally installing the X-direction drive shaft (4).

Description

전자부품 실장장치Electronic component mounting device

제1도는 종래 전자부품 실장장치의 개략 구성도.1 is a schematic configuration diagram of a conventional electronic component mounting apparatus.

제2도는 본 고안 전자부품 실장장치의 구성을 보인 발췌사시도.Figure 2 is an excerpt perspective view showing the configuration of the electronic component mounting device of the present invention.

제3도는 본 고안의 흡착노즐이 부품공급부로 이동하는 상태를 나타낸 설명도.3 is an explanatory view showing a state in which the suction nozzle of the present invention is moved to the component supply unit.

제4도는 본 고안의 흡착노즐이 부품을 흡착하는 상태를 나타낸 설명도.4 is an explanatory diagram showing a state in which the adsorption nozzle of the present invention adsorbs components.

제5도는 본 고안에 의해 부품이 흡착된 후의 작동상태를 나타낸 설명도.5 is an explanatory diagram showing an operating state after a component is adsorbed by the present invention.

제6도는 본 고안에 의해 흡착부품을 인식하고 기판으로 이송하는 상태를 나타낸 설명도.6 is an explanatory diagram showing a state in which the adsorption part is recognized and transferred to the substrate by the present invention.

제7도는 본 고안에 의해 부품을 기판의 정해진 위치에 장착하기 위한 작동상태를 나타낸 설명도.Figure 7 is an explanatory diagram showing an operating state for mounting a part in a predetermined position of the substrate by the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

A : 본체 1 : X-Y테이블A: Main body 1: X-Y table

2,3 : Y방향 구동축 4 : X방향 구동축2,3: Y-direction drive shaft 4: X-direction drive shaft

5 : 노즐헤드 6 : 카메라 헤드5: nozzle head 6: camera head

21,31,41 : 구동모터 51 : 흡착노즐21,31,41: drive motor 51: adsorption nozzle

61 : 인식장치61: recognition device

본 고안은 칩형의 전자부품을 흡착노즐로 흡착하여 이송함과 아울러 흡착된 부품을 인식장치로 인식하여 기판에 실장(장착설치)하는 전자부품 실장장치에 관한 것으로, 특히, 인식장치 및 X-Y 테이블에서 Y축의 동기구동 수단의 활용으로 부품실장시간의 손실을 극소화 함으로써 실장시간을 현저히 단축하는 한편, 실장정도의 향상을 기할 수 있도록 한 전자부품 실장장치에 관한 것이다.The present invention relates to an electronic component mounting apparatus that adsorbs and transfers chip-shaped electronic components with an adsorption nozzle, and recognizes the absorbed components as a recognition device and mounts them on a substrate. The present invention relates to an electronic component mounting apparatus which can shorten the mounting time by minimizing the loss of component mounting time by utilizing the synchronous driving means of the Y axis and improve the mounting accuracy.

종래 일반적인 전자부품 실장장치는, 흡착노즐로 흡착한 부품의 상태를 CCD(Charge Coupled Device) 카메라 등으로 화상인식하고 위치, 보정을 하여 기판위에 실장하는 부품 실장장치에서 부품인식기능부가 별도로 설치되고, X-Y테이블에서 X방향 구동축을 지지하는 Y방향 구동축이 단일의 축으로 된 것이 주류를 이루고 있다.Conventionally, a general electronic component mounting apparatus has a component recognition function separately installed in a component mounting apparatus mounted on a substrate by recognizing, positioning and correcting a state of a component adsorbed by a suction nozzle with a CCD (Charge Coupled Device) camera. The mainstream is that the Y-direction drive shaft supporting the X-direction drive shaft in the XY table is a single axis.

예컨대, 제1도에서 도시된 바와 같이, 본체(B)상에 부품을 공급하는 부품공급부(109)와 흡착노즐(151)로 흡착한 부품의 흡착상태를 인식하는 인식장치(161) 및 상기 흡착노즐(151)이 설치된 실장헤드(105)를 축지지하는 X방향 구동축(104)과, 이 X방향 구동축(104)과 직교 설치된 단일의 Y방향 구동축(102)의 X-Y테이블로 구성되어, 부품실장장치를 가동시킴에 따라 실장헤드(105)는 수치제어(Numerical control)된 X-Y테이블에 의해서 부품공급부(109)이상으로 이동하고, 공급된 부품을 흡착노즐(151)로 흡착한다.For example, as shown in FIG. 1, the component supply unit 109 for supplying a component on the body B and the recognition device 161 for recognizing the adsorption state of the component adsorbed by the adsorption nozzle 151 and the adsorption It consists of an XY table of the X direction drive shaft 104 which supports the mounting head 105 in which the nozzle 151 was provided, and the single Y direction drive shaft 102 provided orthogonal to this X direction drive shaft 104, and is mounted. As the apparatus is operated, the mounting head 105 is moved beyond the component supply unit 109 by the numerically controlled XY table, and the supplied component is sucked by the suction nozzle 151.

부품흡착부 실장헤드(105)는 부품인식장치(161)의 상부로 이동하여 일정 시간 정지하고 부품의 흡착상태가 부품인식장치(161)에 의해 인식되게 된다.The component adsorption part mounting head 105 moves to the upper portion of the component recognition device 161 and stops for a predetermined time, and the adsorption state of the component is recognized by the component recognition device 161.

이후, 상기 실장 헤드(105)는 기판의 소정위치에 부품인식결과에 의한 위치교정등의 보정을 행한 후 실장을 실시한다.Thereafter, the mounting head 105 performs mounting after correcting a position correction or the like based on the component recognition result at a predetermined position on the substrate.

그러나, 이같은 종래 전자부품 실장장치에 있어서의 실장헤드(105)는, 흡착노즐(151)에 의해 부품을 흡착한 후 부품인식장치(161) 상부로 이동하여 상기 부품인식장치(161)를 통해 인식정보를 읽어들일 때까지 정지해야만 함으로써 인식과 장착을 행할 때 인식장치 위로 이동하는 시간과 인식정보를 읽어들이는 시간이 실장시간의 손실로 되고, X방향 구동축(104)을 지지하는 Y방향 구동축(102)이 단일개로 일측에만 편심구성되어 있는 편향구조를 말미암아 결국 안정화시간(Settling Time)이 길어질 뿐만 아니라, 장착정도의 저하현상이 발생되는 등의 문제점이 내포되어 있다.However, the mounting head 105 in such a conventional electronic component mounting apparatus, after absorbing the component by the suction nozzle 151, is moved to the upper part recognition device 161 and recognized by the component recognition device 161. By stopping until information is read out, the time to move up the recognition apparatus and the time to read the recognition information during the recognition and mounting are lost in the mounting time, and the Y-direction drive shaft supporting the X-direction drive shaft 104 ( Due to the deflection structure in which 102 is eccentrically formed on only one side, the settling time is not only long but also a problem of deterioration of mounting accuracy is included.

본 고안은, 전술한 바와 같은 종래의 전자부품 실장장치에 있어서의 제반결점을 일소하여, 흡착부품의 인식 및 장착시간의 손실을 최소치로 줄이고 안정화시간(Settling Time) 또한 대폭단축 시킬 수 있는 신뢰성이 탁월한 전사부품 실장장치를 제공하고자 함에 그 목적이 있다.The present invention eliminates all the drawbacks of the conventional electronic component mounting apparatus as described above, thereby reducing the loss of recognition and mounting time of the adsorption components to a minimum value, and greatly reducing the stabilization time. The purpose is to provide an excellent transfer part mounting device.

이러한 목적을 달성하기 위한 본 고안의 특징적인 요소로서는, 흡착노즐이 부품을 흡착하여 기판위로 이송하는 사이에 인식장치가 부품의 흡착상태를 인식하도록 구성하고, 흡착노즐이 부품의 흡착 혹은 실장을 위해 하강할시에는 인식장치가 흡착노즐로부터 퇴피하도록 구성하는 한편, Y방향 구동축을 동기구동 수단화로 구성하여 안정화 시간(Settling Time)의 손실을 최소치로 줄일 수 있도록 한 것이다.As a characteristic element of the present invention for achieving the above object, the recognition device is configured to recognize the adsorption state of the part while the adsorption nozzle absorbs the part and transports it onto the substrate, and the adsorption nozzle is used for adsorption or mounting of the part. When descending, the recognition device is configured to withdraw from the adsorption nozzle, while the Y-direction drive shaft is configured as a synchronous drive means to reduce the loss of the settling time to a minimum value.

이하, 본 고안의 바람직한 실시예를 첨부도면에 의거 구체적을 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention in detail as follows.

첨부도면 제2도는 본 고안의 구성을 보인 발췌 사시도로서, 본체(A)의 X-Y테이블(1) 상부 양측에, 각각의 구동모터(21),(31)을 가지며 동기구동되는 나선형태의 Y방향 구동축(2),(3)이 설치되어 있고 이 Y방향 구동축(2),(3)에는 구동모터(41)를 가지는 나선형태의 X방향 구동축(4)이 직교되게 설치구성되어 있다.2 is a schematic perspective view showing the structure of the present invention, in which the axial direction Y of the helical shape which is synchronously driven with driving motors 21 and 31 on both sides of the XY table 1 of the main body A is shown. The drive shafts 2 and 3 are provided, and the Y-direction drive shafts 2 and 3 are formed so that the spiral X-direction drive shaft 4 having the drive motor 41 is orthogonal to each other.

상기, X방향 구동축(4)에는 흡착노즐(51)을 가지는 노즐헤드(5)와, 흡착노즐(51)에 흡착되는 부품의 흡착상태를 하방으로부터 촬영가능한 인식장치(61)가 설치된 부품 인식용 카메라헤드(6)가 구성되어 있다.In the X direction drive shaft 4, a nozzle head 5 having a suction nozzle 51 and a recognition device 61 capable of photographing a suction state of a component sucked by the suction nozzle 51 from below are provided. The camera head 6 is comprised.

도면중 미설명부호 7은 기판, 8은 기판(7)을 이송하기 위한 콘베어 장치, 9는 부품공급부, 10은 전자부품을 나타낸 것이다.In the drawings, reference numeral 7 denotes a substrate, 8 denotes a conveyor device for transferring the substrate 7, 9 denotes a component supply unit, and 10 denotes an electronic component.

이와같은 구성으로 된 본 고안이 작동됨에 있어서는, 머저, 도시하지 않은 부품공급장치에 의해 X-Y테이블(1)상의 부품공급부(9)에 전자부품(10)의 공급이 이루어지면, 제3도에서 도시된 바와 같이 흡착노즐(51)은 상승하고 인식장치(61)는 자체모터의 구동에 의해 상기 흡착노즐(51)로부터 퇴피하며 X-Y테이블(1)의 수치제어(Numerical Control)에 의해 부품공급부(9)를 향해 이동하게 된다.In the operation of the present invention having such a configuration, when the electronic component 10 is supplied to the component supply portion 9 on the XY table 1 by a component supply apparatus (not shown), the components shown in FIG. As shown, the suction nozzle 51 is raised, the recognition device 61 is evacuated from the suction nozzle 51 by the driving of its own motor, and the component supply unit 9 is controlled by numerical control of the XY table 1. Move toward).

이후, 상기 흡착노즐(51)은 하강하여 부품공급부(9)에 공급된 전자부품(10)을 흡착한다(제4도 참조).Thereafter, the suction nozzle 51 is lowered to suck the electronic component 10 supplied to the component supply unit 9 (see FIG. 4).

전자부품(10)의 흡착이 이루어지면 제5도에서와 같이 흡착노즐(51)은 상승하고 인식장치(61)는 인식가능한 위치 즉, 흡착노즐(51)하부로 X방향 구동축(4)상을 조금씩 이동한다.When the adsorption of the electronic component 10 is made, as shown in FIG. 5, the adsorption nozzle 51 is raised and the recognition device 61 moves on the X-direction drive shaft 4 below the recognizable position, that is, under the adsorption nozzle 51. Move little by little.

이때, 이동이 완료되어 이동속도가 제로(0)값을 갖는 상태에서 수치제어(Numerical Control)되는 X-Y테이블(1)은 기판(7)을 서서히 이동함은 물론이다(제6도 참조).At this time, the X-Y table 1 which is numerically controlled in the state where the movement is completed and the movement speed has a zero value gradually moves the substrate 7 (see FIG. 6).

이후, 상기의 X-Y테이블(1)의 이송중에 흡착노즐(51)에 흡착된 전자부품(10)의 인식장치(61)는 X방향 구동축(4)상의 흡착노즐(51)로부터 퇴피하고 흡착노즐(51)은 하강하여 부품(10)을 기판(7)상의 정해진 위치(장착위치)에 실장하게 되는바, 실장행정이 완료될 수 있으며, 최초의 상태 즉, 제3도에서와 같은 상태로 복귀되어 상술한 과정을 반복 실시하게 된다.Thereafter, the recognition device 61 of the electronic component 10 adsorbed to the suction nozzle 51 during the transfer of the XY table 1 retracts from the suction nozzle 51 on the X-direction drive shaft 4 and the suction nozzle ( 51 is lowered to mount the component 10 at a predetermined position (mounting position) on the substrate 7, and thus the mounting stroke can be completed and returned to the initial state, that is, as shown in FIG. The above-described process is repeated.

이상에서 상술한 바와 같이 본 고안 전자부품 실장장치에 의하면, 부품을 흡착노즐로 흡착하여 기판위로 이송하는 동안에 인식장치에 이해 부품의 흡착상태를 인식할 수 있도록 함으로써 부품의 장착(실장)시가 손실의 최소화 이점이 있으며, 노즐헤드와 카메라 헤드가 설치되어 있는 X방향 구동축을 지지하며 이 X방향 구동축과 직교되게 구성되는 동기 구동축화의 Y방향 구동축에 의해 X-Y테이블의 안정화 시간(Settlin time)을 줄일 수 있음으로써 장착시간 손실의 최소화 효과가 있음은 물론, 흡착노즐의 하강시에 인식장치가 흡착노즐로부터 퇴피됨으로써 부품흡착시 및 부품장착시에 인식장치는 전혀 간섭없이 정확히 제어됨으로써 장착 정도가 탁월히 보장될 수 있는 특단의 효과가 기대된다.As described above, according to the electronic device mounting apparatus of the present invention, it is possible to recognize the adsorption state of the component while the component is adsorbed by the adsorption nozzle and transported onto the substrate. There is a minimizing advantage, and the settling time of the XY table can be reduced by the Y-direction drive shaft of the synchronous drive shaft configured to support the X-direction drive shaft where the nozzle head and the camera head are installed and orthogonal to the X-direction drive shaft. As well as minimizing the loss of installation time, the recognition device is evacuated from the adsorption nozzle when the adsorption nozzle is lowered. An exceptional effect is expected.

Claims (1)

본체(A)의 X-Y테이블(1) 상부 양측에, 구동모터(21),(31)를 가지며 동기구동되는 나선형태의 Y방향 구동축(2),(3)을 설치하고, 이에, 흡착노즐(51)이 설치된 노즐헤드(5)와 상기 흡착노즐(51)에 흡착되는 부품의 흡착상태를 하방으로부터 촬영가능한 인식장치(61)가 설치된 부품인식용 카메라 헤드(6) 및 구동모터(41)를 가지는 X방향 구동축(4)을 직교되게 설치하여, 안정화시간(Settling Time)을 단축시킬 수 있도록 구성하여서 됨을 특징으로 하는 전자부품 실장장치.On both sides of the upper part of the XY table 1 of the main body A, helical Y-direction drive shafts 2 and 3 having drive motors 21 and 31 and synchronously driven are provided. The part recognition camera head 6 and the drive motor 41 provided with the nozzle head 5 provided with the 51 and the recognition device 61 capable of photographing the adsorption state of the parts adsorbed to the suction nozzle 51 from below. The branch is an electronic component mounting apparatus, characterized in that configured to be orthogonal to the X-direction drive shaft (4), to shorten the stabilization time (Settling Time).
KR2019930011956U 1993-06-30 1993-06-30 Apparatus for mounting electronic part KR0125333Y1 (en)

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