KR0117463Y1 - Ion implanter of wafer - Google Patents

Abstract

Disclosed is an ion implantation apparatus for a wafer of the present invention.

The ion implantation apparatus according to the present invention includes a main body fixedly installed at the outer periphery of the turntable, a probe pin corresponding to a groove formed on the outer circumferential surface of the esk horizontally extended from the main body to the disc, and air connected to the main body to inject air into the probe pin. It consists of a supply pipe, an air cylinder connected to the air supply pipe and fixed at the bottom of the turntable, and a holder pin part installed on the disc to interlock with the air cylinder, and the operation pins of the probe pin and the air cylinder are formed by the air injected through the air supply pipe. And a disk holder for operating the receiving and holder pin portions of the outer circumferential surface into the grooves to support the disk and to clamp and release the wafer.

Another condition of the ion implantation apparatus, the disk state sensing device, includes a light emitting part installed at a position corresponding to the opening formed in the disk on which the wafer is loaded and unloaded, and light emitted from the overheating part corresponding to the opening of the disk through the opening. It consists of an optical sensor consisting of a light receiving unit for receiving.

Description

Wafer ion implanter

1A is a side view showing a relation between a disk for a general ion implantation device and a disk holder.

FIG. 1B is a detailed sectional view of part A of FIG. 1A.

2 is a schematic configuration diagram of a disk state sensing device for a general ion implantation device.

Figure 3a is a block diagram of the disc holder used in the present invention.

3B is a detailed cross-sectional view of portion B of FIG. 3A.

4 is a configuration diagram of a state after the operation of the disc holder.

5 is a schematic configuration diagram of a disk state sensing apparatus according to the present invention.

* Description of Symbols on Major Parts of Drawings *

30; disk 40; disk holder

42; probe pin 43; air supply line

46; holder pin 50; disk state sensing device

The present invention relates to an ion implantation apparatus of a wafer, and more particularly, to an ion implantation apparatus capable of performing accurate clamping of a wafer and sensing of a disk.

Among semiconductor manufacturing equipment, an ion implanter for implanting ions onto a wafer is provided with a wafer transfer system for transferring wafers.

The wafer transfer system includes a disk for carrying out an ion implantation process with the wafer seated thereon, and includes a transfer section for loading and unloading the wafer. In addition, a disk state sensing device that detects the exact position of the disk (the accurate loading and unloading of the wafer to be transported only when the disk is correctly positioned at the initial setting position), the support of the disk seated on the turntable, and the wafer located on the disk A disk holder for clamping of the disk is installed.

The above-described configuration, function, and problems of the disk holder and the disk state sensing device will be described separately for convenience.

Disc holder

FIG. 1A is a side view showing a relation between a disk for a general ion implantation device and a disk holder. FIG. 1A shows that the disk holder 10 is configured at one place for convenience. However, the wafer 1 is loaded and unloaded. Eight disk holders 10 are provided on the outer circumference of the circular turntable 2 where loading is performed. Each disk holder 10 corresponds to an outer circumferential surface of the disk 1 placed on the turntable 2, respectively.

The disc holder 10 includes a main body 11 fixedly installed on an outer periphery of the turntable 2, a probe pin 12 extending horizontally from the main body 11 toward the disc 1, and air connected to the main body 11. It consists of a supply pipe 13 and the holder pin part 14 provided on the disk 1.

The probe pin 12 is configured in the form of an air cylinder capable of horizontal transfer, and the probe pin 12 is horizontally moved toward the disk 1 by the air supplied through the air supply pipe 13. The outer circumferential surface of the disk 1 corresponding to the probe pin 12 is formed with a groove 1A for accommodating the end of the probe pin 12, and a holder pin portion 14 is formed at the edge of the groove 1A. In addition, a pad (P) for fixing the wafer is fixedly installed on the upper surface of the disk 1 corresponding to the holder pin 14.

FIG. 1B is a detailed view of the portion A of FIG. 1A, wherein the holder pin portion 14 is fixed to the surface of the disk 1 and has a hollow casing 14A of elastic material having a shape that is bent downward toward the disk surface, and the casing 14A. ) And a spring 14C located on the outer circumferential surface of the pin 14B and the pin 14B accommodated therein, and the disk 1 corresponding to the casing 14A is composed of a through hole 1C and a pin 14B. A portion of the spring 14C is received. (A predetermined jaw portion 1B is formed on the upper inner circumferential surface of the through hole 1C, and a horizontally extended protrusion 14B 'is formed on the lower outer circumferential surface of the pin 14B, respectively, and is provided at the through hole 1C of the spring 14C. Prevents deviations.)

The operation and function of the disc holder 10 configured as described above will be briefly described with reference to the drawings. In order to load or unload the wafer onto the pad P installed on the upper surface, the disc holder 10 is provided. As soon as it is seated on the turntable 2 so as to correspond to the lower end, the lower end of the pin 14B of the holder skin 14 exposed to the bottom of the disk 1 is brought into contact with the turntable 1 and upwardly moved. As the pin 14B rises, the spring 14C accommodated in the through hole 1C of the disk 1 is compressed by the protrusion 14B 'and the jaw portion 1B, while the pin 14B is bent in a curved shape. 14A, the end of the casing 14A, which has been upwardly moved and the casing 14A is upwardly moved, and thus pressurizes the wafer surface, is released from the wafer. Load onto the phase.

On the other hand, the air introduced through the air supply pipe 13 is introduced into the probe pin 12, so that the probe pin 12 is transferred toward the disk 1 so that the end of the probe pin 12 is the outer peripheral surface of the disk 1 It is accommodated in the groove (1A) configured in the to fix the disk (1).

Thus, the disk 1 performs unloading of the wafer and loading of a new wafer onto the disk 1 in a state of being fixed by the probe pin 12.

When the disk 1 is detached from the turntable 2 to process the new wafer, the restoring force acting on the spring 14C of the disk holder 10 causes the pin 14B to return to its initial position and at the same time the elastic force. The casing 14A having the curved portion is curved toward the wafer to pressurize the surface of the wafer, thereby preventing the flow of the wafer.

Problems occurring in the disc holder 10 having the above configuration and function is as follows.

First, the operation of each holder pin portion 14 provided in the eight disc holders 10 is performed simultaneously at the moment when the disk 1 is seated on the turntable 2, and thus, at the portion where the wafer is not seated. The holder pin 14 is also operated.

Second, when each disk holder 10 installed on the outer circumferential surface of the disk 1 having a relatively large area, it is impossible for the operator to check whether the holder pin 14 is operated, that is, clamping of each wafer and fixing of the disk. ,

Third, since each holder pin portion 14 is operated by the contact of the turntable 2 and the disk 1, the casing of the holder pin portion 14 when the flat state of the disk 1 and the turntable 2 does not match. 14A) It is difficult to unload the wafer and load the new wafer because the end does not deviate from the surface of the wafer.

Fourth, the clamping of the wafer is released by the operation of the holder pin in the case where the disk and the tentable are in contact. Flow may occur and, in severe cases, may also be dislodged on the pads.

Disk status sensor

The disk state sensing device 20 is used to detect the position of the disk 1 seated on the turntable 2 by the disk holder 10 described above.

FIG. 2 is a schematic block diagram showing the structure of a general disk and a sensing unit, and includes an optical sensor 21 having an light emitting unit 22 and a light receiving unit 23 under the disk 1 on which a wafer is loaded and unloaded. A sensor is provided, and the optical sensor 21 is connected to a CPU (not shown) through an electrical circuit. On the bottom of the disk 1 corresponding to the optical sensor 21 is formed a slot (1D: Slot) formed in a groove shape (in FIG. 1, only one slot and a pair of optical sensors corresponding to the bottom of the disk are formed. Although shown, there are eight slots formed on the bottom of the disk-shaped disk provided in the actual equipment, and the optical sensor is installed at the loading and unloading positions of the wafer respectively).

The optical sensor 21 detects whether the disk 1 is correctly seated at a set position on the turntable before loading or unloading the wafer onto the disk 1 thus configured. In other words, due to the operation of a disk turntable (not shown) for loading or unloading a wafer, the disk 1 is sensed after being moved to a setting position for wafer unloading or another wafer loading. .

When the disk 1 moves to the set position, any one slot 1D of the disk 1 corresponds to the lower optical sensor 21, and the light irradiated from the light emitting part 22 of the optical sensor 21 is slotted. Reflected from the configuration surface of 1D, the amount of reflected light is sensed through the light-receiving unit 23, and the detection signal is transmitted to the CPU. Upon receiving this detection signal, the CPU reads the position state of the slot 1D in comparison with the value of the amount of light reflected from the slot 1D of the disk 1 (this value is a set value input to the CPU).

If the position of the slot is read through the detection signal of the optical sensor, that is, the measured value of the amount of light reflected from the slot and the input value input to the CPU are different, it means that the disk is not positioned correctly at the set position. .

However, when the inside of the slot formed in the lower part of the disk is contaminated by foreign matters, or the disk is not kept flat on the turntable and the position of each slot is misaligned, it is impossible to obtain the correct light amount detection signal of the optical sensor. As a result, it is impossible to verify that the disk is positioned correctly, and if the disk is not misplaced, it is impossible to expect accurate loading and unloading of the wafer.

The present invention is to solve the above-mentioned problems in the disk holder and the disk state sensing device provided in the wafer ion implantation device, which is operated individually and at the same time firmly clamping the wafer using air pressure, and accurately the state of the disk The purpose is to provide an ion implantation apparatus that can be detected.

The disk holder of the ion implantation apparatus according to the present invention for achieving the above object is a probe pin that is vertically fixed to the outer peripheral portion of the turntable, the horizontally extending from the main body toward the disk and a probe pin corresponding to the groove formed on the outer peripheral surface of the disk An air supply pipe connected to inject air to the probe pins, an air cylinder connected to the air supply pipe and fixed to the bottom of the turntable, and a holder pin part installed on the disc to interlock with the air cylinder, Probe pin and the operating rod of the air cylinder is characterized in that configured to perform the support of the disk and the clamping and release of the wafer by operating the receiving and holder pin portion into the groove of the outer peripheral surface of the disk.

In addition, the disk state detection device of the ion implantation apparatus according to the present invention is a light emitting unit installed in a position corresponding to the opening formed in the disk, the wafer is loaded and unloaded, and the light corresponding to the opening of the disk and irradiated from the light emitting And an optical sensor comprising a light receiving portion for receiving light through an opening of the disk.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. For convenience, the disk holder and the disk state sensing apparatus will be described separately.

Disc holder

Figure 3a is a block diagram showing the relationship between the disk and the disk holder for the ion implantation apparatus according to the present invention, Figure 3a shows that the disk holder 40 is configured in one place for convenience, the outer peripheral portion of the circular turntable (2A) Eight disc holders 40 are provided in the respective disc holders 40 respectively corresponding to the outer circumferential surface of the disc 30 placed on the turntable 2A. (Hereinafter, only one set of disk holders will be described as an example.)

The disc holder 40 is connected to the main body 41 fixedly installed on the outer periphery of the turntable 2A, the probe pin 42 extending horizontally from the main body 41 toward the disc 30, and the main body 41. It is composed of an air cylinder 44 connected to the air supply pipe 43 and the air supply pipe 43 and fixed to the lower end of the outer periphery of the turntable 2A, and a holder pin 46 provided on the disc 30.

The probe pin 42 is configured in the form of an air cylinder capable of horizontal transfer, and the actuating rod 45 of the probe pin 42 and the air cylinder 44 is formed by the air introduced through the air supply pipe 43. Transfer toward 30 is made.

The outer circumferential surface of the disk 30 corresponding to the probe pin 42 is formed with a groove 30A for accommodating the end of the probe pin 42, and the turntable corresponding to the operation rod 45 of the air cylinder 44 By removing a portion of the outer peripheral portion of 2A), the operating rod 44 of the air cylinder 44 and the holder pin portion 46 formed on the disk 30 correspond to each other. (A pad for fixing the wafer is fixedly installed on the upper surface of the disk corresponding to the holder pin as shown in FIG. 1A.)

FIG. 3b is a detailed view of FIG. 3a and B. When the holder pin 46 used in the present invention is also made of an elastic material, it is fixed to the surface of the disk 30 and hollow casing downwardly curved toward the surface of the disk 30. 46A) and the pin 46B housed in the casing 46A and the spring 46C located on the outer circumferential surface of the pin 46B, the through hole 30C is provided in the disk 30 corresponding to the casing 46A. Is configured to pass through the pin 46B and to accommodate the spring 46C. (A predetermined jaw portion 30B is formed on the upper inner circumferential surface of the through hole 30C, and a horizontally extending projection 46B 'is formed on the lower outer circumferential surface of the pin 46B, respectively, at the through hole 30C of the spring 46C. Prevents deviations.)

The lower end of the pin 46B corresponds to the actuating rod 45 of the air cylinder 44.

Referring to the operation and function of the disk holder 40 configured as described above with reference to FIGS. 3B and 4, FIG. 4 shows that after the disk holder 40 is operated, that is, the desk 30 is placed on the turntable 2A. A front view of a state seated in the holder, the holder exposed to the bottom surface of the disk 30 when the disk 30 is seated on the turntable 2A to correspond to the disk holder 40 for unloading the wafer and loading a new wafer. The lower end of the pin 46B of the pin portion 46 corresponds to the actuating rod 45 of the air cylinder 44, and the groove 30A formed on the outer circumferential surface of the disk 30 corresponds to the probe pin 42.

When air is injected through the air supply pipe 43, the probe pin 42 and the actuating rod 45 of the air cylinder 44 simultaneously move horizontally and vertically toward the disk 30, and thus the probe pin 41 ) Is accommodated in the groove (30A) of the outer peripheral surface of the disk 30 to fix the disk 30, the operating rod 45 of the air cylinder 44 to convey the pin 46B of the holder pin portion 46 upwards .

As the pin 46B rises, the spring 46C accommodated in the through hole 30C of the disc 30 is compressed by the protrusion 46B 'and the jaw 30B, while the pin 46B is curved. The end of the casing 46A, which was conveyed along the casing 46A and simultaneously conveyed the casing 46A upward and pressurized the wafer surface, is separated from the wafer, and then the unloading of the wafer and the new wafer are removed from the disk 30. It is loaded on the pad (P).

Meanwhile, an end portion of the probe pin 42 into which air is introduced through the air supply pipe 43 is transferred toward the disk 30, and an end portion of the pin 46B is formed in the groove 30A formed on the outer circumferential surface of the disk 30. Is received to fix the disk 30.

Therefore, while the disk 30 is fixed by the probe pin 42, the wafer is stably unloaded onto the disk 30 and the new wafer is loaded at the same time.

When the disk 30 is separated from the turntable 2A to process the new wafer loaded on the disk 30, the injection of air through the air supply pipe 43 is blocked, and in this case, the probe pin 42 And the operating rod 45 of the air cylinder 44 is returned to the initial position, and thus the pin 46B of the holder pin portion 46 returns to the initial position and elastic force at the same time due to the restoring force acting on the spring 46C. The casing 46A having a pressure suppresses the flow of the wafer by pressing the surface of the wafer so that the wafer is not separated or dropped during the movement of the disk 30. (Eight disk holders having the above-described configuration and functions are provided on the outer circumference of the circular turntable where wafers are loaded and unloaded from the disks.)

Such a disc holder controls each air supply pipe to individually operate the probe pins for supporting the discs and the holder pins for clamping and releasing the way so that each member, in particular, the holder pins can be accurately executed. Excellent effect can be expected in securing reliability and preventing wafer damage.

Disk status sensor

Referring to FIG. 5, the disk state detecting device 50 for detecting the position of the disk 30 seated on the turntable 2A by the disk holder 40 described above will be described.

5 is a schematic block diagram showing the configuration of the disk state detection apparatus 50 according to the present invention, the light emitting portion 52 of the optical sensor 51 on the top of the disk 10, the wafer is loaded and unloaded Position the light receiving unit 53 at the bottom thereof. (The light receiving portion 53 and the light emitting portion 52 are connected to C.P.U. through an electrical circuit.)

An opening 30D through which the light irradiated from the light emitting portion 52 can pass is formed in the light receiving portion 53 of the optical sensor 51 and the outer peripheral portion of the disk 30 corresponding to the light emitting portion 52. (In Fig. 5, only one opening is shown on the disk and a pair of optical sensors corresponding thereto, but the disk-shaped disk of the actual equipment has eight openings, and the optical sensors are installed at the loading positions of the wafer, respectively. To detect the exact position of the disk.)

Before loading or unloading the wafer onto the disk 30 configured as described above, it is possible to detect whether the disk 30 is accurately positioned at a predetermined position on the turntable (not shown in FIG. 5) through the optical sensor 51. have.

That is, the disk 30 rotated according to the operation of the turntable for loading or unloading the wafer is sensed after moving to the set position for wafer unloading or loading of another wafer.

When the disk 30 moves to the set position, the light receiving unit 53 and the light emitting unit 52 of the optical sensor 51 correspond to the opening 30D formed in the disk 30, and the light irradiated from the light emitting unit 52 When received by the light receiving portion 53 through the opening 30D, the light receiving signal is transmitted to the CPU.

The CPU, which receives each sensing signal transmitted from each optical sensor 51, compares all the sensing signals with the input values, and determines that the seating state of the disk 30 is good if all the sensing signals match the input values. It is done.

Such a disk state detection device 50 can improve the accuracy of the detected signal compared to detecting the signal through the amount of light reflected on the slot surface formed on the bottom surface of the disk, thereby doubling the reliability of the determined state of the disk. By preventing the unstable state of the disk, it is possible to prevent damage to the wafer.

Claims (2)

In the ion implantation apparatus of a wafer having a disk loaded with a wafer, a disk holder for supporting the disk and a clamping function of the wafer and a plurality of sensing devices for detecting a disk state, The disc holder A main body fixed perpendicularly to the outer periphery of the turntable, A probe pin extending horizontally from the main body toward a disk and corresponding to a groove formed on an outer circumferential surface of the disk; An air supply pipe connected to the main body for injecting air into the probe pin; An air cylinder connected to the air supply pipe and fixed to the lower end of the turntable; A holder pin portion installed on the disk and interlocked with the air cylinder to accommodate the probe pin and the operating rod of the air cylinder into the groove of the outer circumferential surface of the disk by the air injected through the air supply pipe, and the holder pin portion. And an ion implantation apparatus for operating the disk, and clamping and releasing the wafer. The method of claim 1, The disk state sensing device may include a light emitting part installed at a position corresponding to an opening formed in a disk on which a wafer is loaded and unloaded; And an optical sensor corresponding to an opening of the disk, the optical sensor comprising a light receiving unit for receiving the light emitted from the light emitting unit through the opening.