JPWO2025191767A1 - - Google Patents
Info
- Publication number
- JPWO2025191767A1 JPWO2025191767A1 JP2025518326A JP2025518326A JPWO2025191767A1 JP WO2025191767 A1 JPWO2025191767 A1 JP WO2025191767A1 JP 2025518326 A JP2025518326 A JP 2025518326A JP 2025518326 A JP2025518326 A JP 2025518326A JP WO2025191767 A1 JPWO2025191767 A1 JP WO2025191767A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2024/009922 WO2025191767A1 (ja) | 2024-03-14 | 2024-03-14 | 接合基板、接合基板の製造方法、及び、半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7728488B1 JP7728488B1 (ja) | 2025-08-22 |
| JPWO2025191767A1 true JPWO2025191767A1 (https=) | 2025-09-18 |
| JPWO2025191767A5 JPWO2025191767A5 (https=) | 2026-02-18 |
Family
ID=96775422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025518326A Active JP7728488B1 (ja) | 2024-03-14 | 2024-03-14 | 接合基板、接合基板の製造方法、及び、半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7728488B1 (https=) |
| WO (1) | WO2025191767A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05304062A (ja) * | 1992-04-27 | 1993-11-16 | Rohm Co Ltd | 接合ウェーハ及びその製造方法 |
| JP5803979B2 (ja) * | 2013-05-29 | 2015-11-04 | 住友電気工業株式会社 | 炭化珪素基板および炭化珪素半導体装置ならびに炭化珪素基板および炭化珪素半導体装置の製造方法 |
| WO2018055838A1 (ja) * | 2016-09-23 | 2018-03-29 | 株式会社テンシックス | 半導体素子の製造方法及び半導体基板 |
-
2024
- 2024-03-14 JP JP2025518326A patent/JP7728488B1/ja active Active
- 2024-03-14 WO PCT/JP2024/009922 patent/WO2025191767A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7728488B1 (ja) | 2025-08-22 |
| WO2025191767A1 (ja) | 2025-09-18 |
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