JPWO2024262630A5 - - Google Patents

Info

Publication number
JPWO2024262630A5
JPWO2024262630A5 JP2025528152A JP2025528152A JPWO2024262630A5 JP WO2024262630 A5 JPWO2024262630 A5 JP WO2024262630A5 JP 2025528152 A JP2025528152 A JP 2025528152A JP 2025528152 A JP2025528152 A JP 2025528152A JP WO2024262630 A5 JPWO2024262630 A5 JP WO2024262630A5
Authority
JP
Japan
Prior art keywords
insulating layer
wiring board
photoelectric composite
layer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025528152A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024262630A1 (https=
Filing date
Publication date
Priority claimed from PCT/JP2023/023427 external-priority patent/WO2024262042A1/ja
Application filed filed Critical
Publication of JPWO2024262630A1 publication Critical patent/JPWO2024262630A1/ja
Publication of JPWO2024262630A5 publication Critical patent/JPWO2024262630A5/ja
Pending legal-status Critical Current

Links

JP2025528152A 2023-06-23 2024-06-21 Pending JPWO2024262630A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2023/023427 WO2024262042A1 (ja) 2023-06-23 2023-06-23 光電複合配線板の製造方法、光電複合配線板、半導体パッケージ及び積層フィルム
PCT/JP2024/022680 WO2024262630A1 (ja) 2023-06-23 2024-06-21 光電複合配線板の製造方法、光電複合配線板及び半導体パッケージ

Publications (2)

Publication Number Publication Date
JPWO2024262630A1 JPWO2024262630A1 (https=) 2024-12-26
JPWO2024262630A5 true JPWO2024262630A5 (https=) 2026-04-13

Family

ID=93935243

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2025528151A Pending JPWO2024262629A1 (https=) 2023-06-23 2024-06-21
JP2025528152A Pending JPWO2024262630A1 (https=) 2023-06-23 2024-06-21

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2025528151A Pending JPWO2024262629A1 (https=) 2023-06-23 2024-06-21

Country Status (5)

Country Link
JP (2) JPWO2024262629A1 (https=)
KR (2) KR20260023060A (https=)
CN (2) CN121399513A (https=)
TW (2) TW202505236A (https=)
WO (3) WO2024262042A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3911553B2 (ja) * 1998-03-10 2007-05-09 独立行政法人産業技術総合研究所 有機高分子成形体、及びその製造方法
JP4374648B2 (ja) * 1999-04-13 2009-12-02 凸版印刷株式会社 光・電気配線基板及び製造方法並びに実装基板
JP2002148187A (ja) * 2000-11-08 2002-05-22 Nippon Telegr & Teleph Corp <Ntt> 光導波路型ｓｐｒ現象計測チップ、その製造方法およびｓｐｒ現象計測方法
JP2003050329A (ja) * 2001-08-06 2003-02-21 Toppan Printing Co Ltd 光・電気配線基板及びその製造方法並びに実装基板
JP2007041122A (ja) * 2005-08-01 2007-02-15 Hitachi Cable Ltd ポリマ光導波路の製造方法及びポリマ光導波路、並びにそれを用いた光モジュール
WO2007114316A1 (ja) * 2006-03-30 2007-10-11 Kyocera Corporation 光伝送基板およびその製造方法並びに光電子混載基板
JP5155596B2 (ja) * 2007-05-14 2013-03-06 新光電気工業株式会社 光電気混載基板の製造方法
US7729570B2 (en) * 2007-05-18 2010-06-01 Ibiden Co., Ltd. Photoelectric circuit board and device for optical communication
JP5395734B2 (ja) * 2010-05-07 2014-01-22 新光電気工業株式会社 光電気複合基板の製造方法
JP5367635B2 (ja) * 2010-05-07 2013-12-11 日本特殊陶業株式会社 光導波路付き配線基板の製造方法
JP2015114390A (ja) * 2013-12-09 2015-06-22 住友ベークライト株式会社 接着シート、接着シート付き光導波路、光電気混載基板、光電気混載基板の製造方法、光モジュールおよび電子機器
US11076491B2 (en) * 2019-10-16 2021-07-27 Compass Technology Company Limited Integrated electro-optical flexible circuit board
JP7555204B2 (ja) * 2020-06-22 2024-09-24 東ソー株式会社 重合性化合物、重合体、光学薄膜

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