CN121399513A - 光电复合布线板的制造方法、光电复合布线板及半导体封装 - Google Patents

光电复合布线板的制造方法、光电复合布线板及半导体封装

Info

Publication number
CN121399513A
CN121399513A CN202480036125.1A CN202480036125A CN121399513A CN 121399513 A CN121399513 A CN 121399513A CN 202480036125 A CN202480036125 A CN 202480036125A CN 121399513 A CN121399513 A CN 121399513A
Authority
CN
China
Prior art keywords
layer
wiring board
insulating layer
manufacturing
composite wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480036125.1A
Other languages
English (en)
Chinese (zh)
Inventor
吉田雄麻
柴田智章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN121399513A publication Critical patent/CN121399513A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CN202480036125.1A 2023-06-23 2024-06-21 光电复合布线板的制造方法、光电复合布线板及半导体封装 Pending CN121399513A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2023/023427 WO2024262042A1 (ja) 2023-06-23 2023-06-23 光電複合配線板の製造方法、光電複合配線板、半導体パッケージ及び積層フィルム
JPPCT/JP2023/023427 2023-06-23
PCT/JP2024/022680 WO2024262630A1 (ja) 2023-06-23 2024-06-21 光電複合配線板の製造方法、光電複合配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
CN121399513A true CN121399513A (zh) 2026-01-23

Family

ID=93935243

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202480036125.1A Pending CN121399513A (zh) 2023-06-23 2024-06-21 光电复合布线板的制造方法、光电复合布线板及半导体封装
CN202480036161.8A Pending CN121219618A (zh) 2023-06-23 2024-06-21 光电复合布线板的制造方法、光电复合布线板以及半导体封装

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202480036161.8A Pending CN121219618A (zh) 2023-06-23 2024-06-21 光电复合布线板的制造方法、光电复合布线板以及半导体封装

Country Status (5)

Country Link
JP (2) JPWO2024262629A1 (https=)
KR (2) KR20260023060A (https=)
CN (2) CN121399513A (https=)
TW (2) TW202505236A (https=)
WO (3) WO2024262042A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3911553B2 (ja) * 1998-03-10 2007-05-09 独立行政法人産業技術総合研究所 有機高分子成形体、及びその製造方法
JP4374648B2 (ja) * 1999-04-13 2009-12-02 凸版印刷株式会社 光・電気配線基板及び製造方法並びに実装基板
JP2002148187A (ja) * 2000-11-08 2002-05-22 Nippon Telegr & Teleph Corp <Ntt> 光導波路型ｓｐｒ現象計測チップ、その製造方法およびｓｐｒ現象計測方法
JP2003050329A (ja) * 2001-08-06 2003-02-21 Toppan Printing Co Ltd 光・電気配線基板及びその製造方法並びに実装基板
JP2007041122A (ja) * 2005-08-01 2007-02-15 Hitachi Cable Ltd ポリマ光導波路の製造方法及びポリマ光導波路、並びにそれを用いた光モジュール
WO2007114316A1 (ja) * 2006-03-30 2007-10-11 Kyocera Corporation 光伝送基板およびその製造方法並びに光電子混載基板
JP5155596B2 (ja) * 2007-05-14 2013-03-06 新光電気工業株式会社 光電気混載基板の製造方法
US7729570B2 (en) * 2007-05-18 2010-06-01 Ibiden Co., Ltd. Photoelectric circuit board and device for optical communication
JP5395734B2 (ja) * 2010-05-07 2014-01-22 新光電気工業株式会社 光電気複合基板の製造方法
JP5367635B2 (ja) * 2010-05-07 2013-12-11 日本特殊陶業株式会社 光導波路付き配線基板の製造方法
JP2015114390A (ja) * 2013-12-09 2015-06-22 住友ベークライト株式会社 接着シート、接着シート付き光導波路、光電気混載基板、光電気混載基板の製造方法、光モジュールおよび電子機器
US11076491B2 (en) * 2019-10-16 2021-07-27 Compass Technology Company Limited Integrated electro-optical flexible circuit board
JP7555204B2 (ja) * 2020-06-22 2024-09-24 東ソー株式会社 重合性化合物、重合体、光学薄膜

Also Published As

Publication number Publication date
TW202505236A (zh) 2025-02-01
KR20260021793A (ko) 2026-02-13
KR20260023060A (ko) 2026-02-20
JPWO2024262629A1 (https=) 2024-12-26
WO2024262630A1 (ja) 2024-12-26
WO2024262629A1 (ja) 2024-12-26
TW202507353A (zh) 2025-02-16
CN121219618A (zh) 2025-12-26
JPWO2024262630A1 (https=) 2024-12-26
WO2024262042A1 (ja) 2024-12-26

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