JPWO2024247263A1 - - Google Patents
Info
- Publication number
- JPWO2024247263A1 JPWO2024247263A1 JP2025523203A JP2025523203A JPWO2024247263A1 JP WO2024247263 A1 JPWO2024247263 A1 JP WO2024247263A1 JP 2025523203 A JP2025523203 A JP 2025523203A JP 2025523203 A JP2025523203 A JP 2025523203A JP WO2024247263 A1 JPWO2024247263 A1 JP WO2024247263A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/020688 WO2024247263A1 (ja) | 2023-06-02 | 2023-06-02 | 基板収納容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024247263A1 true JPWO2024247263A1 (https=) | 2024-12-05 |
| JPWO2024247263A5 JPWO2024247263A5 (https=) | 2026-03-27 |
Family
ID=93657524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025523203A Pending JPWO2024247263A1 (https=) | 2023-06-02 | 2023-06-02 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024247263A1 (https=) |
| KR (1) | KR20260018834A (https=) |
| CN (1) | CN121002638A (https=) |
| TW (1) | TW202448779A (https=) |
| WO (1) | WO2024247263A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5361805B2 (ja) * | 2010-06-15 | 2013-12-04 | 信越ポリマー株式会社 | 基板収納容器 |
| KR102098790B1 (ko) * | 2013-06-19 | 2020-04-08 | 미라이얼 가부시키가이샤 | 기판수납용기 |
| CN116888721A (zh) * | 2021-03-29 | 2023-10-13 | 未来儿股份有限公司 | 基板收纳容器 |
-
2023
- 2023-06-02 KR KR1020257040056A patent/KR20260018834A/ko active Pending
- 2023-06-02 WO PCT/JP2023/020688 patent/WO2024247263A1/ja not_active Ceased
- 2023-06-02 JP JP2025523203A patent/JPWO2024247263A1/ja active Pending
- 2023-06-02 CN CN202380097566.8A patent/CN121002638A/zh active Pending
-
2024
- 2024-05-24 TW TW113119219A patent/TW202448779A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20260018834A (ko) | 2026-02-09 |
| TW202448779A (zh) | 2024-12-16 |
| WO2024247263A1 (ja) | 2024-12-05 |
| CN121002638A (zh) | 2025-11-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251202 |