CN121002638A - 基板收纳容器 - Google Patents

基板收纳容器

Info

Publication number
CN121002638A
CN121002638A CN202380097566.8A CN202380097566A CN121002638A CN 121002638 A CN121002638 A CN 121002638A CN 202380097566 A CN202380097566 A CN 202380097566A CN 121002638 A CN121002638 A CN 121002638A
Authority
CN
China
Prior art keywords
positioning
substrate support
positioning portion
wall
container body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380097566.8A
Other languages
English (en)
Chinese (zh)
Inventor
久保田幸二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miraial Co Ltd
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Publication of CN121002638A publication Critical patent/CN121002638A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202380097566.8A 2023-06-02 2023-06-02 基板收纳容器 Pending CN121002638A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/020688 WO2024247263A1 (ja) 2023-06-02 2023-06-02 基板収納容器

Publications (1)

Publication Number Publication Date
CN121002638A true CN121002638A (zh) 2025-11-21

Family

ID=93657524

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380097566.8A Pending CN121002638A (zh) 2023-06-02 2023-06-02 基板收纳容器

Country Status (5)

Country Link
JP (1) JPWO2024247263A1 (https=)
KR (1) KR20260018834A (https=)
CN (1) CN121002638A (https=)
TW (1) TW202448779A (https=)
WO (1) WO2024247263A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5361805B2 (ja) * 2010-06-15 2013-12-04 信越ポリマー株式会社 基板収納容器
JP6162803B2 (ja) * 2013-06-19 2017-07-12 ミライアル株式会社 基板収納容器
US12424472B2 (en) * 2021-03-29 2025-09-23 Miraial Co., Ltd. Substrate storing container

Also Published As

Publication number Publication date
WO2024247263A1 (ja) 2024-12-05
KR20260018834A (ko) 2026-02-09
TW202448779A (zh) 2024-12-16
JPWO2024247263A1 (https=) 2024-12-05

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Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination