JPWO2024247025A1 - - Google Patents
Info
- Publication number
- JPWO2024247025A1 JPWO2024247025A1 JP2023556766A JP2023556766A JPWO2024247025A1 JP WO2024247025 A1 JPWO2024247025 A1 JP WO2024247025A1 JP 2023556766 A JP2023556766 A JP 2023556766A JP 2023556766 A JP2023556766 A JP 2023556766A JP WO2024247025 A1 JPWO2024247025 A1 JP WO2024247025A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/019866 WO2024247025A1 (ja) | 2023-05-29 | 2023-05-29 | 半導体装置および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7378693B1 JP7378693B1 (ja) | 2023-11-13 |
| JPWO2024247025A1 true JPWO2024247025A1 (https=) | 2024-12-05 |
| JPWO2024247025A5 JPWO2024247025A5 (https=) | 2025-05-13 |
Family
ID=88729163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023556766A Active JP7378693B1 (ja) | 2023-05-29 | 2023-05-29 | 半導体装置および半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7378693B1 (https=) |
| CN (1) | CN121219834A (https=) |
| WO (1) | WO2024247025A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025109755A1 (ja) * | 2023-11-24 | 2025-05-30 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| CN121076034B (zh) * | 2025-11-04 | 2026-03-10 | 深圳市联合蓝海应用材料科技股份有限公司 | 一种化合物半导体背孔器件及其制备方法和晶体管 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02214127A (ja) * | 1989-02-15 | 1990-08-27 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2803408B2 (ja) * | 1991-10-03 | 1998-09-24 | 三菱電機株式会社 | 半導体装置 |
| TWI504780B (zh) * | 2009-09-04 | 2015-10-21 | 穩懋半導體股份有限公司 | 一種利用無電解電鍍法將金屬種子層鍍在半導體晶片的背面及導孔的製程方法 |
| JP5725073B2 (ja) * | 2012-10-30 | 2015-05-27 | 三菱電機株式会社 | 半導体素子の製造方法、半導体素子 |
| JP2022070436A (ja) * | 2020-10-27 | 2022-05-13 | 富士通株式会社 | 半導体装置及びその製造方法 |
-
2023
- 2023-05-29 JP JP2023556766A patent/JP7378693B1/ja active Active
- 2023-05-29 WO PCT/JP2023/019866 patent/WO2024247025A1/ja not_active Ceased
- 2023-05-29 CN CN202380098296.2A patent/CN121219834A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN121219834A (zh) | 2025-12-26 |
| JP7378693B1 (ja) | 2023-11-13 |
| WO2024247025A1 (ja) | 2024-12-05 |
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