JPWO2024135082A1 - - Google Patents

Info

Publication number
JPWO2024135082A1
JPWO2024135082A1 JP2023566497A JP2023566497A JPWO2024135082A1 JP WO2024135082 A1 JPWO2024135082 A1 JP WO2024135082A1 JP 2023566497 A JP2023566497 A JP 2023566497A JP 2023566497 A JP2023566497 A JP 2023566497A JP WO2024135082 A1 JPWO2024135082 A1 JP WO2024135082A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023566497A
Other languages
Japanese (ja)
Other versions
JPWO2024135082A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024135082A1 publication Critical patent/JPWO2024135082A1/ja
Publication of JPWO2024135082A5 publication Critical patent/JPWO2024135082A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
JP2023566497A 2022-12-20 2023-10-25 Pending JPWO2024135082A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022202949 2022-12-20
PCT/JP2023/038439 WO2024135082A1 (ja) 2022-12-20 2023-10-25 配線基板、遮光層形成用ポジ型感光性樹脂組成物、遮光層転写フィルムおよび配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024135082A1 true JPWO2024135082A1 (https=) 2024-06-27
JPWO2024135082A5 JPWO2024135082A5 (https=) 2026-01-07

Family

ID=91588557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566497A Pending JPWO2024135082A1 (https=) 2022-12-20 2023-10-25

Country Status (3)

Country Link
JP (1) JPWO2024135082A1 (https=)
CN (1) CN119895367A (https=)
WO (1) WO2024135082A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014197183A (ja) * 2013-03-06 2014-10-16 日東電工株式会社 画像表示装置
JP2015184958A (ja) * 2014-03-25 2015-10-22 富士フイルム株式会社 タッチパネルモジュールおよび電子機器
JP2017202631A (ja) * 2016-05-12 2017-11-16 東レ株式会社 転写フィルム、積層基材、カバーガラス、積層基材の製造方法
WO2020040054A1 (ja) * 2018-08-23 2020-02-27 富士フイルム株式会社 転写フィルム、積層体、及びパターン形成方法
WO2020184326A1 (ja) * 2019-03-14 2020-09-17 東レ株式会社 感光性樹脂組成物、感光性樹脂シート、硬化膜、硬化膜の製造方法、有機ｅｌ表示装置、および電子部品
WO2021149410A1 (ja) * 2020-01-21 2021-07-29 東レ株式会社 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置
WO2021199996A1 (ja) * 2020-03-30 2021-10-07 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び感光性転写材料用仮支持体
WO2021200357A1 (ja) * 2020-03-30 2021-10-07 東レ株式会社 樹脂組成物、遮光膜、および隔壁付き基板
WO2022130803A1 (ja) * 2020-12-15 2022-06-23 東レ株式会社 配線基板
JP2022112699A (ja) * 2021-01-22 2022-08-03 東レ株式会社 着色樹脂組成物、遮光膜、加飾基板及び加飾フィルム

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014197183A (ja) * 2013-03-06 2014-10-16 日東電工株式会社 画像表示装置
JP2015184958A (ja) * 2014-03-25 2015-10-22 富士フイルム株式会社 タッチパネルモジュールおよび電子機器
JP2017202631A (ja) * 2016-05-12 2017-11-16 東レ株式会社 転写フィルム、積層基材、カバーガラス、積層基材の製造方法
WO2020040054A1 (ja) * 2018-08-23 2020-02-27 富士フイルム株式会社 転写フィルム、積層体、及びパターン形成方法
WO2020184326A1 (ja) * 2019-03-14 2020-09-17 東レ株式会社 感光性樹脂組成物、感光性樹脂シート、硬化膜、硬化膜の製造方法、有機ｅｌ表示装置、および電子部品
WO2021149410A1 (ja) * 2020-01-21 2021-07-29 東レ株式会社 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置
WO2021199996A1 (ja) * 2020-03-30 2021-10-07 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び感光性転写材料用仮支持体
WO2021200357A1 (ja) * 2020-03-30 2021-10-07 東レ株式会社 樹脂組成物、遮光膜、および隔壁付き基板
WO2022130803A1 (ja) * 2020-12-15 2022-06-23 東レ株式会社 配線基板
JP2022112699A (ja) * 2021-01-22 2022-08-03 東レ株式会社 着色樹脂組成物、遮光膜、加飾基板及び加飾フィルム

Also Published As

Publication number Publication date
CN119895367A (zh) 2025-04-25
WO2024135082A1 (ja) 2024-06-27

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