JPWO2024127989A5 - - Google Patents

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Publication number
JPWO2024127989A5
JPWO2024127989A5 JP2024564263A JP2024564263A JPWO2024127989A5 JP WO2024127989 A5 JPWO2024127989 A5 JP WO2024127989A5 JP 2024564263 A JP2024564263 A JP 2024564263A JP 2024564263 A JP2024564263 A JP 2024564263A JP WO2024127989 A5 JPWO2024127989 A5 JP WO2024127989A5
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JP
Japan
Prior art keywords
conductor
columnar
axis
layer
columnar conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024564263A
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English (en)
Japanese (ja)
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JPWO2024127989A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/042681 external-priority patent/WO2024127989A1/ja
Publication of JPWO2024127989A1 publication Critical patent/JPWO2024127989A1/ja
Publication of JPWO2024127989A5 publication Critical patent/JPWO2024127989A5/ja
Pending legal-status Critical Current

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JP2024564263A 2022-12-14 2023-11-29 Pending JPWO2024127989A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022199648 2022-12-14
PCT/JP2023/042681 WO2024127989A1 (ja) 2022-12-14 2023-11-29 多層基板及び多層基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024127989A1 JPWO2024127989A1 (https=) 2024-06-20
JPWO2024127989A5 true JPWO2024127989A5 (https=) 2025-06-12

Family

ID=91485738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024564263A Pending JPWO2024127989A1 (https=) 2022-12-14 2023-11-29

Country Status (4)

Country Link
US (1) US20250240874A1 (https=)
JP (1) JPWO2024127989A1 (https=)
CN (1) CN223978799U (https=)
WO (1) WO2024127989A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196205A (ja) * 1998-12-28 2000-07-14 Fujitsu Ltd フレキシブルプリント基板
JP3969192B2 (ja) * 2002-05-30 2007-09-05 株式会社デンソー 多層配線基板の製造方法
CN106537684B (zh) * 2015-04-09 2019-11-01 株式会社村田制作所 复合传输线路以及电子设备

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