JPWO2024085000A1 - - Google Patents

Info

Publication number
JPWO2024085000A1
JPWO2024085000A1 JP2024551492A JP2024551492A JPWO2024085000A1 JP WO2024085000 A1 JPWO2024085000 A1 JP WO2024085000A1 JP 2024551492 A JP2024551492 A JP 2024551492A JP 2024551492 A JP2024551492 A JP 2024551492A JP WO2024085000 A1 JPWO2024085000 A1 JP WO2024085000A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024551492A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024085000A1 publication Critical patent/JPWO2024085000A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
JP2024551492A 2022-10-20 2023-10-06 Pending JPWO2024085000A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022168323 2022-10-20
PCT/JP2023/036501 WO2024085000A1 (ja) 2022-10-20 2023-10-06 流体供給システム、基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
JPWO2024085000A1 true JPWO2024085000A1 (https=) 2024-04-25

Family

ID=90737415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024551492A Pending JPWO2024085000A1 (https=) 2022-10-20 2023-10-06

Country Status (3)

Country Link
JP (1) JPWO2024085000A1 (https=)
TW (1) TW202427587A (https=)
WO (1) WO2024085000A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009038328A (ja) * 2007-08-06 2009-02-19 Ryusyo Industrial Co Ltd 超臨界流体洗浄装置
JP2011187570A (ja) * 2010-03-05 2011-09-22 Tokyo Electron Ltd 超臨界処理装置及び超臨界処理方法
WO2012165377A1 (ja) * 2011-05-30 2012-12-06 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP2017059642A (ja) * 2015-09-15 2017-03-23 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP2020025013A (ja) * 2018-08-07 2020-02-13 東京エレクトロン株式会社 基板処理装置のパーティクル除去方法および基板処理装置
JP2021503714A (ja) * 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧処理システムのためのコンデンサシステム
WO2022196384A1 (ja) * 2021-03-18 2022-09-22 東京エレクトロン株式会社 基板処理方法および基板処理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009038328A (ja) * 2007-08-06 2009-02-19 Ryusyo Industrial Co Ltd 超臨界流体洗浄装置
JP2011187570A (ja) * 2010-03-05 2011-09-22 Tokyo Electron Ltd 超臨界処理装置及び超臨界処理方法
WO2012165377A1 (ja) * 2011-05-30 2012-12-06 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP2017059642A (ja) * 2015-09-15 2017-03-23 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP2021503714A (ja) * 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧処理システムのためのコンデンサシステム
JP2020025013A (ja) * 2018-08-07 2020-02-13 東京エレクトロン株式会社 基板処理装置のパーティクル除去方法および基板処理装置
WO2022196384A1 (ja) * 2021-03-18 2022-09-22 東京エレクトロン株式会社 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
WO2024085000A1 (ja) 2024-04-25
TW202427587A (zh) 2024-07-01

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