JPWO2024071069A1 - - Google Patents
Info
- Publication number
- JPWO2024071069A1 JPWO2024071069A1 JP2024549390A JP2024549390A JPWO2024071069A1 JP WO2024071069 A1 JPWO2024071069 A1 JP WO2024071069A1 JP 2024549390 A JP2024549390 A JP 2024549390A JP 2024549390 A JP2024549390 A JP 2024549390A JP WO2024071069 A1 JPWO2024071069 A1 JP WO2024071069A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022155322 | 2022-09-28 | ||
| PCT/JP2023/034821 WO2024071069A1 (ja) | 2022-09-28 | 2023-09-26 | 配線基板およびそれを用いた実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024071069A1 true JPWO2024071069A1 (https=) | 2024-04-04 |
| JPWO2024071069A5 JPWO2024071069A5 (https=) | 2025-05-30 |
Family
ID=90477855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549390A Withdrawn JPWO2024071069A1 (https=) | 2022-09-28 | 2023-09-26 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4598286A1 (https=) |
| JP (1) | JPWO2024071069A1 (https=) |
| CN (1) | CN119856576A (https=) |
| WO (1) | WO2024071069A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025244106A1 (ja) * | 2024-05-24 | 2025-11-27 | 京セラ株式会社 | 配線基板および実装構造体 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3367886B2 (ja) * | 1998-01-20 | 2003-01-20 | 株式会社村田製作所 | 電子回路装置 |
| JP2005277023A (ja) * | 2004-03-24 | 2005-10-06 | Nec Corp | プリント回路基板、およびプリント配線基板とコネクタとの接着方法 |
| JP4138689B2 (ja) | 2004-03-30 | 2008-08-27 | 株式会社東芝 | インターフェイスモジュール付ｌｓｉパッケージ及びｌｓｉパッケージ |
| JP2009536362A (ja) | 2006-05-05 | 2009-10-08 | リフレックス フォトニックス インコーポレイテッド | 光学有効集積回路パッケージ |
| JP4589428B2 (ja) * | 2008-08-19 | 2010-12-01 | アルプス電気株式会社 | 半導体チップモジュール |
| JP5502139B2 (ja) * | 2012-05-16 | 2014-05-28 | 日本特殊陶業株式会社 | 配線基板 |
-
2023
- 2023-09-26 CN CN202380068057.2A patent/CN119856576A/zh not_active Withdrawn
- 2023-09-26 EP EP23872292.0A patent/EP4598286A1/en not_active Withdrawn
- 2023-09-26 JP JP2024549390A patent/JPWO2024071069A1/ja not_active Withdrawn
- 2023-09-26 WO PCT/JP2023/034821 patent/WO2024071069A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN119856576A (zh) | 2025-04-18 |
| EP4598286A1 (en) | 2025-08-06 |
| WO2024071069A1 (ja) | 2024-04-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250312 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250312 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20250521 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20260105 |