JPWO2024071069A1 - - Google Patents

Info

Publication number
JPWO2024071069A1
JPWO2024071069A1 JP2024549390A JP2024549390A JPWO2024071069A1 JP WO2024071069 A1 JPWO2024071069 A1 JP WO2024071069A1 JP 2024549390 A JP2024549390 A JP 2024549390A JP 2024549390 A JP2024549390 A JP 2024549390A JP WO2024071069 A1 JPWO2024071069 A1 JP WO2024071069A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024549390A
Other languages
Japanese (ja)
Other versions
JPWO2024071069A5 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024071069A1 publication Critical patent/JPWO2024071069A1/ja
Publication of JPWO2024071069A5 publication Critical patent/JPWO2024071069A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2024549390A 2022-09-28 2023-09-26 Pending JPWO2024071069A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022155322 2022-09-28
PCT/JP2023/034821 WO2024071069A1 (ja) 2022-09-28 2023-09-26 配線基板およびそれを用いた実装構造体

Publications (2)

Publication Number Publication Date
JPWO2024071069A1 true JPWO2024071069A1 (cg-RX-API-DMAC7.html) 2024-04-04
JPWO2024071069A5 JPWO2024071069A5 (cg-RX-API-DMAC7.html) 2025-05-30

Family

ID=90477855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549390A Pending JPWO2024071069A1 (cg-RX-API-DMAC7.html) 2022-09-28 2023-09-26

Country Status (4)

Country Link
EP (1) EP4598286A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024071069A1 (cg-RX-API-DMAC7.html)
CN (1) CN119856576A (cg-RX-API-DMAC7.html)
WO (1) WO2024071069A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025244106A1 (ja) * 2024-05-24 2025-11-27 京セラ株式会社 配線基板および実装構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367886B2 (ja) * 1998-01-20 2003-01-20 株式会社村田製作所 電子回路装置
JP2005277023A (ja) * 2004-03-24 2005-10-06 Nec Corp プリント回路基板、およびプリント配線基板とコネクタとの接着方法
JP4138689B2 (ja) 2004-03-30 2008-08-27 株式会社東芝 インターフェイスモジュール付ｌｓｉパッケージ及びｌｓｉパッケージ
JP2009536362A (ja) 2006-05-05 2009-10-08 リフレックス フォトニックス インコーポレイテッド 光学有効集積回路パッケージ
JP4589428B2 (ja) * 2008-08-19 2010-12-01 アルプス電気株式会社 半導体チップモジュール
JP5502139B2 (ja) * 2012-05-16 2014-05-28 日本特殊陶業株式会社 配線基板

Also Published As

Publication number Publication date
CN119856576A (zh) 2025-04-18
WO2024071069A1 (ja) 2024-04-04
EP4598286A1 (en) 2025-08-06

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