JPWO2024063112A5 - - Google Patents

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Publication number
JPWO2024063112A5
JPWO2024063112A5 JP2023560177A JP2023560177A JPWO2024063112A5 JP WO2024063112 A5 JPWO2024063112 A5 JP WO2024063112A5 JP 2023560177 A JP2023560177 A JP 2023560177A JP 2023560177 A JP2023560177 A JP 2023560177A JP WO2024063112 A5 JPWO2024063112 A5 JP WO2024063112A5
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JP
Japan
Prior art keywords
resin composition
composition according
meth
resin
temporary fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023560177A
Other languages
English (en)
Japanese (ja)
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JPWO2024063112A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/034182 external-priority patent/WO2024063112A1/ja
Publication of JPWO2024063112A1 publication Critical patent/JPWO2024063112A1/ja
Publication of JPWO2024063112A5 publication Critical patent/JPWO2024063112A5/ja
Pending legal-status Critical Current

Links

JP2023560177A 2022-09-21 2023-09-21 Pending JPWO2024063112A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022150426 2022-09-21
PCT/JP2023/034182 WO2024063112A1 (ja) 2022-09-21 2023-09-21 樹脂組成物、仮固定材、及び、電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024063112A1 JPWO2024063112A1 (https=) 2024-03-28
JPWO2024063112A5 true JPWO2024063112A5 (https=) 2025-05-28

Family

ID=90454617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023560177A Pending JPWO2024063112A1 (https=) 2022-09-21 2023-09-21

Country Status (5)

Country Link
JP (1) JPWO2024063112A1 (https=)
KR (1) KR20250071891A (https=)
CN (1) CN119156423A (https=)
TW (1) TW202428827A (https=)
WO (1) WO2024063112A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2601956B2 (ja) 1991-07-31 1997-04-23 リンテック株式会社 再剥離型粘着性ポリマー
PH12012502576A1 (en) * 2010-07-02 2022-03-30 Toray Industries Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film
KR102521872B1 (ko) * 2015-11-26 2023-04-14 가부시끼가이샤 레조낙 전자 부품의 제조방법, 가고정용 수지 조성물, 가고정용 수지 필름 및 가고정용 수지 필름 시트
JP6951132B2 (ja) * 2017-06-20 2021-10-20 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、その硬化物および電子部品
JP7719724B2 (ja) * 2020-05-08 2025-08-06 積水化学工業株式会社 粘着剤組成物、粘着テープ、及び、電子部品の処理方法
CN115702212B (zh) * 2020-09-23 2024-01-12 积水化学工业株式会社 固化性树脂组合物、临时固定材料、以及电子部件的制造方法

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