JPWO2024057850A5 - - Google Patents

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Publication number
JPWO2024057850A5
JPWO2024057850A5 JP2024546808A JP2024546808A JPWO2024057850A5 JP WO2024057850 A5 JPWO2024057850 A5 JP WO2024057850A5 JP 2024546808 A JP2024546808 A JP 2024546808A JP 2024546808 A JP2024546808 A JP 2024546808A JP WO2024057850 A5 JPWO2024057850 A5 JP WO2024057850A5
Authority
JP
Japan
Prior art keywords
semiconductor device
support
thickness direction
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024546808A
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English (en)
Japanese (ja)
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JPWO2024057850A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/030307 external-priority patent/WO2024057850A1/ja
Publication of JPWO2024057850A1 publication Critical patent/JPWO2024057850A1/ja
Publication of JPWO2024057850A5 publication Critical patent/JPWO2024057850A5/ja
Pending legal-status Critical Current

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JP2024546808A 2022-09-15 2023-08-23 Pending JPWO2024057850A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022147000 2022-09-15
PCT/JP2023/030307 WO2024057850A1 (ja) 2022-09-15 2023-08-23 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024057850A1 JPWO2024057850A1 (https=) 2024-03-21
JPWO2024057850A5 true JPWO2024057850A5 (https=) 2025-05-27

Family

ID=90274859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024546808A Pending JPWO2024057850A1 (https=) 2022-09-15 2023-08-23

Country Status (3)

Country Link
US (1) US20250210424A1 (https=)
JP (1) JPWO2024057850A1 (https=)
WO (1) WO2024057850A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025253837A1 (ja) * 2024-06-07 2025-12-11 富士電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016062917A (ja) * 2014-09-12 2016-04-25 トヨタ自動車株式会社 半導体装置
JP2016066659A (ja) * 2014-09-24 2016-04-28 トヨタ自動車株式会社 半導体装置
JP2020043305A (ja) * 2018-09-13 2020-03-19 トヨタ自動車株式会社 パワーカード
JP7215210B2 (ja) * 2019-02-20 2023-01-31 株式会社デンソー 半導体装置

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