JPWO2024038650A1 - - Google Patents

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Publication number
JPWO2024038650A1
JPWO2024038650A1 JP2024541422A JP2024541422A JPWO2024038650A1 JP WO2024038650 A1 JPWO2024038650 A1 JP WO2024038650A1 JP 2024541422 A JP2024541422 A JP 2024541422A JP 2024541422 A JP2024541422 A JP 2024541422A JP WO2024038650 A1 JPWO2024038650 A1 JP WO2024038650A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024541422A
Other languages
Japanese (ja)
Other versions
JPWO2024038650A5 (https=
JP7816535B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024038650A1 publication Critical patent/JPWO2024038650A1/ja
Publication of JPWO2024038650A5 publication Critical patent/JPWO2024038650A5/ja
Application granted granted Critical
Publication of JP7816535B2 publication Critical patent/JP7816535B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/252—Terminals the terminals being coated on the capacitive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2024541422A 2022-08-18 2023-05-24 積層セラミックコンデンサ Active JP7816535B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022130642 2022-08-18
JP2022130642 2022-08-18
PCT/JP2023/019394 WO2024038650A1 (ja) 2022-08-18 2023-05-24 積層セラミックコンデンサ

Publications (3)

Publication Number Publication Date
JPWO2024038650A1 true JPWO2024038650A1 (https=) 2024-02-22
JPWO2024038650A5 JPWO2024038650A5 (https=) 2025-03-07
JP7816535B2 JP7816535B2 (ja) 2026-02-18

Family

ID=89941700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024541422A Active JP7816535B2 (ja) 2022-08-18 2023-05-24 積層セラミックコンデンサ

Country Status (5)

Country Link
US (1) US20240355546A1 (https=)
JP (1) JP7816535B2 (https=)
KR (1) KR20250002709A (https=)
CN (1) CN119422214A (https=)
WO (1) WO2024038650A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012167A (ja) * 2003-05-27 2005-01-13 Murata Mfg Co Ltd 積層セラミック電子部品とその実装構造および実装方法
JP2014036149A (ja) * 2012-08-09 2014-02-24 Tdk Corp 電子部品
JP2014187058A (ja) * 2013-01-14 2014-10-02 Samsung Electro-Mechanics Co Ltd 積層セラミックキャパシタ、積層セラミックキャパシタの実装基板及び積層セラミックキャパシタの製造方法
JP2015053503A (ja) * 2012-10-26 2015-03-19 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層チップ電子部品及びその実装基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02155209A (ja) * 1988-12-07 1990-06-14 Nec Corp 表面実装用チップ部品
JP2000182888A (ja) 1998-12-16 2000-06-30 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
JP2013058558A (ja) * 2011-09-07 2013-03-28 Tdk Corp 電子部品
KR101422929B1 (ko) * 2012-11-07 2014-07-23 삼성전기주식회사 적층 세라믹 전자부품 및 그 실장 기판
JP6233397B2 (ja) * 2015-12-16 2017-11-22 Tdk株式会社 セラミック電子部品のはんだ実装構造
KR101823246B1 (ko) * 2016-06-21 2018-01-29 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
KR101883061B1 (ko) * 2016-09-08 2018-07-27 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
JP2021068853A (ja) * 2019-10-28 2021-04-30 株式会社村田製作所 支持端子付きコンデンサチップ
JP2023019368A (ja) * 2021-07-29 2023-02-09 株式会社村田製作所 積層セラミックコンデンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012167A (ja) * 2003-05-27 2005-01-13 Murata Mfg Co Ltd 積層セラミック電子部品とその実装構造および実装方法
JP2014036149A (ja) * 2012-08-09 2014-02-24 Tdk Corp 電子部品
JP2015053503A (ja) * 2012-10-26 2015-03-19 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層チップ電子部品及びその実装基板
JP2014187058A (ja) * 2013-01-14 2014-10-02 Samsung Electro-Mechanics Co Ltd 積層セラミックキャパシタ、積層セラミックキャパシタの実装基板及び積層セラミックキャパシタの製造方法

Also Published As

Publication number Publication date
JP7816535B2 (ja) 2026-02-18
KR20250002709A (ko) 2025-01-07
WO2024038650A1 (ja) 2024-02-22
CN119422214A (zh) 2025-02-11
US20240355546A1 (en) 2024-10-24

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