JPWO2024024442A1 - - Google Patents

Info

Publication number
JPWO2024024442A1
JPWO2024024442A1 JP2024536909A JP2024536909A JPWO2024024442A1 JP WO2024024442 A1 JPWO2024024442 A1 JP WO2024024442A1 JP 2024536909 A JP2024536909 A JP 2024536909A JP 2024536909 A JP2024536909 A JP 2024536909A JP WO2024024442 A1 JPWO2024024442 A1 JP WO2024024442A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024536909A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024024442A1 publication Critical patent/JPWO2024024442A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2024536909A 2022-07-25 2023-07-06 Pending JPWO2024024442A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022118243 2022-07-25
PCT/JP2023/025115 WO2024024442A1 (ja) 2022-07-25 2023-07-06 樹脂組成物

Publications (1)

Publication Number Publication Date
JPWO2024024442A1 true JPWO2024024442A1 (enrdf_load_stackoverflow) 2024-02-01

Family

ID=89706123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024536909A Pending JPWO2024024442A1 (enrdf_load_stackoverflow) 2022-07-25 2023-07-06

Country Status (4)

Country Link
JP (1) JPWO2024024442A1 (enrdf_load_stackoverflow)
CN (1) CN119278226A (enrdf_load_stackoverflow)
TW (1) TW202411342A (enrdf_load_stackoverflow)
WO (1) WO2024024442A1 (enrdf_load_stackoverflow)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079033A (ja) * 1983-10-07 1985-05-04 Sumitomo Bakelite Co Ltd 素子封止に好適なエポキシ樹脂組成物
JPH10510401A (ja) * 1994-12-09 1998-10-06 シーメンス アクチエンゲゼルシヤフト 表面波構成素子及びそのための減衰構造体の製法
JP2000351888A (ja) * 1999-06-14 2000-12-19 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2000351831A (ja) * 1999-06-11 2000-12-19 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2001081286A (ja) * 1999-09-13 2001-03-27 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2005213299A (ja) * 2004-01-27 2005-08-11 Matsushita Electric Works Ltd 半導体封止用樹脂組成物とそれを用いた半導体装置
WO2006129480A1 (ja) * 2005-05-31 2006-12-07 Adeka Corporation エポキシ樹脂硬化性組成物
JP2009535446A (ja) * 2006-04-25 2009-10-01 サイテク・テクノロジー・コーポレーシヨン 紫外線および摩耗に対する抵抗性をもった複合体の表面形成用フィルム
WO2019009093A1 (ja) * 2017-07-06 2019-01-10 株式会社日本触媒 エチレン化合物、紫外線吸収剤および樹脂組成物
JP2019031638A (ja) * 2017-08-09 2019-02-28 株式会社日本触媒 樹脂組成物
JP2020132699A (ja) * 2019-02-14 2020-08-31 株式会社日本触媒 樹脂組成物、インクおよび光学フィルター

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079033A (ja) * 1983-10-07 1985-05-04 Sumitomo Bakelite Co Ltd 素子封止に好適なエポキシ樹脂組成物
JPH10510401A (ja) * 1994-12-09 1998-10-06 シーメンス アクチエンゲゼルシヤフト 表面波構成素子及びそのための減衰構造体の製法
JP2000351831A (ja) * 1999-06-11 2000-12-19 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2000351888A (ja) * 1999-06-14 2000-12-19 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2001081286A (ja) * 1999-09-13 2001-03-27 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2005213299A (ja) * 2004-01-27 2005-08-11 Matsushita Electric Works Ltd 半導体封止用樹脂組成物とそれを用いた半導体装置
WO2006129480A1 (ja) * 2005-05-31 2006-12-07 Adeka Corporation エポキシ樹脂硬化性組成物
JP2009535446A (ja) * 2006-04-25 2009-10-01 サイテク・テクノロジー・コーポレーシヨン 紫外線および摩耗に対する抵抗性をもった複合体の表面形成用フィルム
WO2019009093A1 (ja) * 2017-07-06 2019-01-10 株式会社日本触媒 エチレン化合物、紫外線吸収剤および樹脂組成物
JP2019031638A (ja) * 2017-08-09 2019-02-28 株式会社日本触媒 樹脂組成物
JP2020132699A (ja) * 2019-02-14 2020-08-31 株式会社日本触媒 樹脂組成物、インクおよび光学フィルター

Also Published As

Publication number Publication date
WO2024024442A1 (ja) 2024-02-01
TW202411342A (zh) 2024-03-16
CN119278226A (zh) 2025-01-07

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