JPWO2024009470A1 - - Google Patents
Info
- Publication number
- JPWO2024009470A1 JPWO2024009470A1 JP2024531856A JP2024531856A JPWO2024009470A1 JP WO2024009470 A1 JPWO2024009470 A1 JP WO2024009470A1 JP 2024531856 A JP2024531856 A JP 2024531856A JP 2024531856 A JP2024531856 A JP 2024531856A JP WO2024009470 A1 JPWO2024009470 A1 JP WO2024009470A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0436—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/027014 WO2024009470A1 (ja) | 2022-07-07 | 2022-07-07 | 搬送装置、搬送方法、及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024009470A1 true JPWO2024009470A1 (https=) | 2024-01-11 |
| JPWO2024009470A5 JPWO2024009470A5 (https=) | 2025-03-17 |
Family
ID=89453101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024531856A Pending JPWO2024009470A1 (https=) | 2022-07-07 | 2022-07-07 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250379094A1 (https=) |
| JP (1) | JPWO2024009470A1 (https=) |
| CN (1) | CN119487627A (https=) |
| WO (1) | WO2024009470A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3528577B2 (ja) * | 1998-03-04 | 2004-05-17 | セイコーエプソン株式会社 | 半導体装置の製造方法及びアニール装置 |
| JP4845280B2 (ja) * | 2001-03-21 | 2011-12-28 | 株式会社半導体エネルギー研究所 | レーザアニール装置 |
| JP4610178B2 (ja) * | 2002-11-15 | 2011-01-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4426276B2 (ja) * | 2003-10-06 | 2010-03-03 | 住友重機械工業株式会社 | 搬送装置、塗布システム、及び検査システム |
| JP5078460B2 (ja) * | 2007-06-28 | 2012-11-21 | 住友重機械工業株式会社 | レーザ加工装置、及び、レーザ加工方法 |
| JP2009147240A (ja) * | 2007-12-18 | 2009-07-02 | Dainippon Printing Co Ltd | 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法 |
| JP5918518B2 (ja) * | 2011-11-30 | 2016-05-18 | 川崎重工業株式会社 | 搬送ワークのヨーイング補正機構とその補正方法 |
| JP6887234B2 (ja) * | 2016-09-21 | 2021-06-16 | 株式会社日本製鋼所 | レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法 |
| JP6917691B2 (ja) * | 2016-10-04 | 2021-08-11 | 株式会社日本製鋼所 | レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法 |
-
2022
- 2022-07-07 JP JP2024531856A patent/JPWO2024009470A1/ja active Pending
- 2022-07-07 CN CN202280097863.8A patent/CN119487627A/zh active Pending
- 2022-07-07 WO PCT/JP2022/027014 patent/WO2024009470A1/ja not_active Ceased
- 2022-07-07 US US18/878,266 patent/US20250379094A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250379094A1 (en) | 2025-12-11 |
| CN119487627A (zh) | 2025-02-18 |
| WO2024009470A1 (ja) | 2024-01-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241224 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250512 |